公开(公告)号：US20120034456A1

公开(公告)日：2012-02-09

申请号：US13265169

申请日：2010-04-16

申请人： Takeshi Hasegawa ,  Takashi Shibuya ,  Hiroyuki Arai ,  Susumu Kurishima

发明人： Takeshi Hasegawa ,  Takashi Shibuya ,  Hiroyuki Arai ,  Susumu Kurishima

IPC分类号： C08K5/5415 ,  B32B9/00

CPC分类号： G03F7/00 ,  C08G77/02 ,  C08K5/057 ,  C09D183/02 ,  C09D183/04 ,  Y10T428/265 ,  C08L83/00

摘要： Provided are a mold release composition, with which it is possible to form a transparent coating on the surface of which a photoresist cannot readily stick, and a surface protective film having a coating constituted by a cured product thereof. The mold release composition can include a binder resin, silicone oil and a metal alkoxide hydrolyzate. A content of the metal alkoxide hydrolyzate can be 50 to 500 parts by weight with respect to 100 parts by weight of the binder resin. The metal alkoxide can consist of or include tetraethoxysilane or tetramethoxysilane. The surface protective film can be obtained by forming a coating of the cured product of the mold release composition on a substrate.

摘要翻译： 提供了一种脱模组合物，其可以在其表面上形成光致抗蚀剂不易于粘附的透明涂层，以及具有由其固化产物构成的涂层的表面保护膜。 脱模组合物可以包括粘合剂树脂，硅油和金属醇盐水解产物。 相对于100重量份的粘合剂树脂，金属醇盐水解物的含量可以为50〜500重量份。 金属醇盐可以由四乙氧基硅烷或四甲氧基硅烷组成或包括四乙氧基硅烷。 表面保护膜可以通过在基材上形成脱模剂组合物的固化物的涂层来获得。

公开(公告)号：US08094308B2

公开(公告)日：2012-01-10

申请号：US12310865

申请日：2007-12-21

申请人： Takeshi Hasegawa

发明人： Takeshi Hasegawa

IPC分类号： G01J4/00

CPC分类号： G01N21/21 ,  G01J3/447 ,  G01N21/31 ,  G01N21/8422

摘要： A spectrometric analyzing device is capable of analyzing a thin film with high accuracy by using light having an arbitrary wavelength, such as not only infrared light but also visible light, ultraviolet light and X-ray, and using whatever refractive index of a supporting member of the thin film. A spectrometric analyzing device comprises a light source (1), a polarizing filter (2), a detection unit (3), a regression operation unit (4) and an absorbance spectrum calculation unit (5). The light source (1) emits light at n different angles of incidence (θn) to a measurement portion. The polarizing filter (2) shields an s-polarized component. The detection unit (3) detects transmitted spectra (S). The regression operation unit (4) uses the transmitted spectra (S) and a mixing ratio (R) to obtain an in-plane mode spectrum (sip) and an out-of-plane mode spectrum (sop) through a regression analysis. The absorbance spectrum calculation unit (5) calculates an in-plane mode absorbance spectrum (Aip) and an out-of-plane mode absorbance spectrum (Aop) of the thin film, based on the results from a state in which the thin film is on the supporting member and a state in which no thin film is on the supporting member.

摘要翻译： 光谱分析装置能够通过使用具有任意波长的光，例如不仅具有红外光，还包括可见光，紫外光和X射线，并且使用任何波长的光的任何折射率，能够高精度地分析薄膜 薄膜。 光谱分析装置包括光源（1），偏振滤光器（2），检测单元（3），回归运算单元（4）和吸收光谱计算单元（5）。 光源（1）以不同的入射角（＆amp; n; n）发射光到测量部分。 偏振滤光器（2）屏蔽s偏振分量。 检测单元（3）检测发送光谱（S）。 回归运算单元（4）使用透射光谱（S）和混合比（R），通过回归分析获得平面内模式谱（sip）和平面外模式谱（sop）。 吸光度光谱计算单元（5）根据薄膜为（1）的状态的结果，计算出薄膜的面内模式吸收光谱（Aip）和平面外模式吸收光谱（Aop） 在支撑构件上并且在支撑构件上没有薄膜的状态。

