AQUEOUS BRAZE PASTE
    61.
    发明申请
    AQUEOUS BRAZE PASTE 审中-公开

    公开(公告)号:US20160244374A1

    公开(公告)日:2016-08-25

    申请号:US15051203

    申请日:2016-02-23

    CPC classification number: C04B37/008 C04B37/006 C04B2237/128 C04B2237/385

    Abstract: In some examples, a method including positioning a first ceramic or ceramic matrix composite (CMC) part and a second ceramic or CMC part adjacent to each other to define a joint between adjacent portions of the first ceramic or CMC part and the second ceramic or CMC part; and depositing an aqueous braze paste at least one of in the joint or adjacent the joint, wherein the aqueous braze paste comprises water, a water-soluble polymeric binder, and a silicon-based powder alloy.

    Abstract translation: 在一些实例中,包括将第一陶瓷或陶瓷基复合材料(CMC)部分和邻近的第二陶瓷或CMC部件定位以限定第一陶瓷或CMC部分的相邻部分与第二陶瓷或CMC之间的接合的方法 部分; 并且在所述接头中或邻近所述接头中的至少一个中沉积水性钎焊糊料,其中所述水性钎焊膏包含水,水溶性聚合物粘合剂和硅基粉末合金。

    MULTILAYER BRAZE TAPE
    62.
    发明申请
    MULTILAYER BRAZE TAPE 审中-公开
    多层布带

    公开(公告)号:US20160207129A1

    公开(公告)日:2016-07-21

    申请号:US15002182

    申请日:2016-01-20

    Abstract: A method may include positioning a multilayer braze tape at a joint between a first part comprising a ceramic or CMC and a second part comprising at least one of a ceramic, a CMC, a metal, or an alloy. The multilayer braze tape may include at least one layer comprising a silicon-containing braze material and at least one layer comprising a reinforcement material. The method also may include applying pressure to compress the multilayer braze tape between the first part and the second part, and heating the multilayer braze tape to melt the silicon-containing braze material and join the first part and the second part.

    Abstract translation: 一种方法可以包括将多层钎焊带定位在包括陶瓷或CMC的第一部分和包括陶瓷,CMC,金属或合金中的至少一种的第二部分之间的接合处。 多层钎焊带可以包括至少一层包含含硅钎焊材料和至少一层包含增强材料的层。 该方法还可以包括施加压力以压缩第一部分和第二部分之间的多层钎焊带,并且加热多层钎焊带以熔化含硅钎焊材料并将第一部分和第二部分接合。

    Techniques for forming composite sandwich structures

    公开(公告)号:US12233471B2

    公开(公告)日:2025-02-25

    申请号:US17537803

    申请日:2021-11-30

    Abstract: In some examples, a technique including positioning supports such that the supports are between a first metallic substrate and a second metallic substrate, wherein an undulating member is located between the first metallic substrate and the second metallic substrate, the undulating member defining a plurality of first peaks adjacent to a first surface of the first metallic substrate and a plurality of second peaks adjacent to a second surface of the second metallic substrate, wherein a first support of the supports is positioned such that the first support extends between a first peak of the plurality of first peaks and the second surface of the second metallic substrate; welding the first peak to the first surface of the first metallic substrate in an area of the first support; and removing the first support by at least one of a thermal removal process or a chemical removal process.

    TECHNIQUES FOR FORMING COMPOSITE SANDWICH STRUCTURES

    公开(公告)号:US20220193810A1

    公开(公告)日:2022-06-23

    申请号:US17537803

    申请日:2021-11-30

    Abstract: In some examples, a technique including positioning supports such that the supports are between a first metallic substrate and a second metallic substrate, wherein an undulating member is located between the first metallic substrate and the second metallic substrate, the undulating member defining a plurality of first peaks adjacent to a first surface of the first metallic substrate and a plurality of second peaks adjacent to a second surface of the second metallic substrate, wherein a first support of the supports is positioned such that the first support extends between a first peak of the plurality of first peaks and the second surface of the second metallic substrate; welding the first peak to the first surface of the first metallic substrate in an area of the first support; and removing the first support by at least one of a thermal removal process or a chemical removal process.

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