摘要:
A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between secondhand third portions of the third coil.
摘要:
A method of fabricating a semiconductor device employing electroless plating including wafer backside protection during wet processing is disclosed. The method includes the steps of laminating a wafer back side and a frame with a protective tape, applying a protective coating to a peripheral portion of the wafer and an adjoining exposed area of the protective tape, the protective coating, protective tape, and wafer forming a protected wafer assembly, curing the frame-supported protective coating, cutting the protected wafer assembly from the protective tape surrounding the protective coating, wet processing the protected wafer assembly, laminating the protected wafer assembly with a second tape, dicing the wafer, and picking up the die from the protective tape.
摘要:
A device (20) for manufacturing a carbon nanotube array (10) includes a reaction chamber (220), a gas introducing tube (228), and a quartz boat (240). The reaction chamber includes a first gas inlet (222), a second gas inlet (224), and a gas outlet (226). The first gas inlet is configured for introducing a reaction gas, and the second gas inlet is configured for introducing a disturbance gas. The quartz boat is disposed in the reaction chamber. The quartz boat is used to carry a substrate (12) from/upon which the carbon nanotube array grows. The gas introducing tube is connected to the second gas inlet and to the quartz boat. The gas introducing tube is used to transport the disturbance gas introduced from the second gas inlet to the quartz boat to disturb/interrupt nanotube growth.
摘要:
Methods are described for synthesizing stoichiometric LiBC and hole doped Li1-xBC (lithium borocarbide) according to heating processes, such as by both an arc-melting method and a sealed tantalum ampoule method. The arc-melting method requires forming a pellet of uniformly-mixed elemental lithium, boron, and graphite and subjecting it to an arc-melt process sufficient to trigger a self-propagating exothermic reaction. Alternatively, the titanium ampoule method requires sealing uniformly-mixed elemental lithium, boron, and graphite (Li—B—C) in a tantalum ampoule; and heating under sufficient temperature for a sufficient period of time. Hole-doped Li1-xBC (0≦x≦0.37) can then be produced, such as through vacuum de-intercalation from the LiBC. According to the present invention, the hexagonal crystal lattice remains largely intact, with only slight decreases in lattice parameters upon hole-doping. The samples are intrinsically diamagnetic and are semiconducting in the 2 K to 300 K range studied.
摘要:
An access point receives uplink transmissions from client stations using directional antenna beams. The directional antenna beams are generated by an antenna array. The different directional antenna beams are assigned beam identification numbers, and a preferred antenna beam is selected for each client station. The client stations in the different antenna beam regions initiate their uplink transmissions using assigned backoff slots within the contention window. The access point selects the preferred directional antenna beam corresponding to the directional antenna beams assigned to the backoff slots.
摘要:
The present invention discloses a pump-type autoclave system and a providing method for steam and pressure thereof, wherein the pump-type autoclave system comprises an autoclave, a steam providing device and a compressor, said steam providing device comprises a water storage container and a heating device used for heating said water storage container, said water storage container, the compressor and the autoclave are connected through a pipeline to form a closed loop, an inlet of the compressor is connected with a steam output port of the water storage container, an outlet of the compressor is connected to a steam input port of the autoclave, and a condensate water drain outlet of the autoclave is connected to the water storage container. The present invention uses the compressor to depressurize an intermediate-low temperature water source to obtain steam, and the steam is pumped into the autoclave and condensed to release heat to obtain corresponding temperature and pressure. Since the present invention fully utilizes a great amount of low-cost intermediate-low temperature heat sources obtained from natural, industrial or living waste heat to provide needed high temperature, steam and pressure to the autoclave system, the energy is saved.
摘要:
According to one embodiment of the invention, a method for secured execution of commands is described. Initially, a second electronic device authenticates a first electronic device and registers the first electronic device as a trusted device. Thereafter, up receipt of a message with one or more embedded commands, such commands are executed without any pre-established communication protocol if the message is from the registered first electronic device.
摘要:
A power device package for containing, protecting and providing electrical contacts for a power transistor includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.