公开(公告)号：US08026182B2

公开(公告)日：2011-09-27

申请号：US12339118

申请日：2008-12-19

申请人： Yoshinobu Nakada ,  Hiroyuki Shiraki ,  Takeshi Hasegawa

发明人： Yoshinobu Nakada ,  Hiroyuki Shiraki ,  Takeshi Hasegawa

IPC分类号： H01L21/302

CPC分类号： F27D5/0037 ,  F27B17/0025 ,  H01L21/324 ,  H01L21/67109 ,  Y10T279/23

摘要： In this heat treatment jig and method for silicon wafers, a silicon wafer is heat-treated while being mounted on support projections provided on three support arms, having an intervening spacing, protruding from a support frame towards the center. At that time, all the support projections under the silicon wafer are positioned on a same circle within a region where a radial distance from the center is defined by 85 to 99.5% of the wafer radius, and the support arms form an angle of 120° with each other about the center. With this jig and method, free depth of a dislocation generated from a pin position can be controlled deeper than a device formation region, and a widest slip-free region where the surface is free from slip dislocation is obtained.

摘要翻译： 在这种用于硅晶片的热处理夹具和方法中，将硅晶片安装在设置在三个支撑臂上的支撑突起上进行热处理，其具有从支撑框架向中心突出的中间间隔。 此时，硅晶片下面的所有支撑突起都位于与中心的径向距离限定晶片半径的85至99.5％的区域内的相同的圆上，并且支撑臂形成120°的角度 彼此围绕中心。 利用这种夹具和方法，可以将从销位置产生的位错的自由深度控制得比装置形成区域更深，并且获得表面没有滑移位错的最宽的无滑动区域。

公开(公告)号：US20100294544A1

公开(公告)日：2010-11-25

申请号：US11989679

申请日：2006-07-28

申请人： Atsushi Momota ,  Ichiro Terunuma ,  Takeshi Hasegawa ,  Yasuo Takemura ,  Yoshifumi Hatakeyama ,  Hiroshi Harada ,  Makoto Katoh

发明人： Atsushi Momota ,  Ichiro Terunuma ,  Takeshi Hasegawa ,  Yasuo Takemura ,  Yoshifumi Hatakeyama ,  Hiroshi Harada ,  Makoto Katoh

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/4691 ,  H05K1/036 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/10303 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.

摘要翻译： 本发明提供一种能够容易地实现电气部件的安装的弯曲型刚性印刷电路板（能够实现具有高生产率和组装性能的电镀电路），可以实现节省空间，并且可以实现容易的制造。 弯曲型刚性印刷线路板包括具有插入其中的空间部分（1A）的硬固化材料（1）。 在该硬质材料（1）的表面上叠层耐热树脂层（31），同时在该空间部（1A）的上表面上层叠耐热树脂层。 除了空间部分（1A）之外，在芯材（1）的背面上堆叠耐热树脂层（32）。 此外，导体层（4）通过耐热树脂层（31,32）堆叠并固定。 导体层（4）已被蚀刻以形成电路。

公开(公告)号：US20090270171A1

公开(公告)日：2009-10-29

申请号：US12093807

申请日：2006-11-07

申请人： Katsunori Onuki ,  Ken Goto ,  Shin Tsuchiya ,  Toshikazu Munemasa ,  Takeshi Hasegawa

发明人： Katsunori Onuki ,  Ken Goto ,  Shin Tsuchiya ,  Toshikazu Munemasa ,  Takeshi Hasegawa

IPC分类号： A63F9/24

CPC分类号： A63F13/358 ,  A63F13/12 ,  A63F13/31 ,  A63F13/79 ,  A63F2300/531 ,  A63F2300/534

摘要： Provided is a network game system for providing a game played by players of game machines by operating at least one of the game machines as a server, in which: the game machine to be operated as a server can be appropriately selected; a measuring unit (22) of each of the game machines (12) measures a time required to exchange predetermined data between the game machine (12) and another game machine (12) of the game machines (12); and a server determining unit (28) determines at least one of the game machines (12) as the game machine (12) to be operated as the server according to the results of the measurement by the measuring units (22) of the game machines (12).

