DETECTION AND REMEDIATION OF HEAD CONTAMINATION
    61.
    发明申请
    DETECTION AND REMEDIATION OF HEAD CONTAMINATION 有权
    头部污染的检测和补救

    公开(公告)号:US20150085632A1

    公开(公告)日:2015-03-26

    申请号:US14037139

    申请日:2013-09-25

    CPC classification number: G11B5/41 G11B5/40 G11B5/455 G11B5/607

    Abstract: A heat generating component of a slider is energized at a predetermined frequency. The heat generating component changes a spacing between a medium and the slider. A temperature response proximate a media-facing surface of the slider is measured while the heating element is energized. Based on the measured temperature response, a determination is made as to whether the media-facing surface is contaminated. In response to determining that the media-facing surface is contaminated, remedial action is taken.

    Abstract translation: 滑块的发热部件以预定的频率被激励。 发热组件改变介质和滑块之间的间距。 在加热元件通电时测量靠近滑块的面向媒体的表面的温度响应。 基于测量的温度响应,确定面向介质的表面是否被污染。 响应确定面向媒体的表面受到污染,采取补救措施。

    Cross-point resistive-based memory architecture
    62.
    发明授权
    Cross-point resistive-based memory architecture 有权
    交叉点电阻式存储架构

    公开(公告)号:US08949567B2

    公开(公告)日:2015-02-03

    申请号:US13777137

    申请日:2013-02-26

    CPC classification number: G06F12/00 G06F12/0238

    Abstract: A plurality of addressable memory tiles each comprise one or more cross-point arrays. Each array comprises a plurality of non-volatile resistance-change memory cells. A controller is configured to couple to the array and to a host system. The controller is configured to perform receiving, from the host system, one or more data objects each having a size equal to a predetermined logical block size, and storing the one or more data objects in a corresponding integer number of one or more of the memory tiles.

    Abstract translation: 多个可寻址存储器块各自包括一个或多个交叉点阵列。 每个阵列包括多个非易失性电阻变化存储单元。 控制器被配置为耦合到阵列和主机系统。 控制器被配置为执行从主机系统接收每个具有等于预定逻辑块大小的大小的一个或多个数据对象,并且将一个或多个数据对象存储在相应整数个存储器中的一个或多个存储器中 瓷砖。

    MEMORY TUNNELING INTERFACE
    65.
    发明公开

    公开(公告)号:US20230305972A1

    公开(公告)日:2023-09-28

    申请号:US17704553

    申请日:2022-03-25

    CPC classification number: G06F13/1668 G06F13/1663 G06F9/4498 G06F9/30101

    Abstract: An apparatus may include a memory device, a memory controller, or both that can communicate via memory standard interfaces. However, the memory device may have physical memory that does not comply with the memory standard by itself. Disclosed herein are solutions that allow various non-standard types of memory, or emerging memory, to be utilized via a host, microprocessor, or memory controller that implements the interface standard. For example, by utilizing a command converter at the microprocessor and a tunneling register at the memory device, a microprocessor can send commands to the memory device by writing them to the tunneling register, which can then be processed at the memory device for operations to be performed with the non-standard or emerging memory.

    INTELLIGENT MANAGEMENT OF FERROELECTRIC MEMORY IN A DATA STORAGE DEVICE

    公开(公告)号:US20220350739A1

    公开(公告)日:2022-11-03

    申请号:US17730920

    申请日:2022-04-27

    Abstract: Method and apparatus for managing a front-end cache formed of ferroelectric memory element (FME) cells. Prior to storage of writeback data associated with a pending write command from a client device, an intelligent cache manager circuit forwards a first status value indicative that sufficient capacity is available in the front-end cache for the writeback data. Non-requested speculative readback data previously transferred to the front-end cache from the main NVM memory store may be jettisoned to accommodate the writeback data. A second status value may be supplied to the client device if insufficient capacity is available to store the writeback data in the front-end cache, and a different, non-FME based cache may be used in such case. Mode select inputs can be supplied by the client device specify a particular quality of service level for the front-end cache, enabling selection of suitable writeback and speculative readback data processing strategies.

    THREE-DIMENSIONAL FERROELECTRIC MEMORY

    公开(公告)号:US20210272983A1

    公开(公告)日:2021-09-02

    申请号:US17084940

    申请日:2020-10-30

    Abstract: A memory device has ferroelectric memory cells arranged into a three-dimensional (3D) structure. Each ferroelectric memory cell has a ferroelectric layer adapted to provide non-volatile storage of data. In some cases, each ferroelectric memory cell is arranged as a ferroelectric field effect transistor (FeFET) comprising a source region, a drain region, and a control gate region, the control gate region comprising the ferroelectric layer. In other cases, each ferroelectric memory cell is arranged as a ferroelectric tunnel junction (FTJ) comprising opposing conductive electrode layers between which the ferroelectric layer and a tunnel junction layer are contactingly disposed. The ferroelectric layer may be formed of HfO2, ZrO2, Hf1-xZxO2, etc. The tunnel barrier layer may be formed of Al2O3, MgO, SrTiO3, etc. The memory can be used as a substitute for DRAM, a main memory in a data storage device, a data cache, etc.

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