摘要:
A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.
摘要:
Improved photoimaged nozzle members for a micro-fluid ejection head, micro-fluid ejection heads containing such nozzle members, and methods for making any of the same. One such nozzle member is provided by a photoresist nozzle layer applied adjacent a thick film layer on a substrate having fluid ejector actuators. The photoresist nozzle layer has a plurality of nozzles therein. The nozzles are formed in the nozzle layer from an exit surface of the nozzle layer to an entrance surface of the nozzle layer. The nozzles have a reentrant hole profile with a wall angle greater than about 40 up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle layer.
摘要:
An infusion system that includes a controller device and a communication system to transmit the communications from the controller device to an infusion device pump that controls delivery of fluids to the user's body. More particularly, these apparatuses and methods are for providing convenient monitoring and control of the infusion pump device in determining the appropriate amount of insulin to deliver.
摘要:
Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要:
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要:
The present invention provides a high throughput assay for human Rho kinase activity in vitro, and methods and kits therefor. A high throughput method of assaying a test compound for human Rho kinase modulating activity is also provided.
摘要:
An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.
摘要:
A method and mask to improve measurement of alignment marks is disclosed. An exemplary embodiment of the invention includes a resist mask with a patterned alignment mark comprising an assemblage of features whose spacing is smaller than the wavelength of light used to measure the alignment. In a preferred embodiment, an alignment mark patterning process alters the appearance of the alignment mark and renders an enhanced contrast with the substrate background.
摘要:
A method is presented for processing data in a multithreaded application to alleviate impaired or substandard performance conditions. Work items that are pending processing by the multithreaded application are placed into a data structure. The work items are processed by a plurality of threads within the multithreaded application in accordance with a first algorithm, e.g., first-in first-out (FIFO). A thread within the multithreaded application is configured apart from the plurality of threads such that it processes work items in accordance with a second algorithm that differs from the first algorithm, thereby avoiding the impairing condition. For example, the thread may process a pending work item only if it has a particular characteristic. The thread restricts its own processing of work items by intermittently evaluating workflow conditions for the plurality of threads; if the workflow conditions improve or are unimpaired, then the thread does not process any work items.
摘要:
An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.