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公开(公告)号:US20060145792A1
公开(公告)日:2006-07-06
申请号:US10905449
申请日:2005-01-05
申请人: Louis Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Wong , Chih-Chao Yang
发明人: Louis Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Wong , Chih-Chao Yang
IPC分类号: H01H51/22
CPC分类号: H01H59/0009 , H01H1/20 , H01H2001/0084 , H01H2001/0089 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208
摘要: A hinge type MEMS switch that is fully integratable within a semiconductor fabrication process, such as a CMOS, is described. The MEMS switch constructed on a substrate consists of two posts, each end thereof terminating in a cap; a movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; an upper and lower electrode pairs; and upper and lower interconnect wiring lines connected and disconnected by the movable conductive plate. When in the energized state, a low voltage level is applied to the upper electrode pair, while the lower electrode pair is grounded. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines. The MEMS switch thus formed generates an even force that provides the conductive plate with a translational movement, with the displacement being guided by the two vertical posts.
摘要翻译: 描述了在诸如CMOS之类的半导体制造工艺中可完全集成的铰链式MEMS开关。 构造在基板上的MEMS开关由两个柱构成,每个端部终止于盖; 可移动导电板,其表面终止于两个相对边缘中的每一个中的环中,所述环松动地连接到引导柱; 上下电极对; 以及由可动导电板连接和断开的上下互连布线。 当处于通电状态时,低电压电平施加到上电极对,而下电极对接地。 导电板向上移动,使两条上部互连线路短路。 相反,当电压施加到下电极对时,导电板向下移动,而上电极对接地,使两个下互连布线短路并打开上布线。 由此形成的MEMS开关产生均匀的力,其为导电板提供平移运动,位移由两个垂直柱引导。
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公开(公告)号:US20050127511A1
公开(公告)日:2005-06-16
申请号:US10735845
申请日:2003-12-16
申请人: Chih-Chao Yang , Louis Hsu , Keith Wong , Timothy Dalton , Carl Radens , Larry Clevenger
发明人: Chih-Chao Yang , Louis Hsu , Keith Wong , Timothy Dalton , Carl Radens , Larry Clevenger
IPC分类号: H01L21/768 , H01L23/48 , H01L23/52 , H01L23/522 , H01L23/532
CPC分类号: H01L21/76844 , H01L21/76802 , H01L21/76805 , H01L21/76807 , H01L21/76834 , H01L21/76849 , H01L21/76862 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要: A method of making a diffusion barrier for a interconnect structure. The method comprises: providing a conductive line in a bottom dielectric trench; depositing a sacrificial liner on the cap layer; depositing an interlayer dielectric; forming a trench and a via in the top interlayer dielectric; and removing a portion of the cap layer and the sacrificial layer proximate to the bottom surface of the via. The removed portions of the cap layer and sacrificial layer deposit predominantly along the lower sidewalls of the via. The conductive line is in contact with a cap layer, and the sacrificial layer is in contact with the cap layer. The invention is also directed to the interconnect structures resulting from the inventive process.
摘要翻译: 制造互连结构的扩散阻挡层的方法。 该方法包括:在底部电介质沟槽中提供导线; 在所述盖层上沉积牺牲衬垫; 沉积层间电介质; 在顶层间电介质中形成沟槽和通孔; 以及去除靠近通孔底表面的覆盖层和牺牲层的一部分。 盖层和牺牲层的去除部分主要沿着通孔的下侧壁沉积。 导线与盖层接触,牺牲层与盖层接触。 本发明还涉及由本发明方法产生的互连结构。
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63.
公开(公告)号:US07657995B2
公开(公告)日:2010-02-09
申请号:US11776835
申请日:2007-07-12
申请人: Louis Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
发明人: Louis Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
CPC分类号: H01H59/0009 , H01H1/20 , H01H2001/0084 , H01H2001/0089 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208
摘要: A method of fabricating a MEMS switch that is fully integratable in a semiconductor fabrication line. The method consists of forming two posts, each end thereof terminating in a cap; a rigid movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; forming upper and lower electrode pairs and upper and lower interconnect wiring lines connected and disconnected by the rigid movable conductive plate. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines.
