摘要:
A method for forming an integrated circuit system is provided including forming a semi-conducting layer over a substrate, forming a spacer stack having a gap filler adjacent to the semi-conducting layer and a inter-layer dielectric over the gap filler, forming a transition layer having a recess over the semi-conducting layer and adjacent to the spacer stack, and forming a metal layer in the recess.
摘要:
Disclosed are methods and devices for targeting CD of selected transistors in a semiconductor device. Varying CD is done by forming hard mask lines in a hard mask layer that have varying amounts of spacer material associated therewith. Hard mask lines corresponding to selected transistors are either left covered or uncovered by a resist applied over the hard mask layer. Then, spacer material is selectively removed from the hard mask lines to vary the width of hard mask lines and associated side wall spacers. A gate layer is then etched through the spaces in the hard mask lines to form gate lines having varying widths and targeted CD.
摘要:
A method and manufacture for charge storage layer separation is provided. A layer, such as a polymer layer, is deposited on top of an ONO layer so that the polymer layer is planarized, or approximately planarized. The ONO includes at least a first region and a second region, where the first region is higher than the second region. For example, the first region may be the portion of the ONO that is over the source/drain region, and the second region may be the portion of the ONO that is over the shallow trench. Etching is performed on the polymer layer to expose the first region of the ONO layer, leaving the second region of the ONO unexposed. The etching continues to occur to etch the exposed ONO at the first region so that the ONO layer is etched away in the first region and the second region remains unexposed.
摘要:
A method for forming an integrated circuit system is provided including forming a memory section having a spacer with a substrate, forming an outer doped region of the memory section in the substrate, forming a barrier metal layer over the spacer, and forming a metal plug over the outer doped region and the barrier metal layer.
摘要:
Disclosed are methods of making memory cells and semiconductor devices containing the memory cells. The methods involve oxidizing a portion of a copper containing electrode to form a copper oxide layer; contacting the copper oxide layer with at least one of a sulfur containing gas or plasma to form a CuS layer; forming an organic semiconductor over the CuS layer; and forming an electrode over the organic semiconductor. Such devices containing the memory cells are characterized by light weight and robust reliability.
摘要:
The disclosure describes an exemplary method of detecting a process end point during etching in the fabrication of an integrated circuit. This method can include receiving a reference signal indicative of an intensity of a light source, collecting a reflection signal reflected off a surface of an integrated circuit wafer, and comparing the reference signal and the reflection signal to locate absorption bands, the absorption band being indicative of a process end point.
摘要:
A method for forming high quality multiple thickness oxide layers having different thicknesses by eliminating descum induced defects. The method includes forming an oxide layer, masking the oxide layer with a photoresist layer, and developing the photoresist layer to expose at least one region of the oxide layer. The substrate is then heated and descummed to remove any residue resulting from developing the photoresist. Alternatively, the photoresist layer may be cured prior to heating and descumming the substrate. The oxide layer is then etched, and the remaining photoresist is stripped before another layer of oxide is grown on the substrate.
摘要:
A method for forming high quality oxide layers having different thicknesses by eliminating descum induced defects is disclosed. A semiconductor substrate is subjected to reactive ion etching. The semiconductor substrate includes a wafer, an oxide layer on the wafer, a developed photoresist mask on the oxide layer. The oxide layer is then etched, and the remaining photoresist is stripped before another layer of oxide is grown on the substrate.
摘要:
A method and system for providing a plurality of contacts in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and a plurality of field insulating regions adjacent to a portion of the plurality of gate stacks. The method and system include providing an etch stop layer covering the plurality of field insulating regions. The etch stop layer has an etch selectivity different from a field insulating region etch selectivity of the plurality of field insulating regions. The method and system also include providing an insulating layer covering the plurality of gate stacks, the plurality of field insulating regions and the etch stop layer. The method and system further include etching the insulating layer to provide a plurality of contact holes. The insulating layer etching step uses the etch stop layer to ensure that the insulating etching step does not etch through the plurality of field insulating regions. The method and system also include filling the plurality of contact holes with a conductor.
摘要:
The present invention relates generally to semiconductor memory devices and more particularly to multi-bit flash electrically erasable programmable read only memory (EEPROM) devices that employ charge trapping within a floating gate to indicate a 0 or 1 bit state. A memory device is provided, according to an aspect of the invention, comprising a floating gate transistor having dual polysilicon floating gates with an isolation opening between floating gates. Processes for making the memory device according to the invention are also disclosed.