摘要翻译： 提供了一种网络游戏系统，用于通过将至少一个游戏机作为服务器来提供游戏机的玩家玩的游戏，其中可以适当地选择要作为服务器操作的游戏机; 每个游戏机（12）的测量单元（22）测量在游戏机（12）和游戏机（12）的另一游戏机（12）之间交换预定数据所需的时间; 并且服务器确定单元（28）根据游戏机的测量单元（22）根据测量结果将游戏机（12）中的至少一个确定为要作为服务器操作的游戏机（12） （12）。

公开(公告)号：US07481888B2

公开(公告)日：2009-01-27

申请号：US10551695

申请日：2004-03-30

申请人： Yoshinobu Nakada ,  Hiroyuki Shiraki ,  Takeshi Hasegawa

发明人： Yoshinobu Nakada ,  Hiroyuki Shiraki ,  Takeshi Hasegawa

IPC分类号： C23C16/00

CPC分类号： F27D5/0037 ,  F27B17/0025 ,  H01L21/324 ,  H01L21/67109 ,  Y10T279/23

摘要： In this heat treatment jig and method for silicon wafers, a silicon wafer is heat-treated while being mounted on support projections provided on three support arms, having an intervening spacing, protruding from a support frame towards the center. At that time, all the support projections under the silicon wafer are positioned on a same circle within a region where a radial distance from the center is defined by 85 to 99.5% of the wafer radius, and the support arms form an angle of 120° with each other about the center. With this jig and method, free depth of a dislocation generated from a pin position can be controlled deeper than a device formation region, and a widest slip-free region where the surface is free from slip dislocation is obtained.

摘要翻译： 在这种用于硅晶片的热处理夹具和方法中，将硅晶片安装在设置在三个支撑臂上的支撑突起上进行热处理，其具有从支撑框架向中心突出的中间间隔。 此时，硅晶片下面的所有支撑突起都位于与中心的径向距离限定晶片半径的85至99.5％的区域内的相同的圆上，并且支撑臂形成120°的角度 彼此围绕中心。 利用这种夹具和方法，可以将从销位置产生的位错的自由深度控制得比装置形成区域更深，并且获得表面没有滑移位错的最宽的无滑动区域。

公开(公告)号：US07449138B2

公开(公告)日：2008-11-11

申请号：US11304772

申请日：2005-12-16

申请人： Naritoshi Shimada ,  Mitsuru Kunii ,  Koichi Hatano ,  Yasunori Miyamoto ,  Manabu Shibata ,  Takeshi Hasegawa

发明人： Naritoshi Shimada ,  Mitsuru Kunii ,  Koichi Hatano ,  Yasunori Miyamoto ,  Manabu Shibata ,  Takeshi Hasegawa

IPC分类号： B29C45/00 ,  C11D13/16 ,  A61K7/00

CPC分类号： C11D13/16 ,  C11D17/02

摘要： In a method of producing aerated soap (5) comprising solidifying molten soap (4) having a large number of bubbles dispersed therein in a cavity (11) of a mold (1), the cavity (11) having a prescribed shape, 1.05 or more time as much molten soap (4) as the volume of the aerated soap (5) is fed to the cavity (11) and solidified in a compressed state.

摘要翻译： 在制造充气皂（5）的方法中，包括将其中分散有大量气泡的熔融皂（4）固化在模具（1）的空腔（11）中，具有规定形状的空腔（11）为1.05或 随着充气肥皂（5）的体积被供给到空腔（11）并且以压缩状态固化，更多的时间将熔融肥皂（4）加入。

公开(公告)号：US07399781B2

公开(公告)日：2008-07-15

申请号：US11329505

申请日：2006-01-10

申请人： Shoji Satoh ,  Akira Tatsui ,  Takeshi Hasegawa ,  Hideki Yamada ,  Shin-ichi Kazayama ,  Takahiro Morita ,  Hidekazu Masaki ,  Atsuo Takahashi ,  Fumiya Yoneyama ,  Tetsuo Kuze ,  Yusuke Mizuno ,  Mizuo Miyazaki ,  Shinji Takai

发明人： Shoji Satoh ,  Akira Tatsui ,  Takeshi Hasegawa ,  Hideki Yamada ,  Shin-ichi Kazayama ,  Takahiro Morita ,  Hidekazu Masaki ,  Atsuo Takahashi ,  Fumiya Yoneyama ,  Tetsuo Kuze ,  Yusuke Mizuno ,  Mizuo Miyazaki ,  Shinji Takai

IPC分类号： A61K31/381 ,  C07D333/62

CPC分类号： C07D333/62 ,  C07D409/12 ,  C07D413/12 ,  C07D417/12

摘要： The present invention relates to an N-substituted benzothiophenesulfonamide derivative or a pharmaceutically acceptable salt thereof and applications thereof. Furthermore, it provides an agent for preventing or treating cardiac or circulatory disease and so on caused by abnormal increase of production of angiotensin II or endothelin I based on chymase activity, or by activation of mast cell, and an agent for preventing adhesion after surgery, wherein the agent has a selective inhibitory action on chymase.