摘要翻译: 一种制造可在半导体制造生产线中完全集成的MEMS开关的方法。 该方法包括形成两个柱,其每端终止于盖中; 刚性可移动导电板,其表面终止于两个相对边缘中的每一个中的环中,所述环松散地连接到引导柱; 形成上下电极对以及由刚性可移动导电板连接和断开的上下互连布线。 导电板向上移动,使两条上部互连线路短路。 相反,当电压施加到下电极对时,导电板向下移动,而上电极对接地,使两个下互连布线短路并打开上布线。
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公开(公告)号:US07348870B2
公开(公告)日:2008-03-25
申请号:US10905449
申请日:2005-01-05
申请人: Louis C. Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
发明人: Louis C. Hsu , Timothy Dalton , Lawrence Clevenger , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
IPC分类号: H01H51/22
CPC分类号: H01H59/0009 , H01H1/20 , H01H2001/0084 , H01H2001/0089 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208
摘要: A hinge type MEMS switch that is fully integratable within a semiconductor fabrication process, such as a CMOS, is described. The MEMS switch constructed on a substrate consists of two posts, each end thereof terminating in a cap; a movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; an upper and lower electrode pairs; and upper and lower interconnect wiring lines connected and disconnected by the movable conductive plate. When in the energized state, a low voltage level is applied to the upper electrode pair, while the lower electrode pair is grounded. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines. The MEMS switch thus formed generates an even force that provides the conductive plate with a translational movement, with the displacement being guided by the two vertical posts.
摘要翻译: 描述了在诸如CMOS之类的半导体制造工艺中可完全集成的铰链式MEMS开关。 构造在基板上的MEMS开关由两个柱构成,每个端部终止于盖; 可移动导电板,其表面终止于两个相对边缘中的每一个中的环中,所述环松动地连接到引导柱; 上下电极对; 以及由可动导电板连接和断开的上下互连布线。 当处于通电状态时,低电压电平施加到上电极对,而下电极对接地。 导电板向上移动,使两条上部互连线路短路。 相反,当电压施加到下电极对时,导电板向下移动,而上电极对接地,使两个下互连布线短路并打开上布线。 由此形成的MEMS开关产生均匀的力,其为导电板提供平移运动,位移由两个垂直柱引导。
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公开(公告)号:US20070046392A1
公开(公告)日:2007-03-01
申请号:US11217163
申请日:2005-09-01
申请人: Louis Hsu , Lowrence Clevenger , Timothy Dalton , Carl Radens , Keith Hon Wong , Chih-Chao Yang
发明人: Louis Hsu , Lowrence Clevenger , Timothy Dalton , Carl Radens , Keith Hon Wong , Chih-Chao Yang
IPC分类号: H01P1/10
CPC分类号: H01H50/005 , H01H2050/007 , Y10T29/4902 , Y10T29/49105 , Y10T29/49147
摘要: A MEM switch is described having a free moving element within in micro-cavity, and guided by at least one inductive element. The switch consists of an upper inductive coil; an optional lower inductive coil, each having a metallic core preferably made of permalloy; a micro-cavity; and a free-moving switching element preferably also made of magnetic material. Switching is achieved by passing a current through the upper coil, inducing a magnetic field in the coil element. The magnetic field attracts the free-moving magnetic element upwards, shorting two open wires and thus, closing the switch. When the current flow stops or is reversed, the free-moving magnetic element drops back by gravity to the bottom of the micro-cavity and the wires open. When the chip is not mounted with the correct orientation, gravity cannot be used. In such an instance, a lower coil becomes necessary to pull the free-moving switching element back and holding it at its original position.
摘要翻译: 描述了一种MEM开关,其具有在微腔内的自由移动元件,并由至少一个电感元件引导。 开关由上感应线圈组成; 可选的下感应线圈,每个具有优选由坡莫合金制成的金属芯; 微腔; 以及优选也由磁性材料制成的自由移动的开关元件。 通过使电流通过上部线圈来实现切换,从而在线圈元件中产生磁场。 磁场向上吸引自由移动的磁性元件,短路两根开放的电线,从而闭合开关。 当电流停止或反转时,自由移动的磁性元件通过重力返回到微腔的底部并且电线打开。 当芯片未正确安装时,重力不能使用。 在这种情况下,需要下部线圈将自由移动的开关元件拉回并将其保持在其原始位置。
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66.
