TECHNIQUES FOR THERMAL TREATMENT OF ELECTRONIC DEVICES

    公开(公告)号:US20210358783A1

    公开(公告)日:2021-11-18

    申请号:US17443450

    申请日:2021-07-26

    Applicant: Kateeva, Inc.

    Abstract: Apparatus and techniques are described herein for use in manufacturing electronic devices. such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

    Techniques for thermal treatment of electronic devices

    公开(公告)号:US11107712B2

    公开(公告)日:2021-08-31

    申请号:US16421834

    申请日:2019-07-03

    Applicant: Kateeva, Inc.

    Abstract: Apparatus and techniques are described herein for use in manufacturing electronic devices. Such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

    GAS ENCLOSURE ASSEMBLY AND SYSTEM
    64.
    发明申请

    公开(公告)号:US20210108811A1

    公开(公告)日:2021-04-15

    申请号:US17247591

    申请日:2020-12-17

    Applicant: Kateeva, Inc.

    Abstract: The present teachings relate to various embodiments of a hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of a hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

    Printing system assemblies and methods

    公开(公告)号:US10414181B2

    公开(公告)日:2019-09-17

    申请号:US15836617

    申请日:2017-12-08

    Applicant: Kateeva, Inc.

    Abstract: The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors.

    Low particle gas enclosure systems and methods

    公开(公告)号:US09969193B2

    公开(公告)日:2018-05-15

    申请号:US14275637

    申请日:2014-05-12

    Applicant: Kateeva, Inc.

    Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.

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