摘要翻译： 本发明涉及N-取代苯并噻吩磺酰胺衍生物或其药学上可接受的盐及其应用。 此外，它提供了一种用于预防或治疗由基于糜酶活性或通过活化肥大细胞的血管紧张素II或内皮素I的产生异常增加引起的心脏或血液循环疾病等的药剂和用于预防手术后粘连的药剂， 其中所述药剂对胃促胰酶具有选择性抑制作用。

公开(公告)号：US07368579B2

公开(公告)日：2008-05-06

申请号：US10523008

申请日：2003-10-14

申请人： Fumitaka Goto ,  Noriaki Takemura ,  Tadaaki Otani ,  Takeshi Hasegawa ,  Hidetsugu Tsubouchi ,  Naoto Utsumi ,  Shigekazu Fujita ,  Hideaki Kuroda ,  Takuya Shitsuta ,  Hirofumi Sasaki

发明人： Fumitaka Goto ,  Noriaki Takemura ,  Tadaaki Otani ,  Takeshi Hasegawa ,  Hidetsugu Tsubouchi ,  Naoto Utsumi ,  Shigekazu Fujita ,  Hideaki Kuroda ,  Takuya Shitsuta ,  Hirofumi Sasaki

IPC分类号： C07D407/06

CPC分类号： C07D233/92

摘要： The present invention relates to a 1-substituted-4-nitroimidazole compound represented by the general formula (1) or a salt thereof, (wherein R is a hydrogen atom, a lower alkoxy group-substituted lower alkyl group, a phenyl-lower alkoxy group-substituted lower alkyl group, a cyano-substituted lower alkyl group, a phenyl-lower alkyl group which may have lower alkoxy groups as the substituents in the phenyl ring or a group of the formula —CH2RA; X is a halogen atom or a group of the formula —S(O)n—R1) and method for preparing the same. The compound of the formula (1) is a useful compound as an intermediate for synthesis of various pharmaceutical and agricultural chemicals, particularly, as intermediates for antitubercular agents.

摘要翻译： 本发明涉及由通式（1）表示的1-取代-4-硝基咪唑化合物或其盐（其中R是氢原子，低级烷氧基取代的低级烷基，苯基 - 低级烷氧基 取代基的低级烷基，氰基取代的低级烷基，可以具有低级烷氧基作为苯环中的取代基的苯基 - 低级烷基或式-CH 2的基团， X是卤素原子或式-S（O）n R 1）的基团）及其制备方法。 式（1）的化合物是用作合成各种药用和农药的中间体的有用化合物，特别是作为抗结核剂的中间体。

公开(公告)号：US07326379B2

公开(公告)日：2008-02-05

申请号：US10391628

申请日：2003-03-20

申请人： Takeshi Hasegawa ,  Koichi Hatano ,  Yasunori Miyamoto ,  Tadao Abe ,  Manabu Shibata

发明人： Takeshi Hasegawa ,  Koichi Hatano ,  Yasunori Miyamoto ,  Tadao Abe ,  Manabu Shibata

IPC分类号： B29C45/00 ,  C11D13/16

CPC分类号： C11D13/16

摘要： An apparatus for producing a soap cake comprising a mold which has a cavity of prescribed shape, a feed passage for feeding molten soap to the cavity, and means for pushing molten soap remaining in the feed passage at the time of feeding molten soap to the cavity to remove molten soap remaining in the feed passage. One end of the feed passage is a gate, in which a gate pin for shutting the connection between a feed port and the cavity is slidably provided. As the gate pin advances, molten soap remaining in the feed passage is removed in the step of feeding molten soap to the cavity.

摘要翻译： 一种用于生产皂饼的装置，包括具有规定形状的空腔的模具，用于将熔融皂送入空腔的进料通道，以及在将熔融皂送入空腔时将残留在进料通道中的熔融肥料推入的装置 以除去残留在进料通道中的熔融肥皂。 供给通道的一端是闸门，其中可滑动地设置用于关闭进料口和空腔之间的连接的闸销。 当浇口销前进时，在将熔融皂送入空腔的步骤中，残留在进料通道中的熔融肥皂被去除。