公开(公告)号：US20170193680A1

公开(公告)日：2017-07-06

申请号：US15396800

申请日：2017-01-02

Applicant: KLA-Tencor Corporation

Inventor： Jing Zhang ,  Grace Hsiu-Ling Chen ,  Kris Bhaskar ,  Keith Wells ,  Nan Bai ,  Ping Gu ,  Lisheng Gao

IPC: G06T11/60 ,  H01L21/67 ,  G01N21/95 ,  G06K9/62 ,  G06T7/00

CPC classification number: G01N21/9501 ,  G01N2201/12 ,  G06K9/4628 ,  G06K9/6273 ,  G06K9/6857 ,  G06K2209/19 ,  G06T3/4053

Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.

公开(公告)号：US20160290934A1

公开(公告)日：2016-10-06

申请号：US15088081

申请日：2016-03-31

Applicant: KLA-Tencor Corporation

Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

IPC: G01N21/95 ,  H01L21/66 ,  G06T7/00 ,  H01L21/67

CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为基于印刷在晶片上的设计的信息来生成渲染图像的一个或多个计算机子系统。 渲染图像是由光学检查子系统为印刷在晶片上的设计产生的图像的模拟。 计算机子系统还被配置为将渲染图像与由光学检查子系统产生的晶片的光学图像进行比较。 该设计使用标线印在晶片上。 此外，计算机子系统被配置为基于比较的结果来检测晶片上的缺陷。

公开(公告)号：US20160210526A1

公开(公告)日：2016-07-21

申请号：US13685808

申请日：2012-11-27

Applicant: KLA-TENCOR CORPORATION

Inventor： Hucheng Lee ,  Junqing Huang ,  Lisheng Gao

IPC: G06K9/40

Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.

Abstract translation: 本公开旨在为检查算法和差分滤波器提供用于处理来自检查系统的测试和参考图像的视觉反馈。 可以将用户界面配置为显示信息并接受用户命令。 通信地耦合到用户界面的计算系统可以被配置为接收由检查系统收集的至少一组测试和参考图像。 计算系统还可以被配置为经由用户界面提供测试和参考图像的至少一个视觉表示，以显示检查算法和/或差分滤波器的效果。

公开(公告)号：US09347891B2

公开(公告)日：2016-05-24

申请号：US14381315

申请日：2013-03-01

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Abstract translation: 在光学检查工具中，照明光圈在照明光瞳区域的多个孔径位置中的每一个处打开，一次一个地穿过照明瞳孔区域。 对于每个光圈打开位置，入射光束被引向照明光瞳区域，以便选择性地将照射光束的相应光束束以对应于一个或多个入射角的一组对应于样品的输出光束和输出光束 检测来自样品的响应于在相应的一个或多个入射角度的入射光束入射到样品上的相应射线束。 基于针对每个孔径位置检测的输出光束来确定每个光圈位置的缺陷检测特性。 基于针对每个孔位置确定的缺陷检测特性来确定最佳孔径配置。

公开(公告)号：US20160071256A1

公开(公告)日：2016-03-10

申请号：US14944130

申请日：2015-11-17

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Meng-Che Wu ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.

Abstract translation: 提供了使用缺陷特定信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括在晶片上形成的感兴趣图案，以及在感兴趣的图案附近或其中出现的已知DOI。 信息包括晶片上的目标图像。 该方法还包括在晶片或另一晶片上搜索目标候选。 目标候选人包括兴趣模式。 将目标候选位置和目标候选位置提供给缺陷检测。 此外，该方法包括通过识别目标候选图像中的潜在DOI位置并将一个或多个检测参数应用于潜在DOI位置的图像来检测目标候选中的已知DOI。

公开(公告)号：US09224660B2

公开(公告)日：2015-12-29

申请号：US14470916

申请日：2014-08-27

Applicant: KLA-Tencor Corporation

Inventor： Ashok V. Kulkarni ,  Lisheng Gao ,  Junqing Huang

IPC: G01N21/00 ,  H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L22/20

Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.

Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。

公开(公告)号：US20150221076A1

公开(公告)日：2015-08-06

申请号：US14612192

申请日：2015-02-02

Applicant: KLA-Tencor Corporation

Inventor： Lisheng Gao ,  Avijit K. Ray-Chaudhuri ,  Raghav Babulnath ,  Kenong Wu

IPC: G06T7/00 ,  G06T7/40 ,  G06K9/03 ,  G06K9/46 ,  G06K9/62

CPC classification number: G06T7/001 ,  G06T2207/10024 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.

Abstract translation: 提供了用于对在晶片上检测到的缺陷进行分类的系统和方法。 一种方法包括基于通过检查系统为晶片产生的输出来检测晶片上的缺陷。 该方法还包括基于对应于至少一个缺陷的标准参考图像的部分来确定至少一个缺陷的一个或多个属性。 该方法还包括至少部分地基于一个或多个确定的属性来对至少一个缺陷进行分类。

公开(公告)号：US20150178907A1

公开(公告)日：2015-06-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于如何将一个或多个设计剪辑出现在由晶片的晶片检查过程产生的输出中来改变一个或多个设计剪辑。 该方法还包括在晶片检查过程中将一个或多个改变的设计剪辑与晶片产生的输出对准。 此外，该方法包括基于与一个或多个改变的设计剪辑对准的输出来检测晶片上的缺陷。

公开(公告)号：US20140219544A1

公开(公告)日：2014-08-07

申请号：US14169161

申请日：2014-01-31

Applicant: KLA-TENCOR CORPORATION

Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

IPC: G06T7/00

CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。

公开(公告)号：US11244442B2

公开(公告)日：2022-02-08

申请号：US16508778

申请日：2019-07-11

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Lisheng Gao ,  Jan Lauber ,  Yong Zhang

IPC: G06T7/00 ,  G06T5/00 ,  H01J37/22 ,  H01J37/28

Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.