公开(公告)号:US20070023806A1
公开(公告)日:2007-02-01
申请号:US11193660
申请日:2005-07-29
申请人: Michael Gaidis , Carl Radens , Lawrence Clevenger , Timothy Dalton , Louis Hsu , Keith Hon Wong , Chih-Chao Yang
发明人: Michael Gaidis , Carl Radens , Lawrence Clevenger , Timothy Dalton , Louis Hsu , Keith Hon Wong , Chih-Chao Yang
IPC分类号: H01L29/94
CPC分类号: B82Y10/00 , H01L27/222 , H01L43/12
摘要: A magnetic random access memory (MRAM) device includes a magnetic tunnel junction (MTJ) stack formed over a lower wiring level, a hardmask formed on the MTJ stack, and an upper wiring level formed over the hardmask. The upper wiring level includes a slot via bitline formed therein, the slot via bitline in contact with the hardmask and in contact with an etch stop layer partially surrounding sidewalls of the hardmask.
摘要翻译: 磁性随机存取存储器(MRAM)器件包括形成在下布线层上的磁隧道结(MTJ)堆叠,形成在MTJ堆叠上的硬掩模和形成在硬掩模上的上布线层。 上布线层包括经由位于其中的位线的槽,槽经由与硬掩模接触的位线并与部分地围绕硬掩模的侧壁的蚀刻停止层接触。
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67.
公开(公告)号:US20060109117A1
公开(公告)日:2006-05-25
申请号:US10904664
申请日:2004-11-22
申请人: Louis Hsu , Lawrence Clevenger , Carl Radens , Kwong Wong , Chih-Chao Yang , Timothy Dalton
发明人: Louis Hsu , Lawrence Clevenger , Carl Radens , Kwong Wong , Chih-Chao Yang , Timothy Dalton
IPC分类号: G08B13/14
CPC分类号: G06F21/554 , G06F21/81 , G06F21/86
摘要: A deactivation management unit for facilitating an intelligent multistage system deactivation process where the deactivation management unit is flexible, facilitates recovery, and renders reverse engineering nearly impossible after the system has been permanently deactivated.
摘要翻译: 一种停用管理单元,用于促进智能多级系统停用过程,其中停用管理单元是灵活的,便于恢复,并且在系统被永久停用之后几乎不可能实现逆向工程。
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公开(公告)号:US08215074B2
公开(公告)日:2012-07-10
申请号:US12026123
申请日:2008-02-05
IPC分类号: E04B2/00
CPC分类号: H01L21/0338 , B81B2203/0369 , B81C1/00031 , B81C2201/0149 , B81C2201/0198 , B82Y30/00 , H01L21/0337 , H01L51/0017 , Y10S977/882 , Y10S977/887 , Y10S977/888 , Y10T428/24479 , Y10T428/2457 , Y10T428/24612 , Y10T428/24736 , Y10T428/24802
摘要: In one embodiment, Hexagonal tiles encompassing a large are divided into three groups, each containing ⅓ of all hexagonal tiles that are disjoined among one another. Openings for the hexagonal tiles in each group are formed in a template layer, and a set of self-assembling block copolymers is applied and patterned within each opening. This process is repeated three times to encompass all three groups, resulting in a self-aligned pattern extending over a wide area. In another embodiment, the large area is divided into rectangular tiles of two non-overlapping and complementary groups. Each rectangular area has a width less than the range of order of self-assembling block copolymers. Self-assembled self-aligned line and space structures are formed in each group in a sequential manner so that a line and space pattern is formed over a large area extending beyond the range of order.
摘要翻译: 在一个实施例中,包括大的六边形瓦片被分成三组,每组包含彼此分离的所有六边形瓦片的1/3。 每个组中的六边形瓦片的开口形成在模板层中,并且在每个开口内施加并组合一组自组装嵌段共聚物。 该过程重复三次以包含所有三组,导致在大面积上延伸的自对准图案。 在另一个实施例中,大面积被分成两个不重叠和互补组的矩形瓦片。 每个矩形区域的宽度小于自组装嵌段共聚物的顺序范围。 在每组中以顺序的方式形成自组装的自对准线和空间结构,使得在超过有序范围的大面积上形成线和空间图案。
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公开(公告)号:US20120129357A1
公开(公告)日:2012-05-24
申请号:US12017598
申请日:2008-01-22
申请人: Timothy J. Dalton , Bruce B. Doris , Ho-Cheol Kim , Carl Radens
发明人: Timothy J. Dalton , Bruce B. Doris , Ho-Cheol Kim , Carl Radens
CPC分类号: H01L21/0337 , B81C1/00031 , B81C2201/0149 , B82Y10/00 , B82Y30/00 , H01L21/0338 , Y10T428/24612
摘要: A first nanoscale self-aligned self-assembled nested line structure having a sublithographic width and a sublithographic spacing and running along a first direction is formed from first self-assembling block copolymers within a first layer. The first layer is filled with a filler material and a second layer is deposited above the first layer containing the first nanoscale nested line structure. A second nanoscale self-aligned self-assembled nested line structure having a sublithographic width and a sublithographic spacing and running in a second direction is formed from second self-assembling block copolymers within the second layer. The composite pattern of the first nanoscale nested line structure and the second nanoscale nested line structure is transferred into an underlayer beneath the first layer to form an array of structures containing periodicity in two directions.
摘要翻译: 具有亚光刻宽度和亚光刻距离并沿着第一方向延伸的第一纳米级自对准自组装嵌套线结构由第一层内的第一自组装嵌段共聚物形成。 第一层填充有填充材料,并且第二层沉积在包含第一纳米级嵌套线结构的第一层之上。 具有亚光刻宽度和亚光刻距离并沿第二方向运行的第二纳米级自对准自组装嵌套线结构由第二层内的第二自组装嵌段共聚物形成。 第一纳米级嵌套线结构和第二纳米级嵌套线结构的复合图案被转移到第一层下面的底层中以形成在两个方向上包含周期性的结构阵列。
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公开(公告)号:US08207028B2
公开(公告)日:2012-06-26
申请号:US12017598
申请日:2008-01-22
申请人: Timothy J. Dalton , Bruce B. Doris , Ho-Cheol Kim , Carl Radens
发明人: Timothy J. Dalton , Bruce B. Doris , Ho-Cheol Kim , Carl Radens
IPC分类号: H01L21/336 , H01L21/8234
CPC分类号: H01L21/0337 , B81C1/00031 , B81C2201/0149 , B82Y10/00 , B82Y30/00 , H01L21/0338 , Y10T428/24612
摘要: A first nanoscale self-aligned self-assembled nested line structure having a sublithographic width and a sublithographic spacing and running along a first direction is formed from first self-assembling block copolymers within a first layer. The first layer is filled with a filler material and a second layer is deposited above the first layer containing the first nanoscale nested line structure. A second nanoscale self-aligned self-assembled nested line structure having a sublithographic width and a sublithographic spacing and running in a second direction is formed from second self-assembling block copolymers within the second layer. The composite pattern of the first nanoscale nested line structure and the second nanoscale nested line structure is transferred into an underlayer beneath the first layer to form an array of structures containing periodicity in two directions.
摘要翻译: 具有亚光刻宽度和亚光刻距离并沿着第一方向延伸的第一纳米级自对准自组装嵌套线结构由第一层内的第一自组装嵌段共聚物形成。 第一层填充有填充材料,并且第二层沉积在包含第一纳米级嵌套线结构的第一层之上。 具有亚光刻宽度和亚光刻距离并沿第二方向运行的第二纳米级自对准自组装嵌套线结构由第二层内的第二自组装嵌段共聚物形成。 第一纳米级嵌套线结构和第二纳米级嵌套线结构的复合图案被转移到第一层下面的底层中以形成在两个方向上包含周期性的结构阵列。
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