SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    61.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20140048801A1

    公开(公告)日:2014-02-20

    申请号:US14064294

    申请日:2013-10-28

    Abstract: A semiconductor device having a novel structure or a method for manufacturing the semiconductor device is provided. For example, the reliability of a transistor which is driven at high voltage or large current is improved. For improvement of the reliability of the transistor, a buffer layer is provided between a drain electrode layer (or a source electrode layer) and an oxide semiconductor layer such that the end portion of the buffer layer is beyond the side surface of the drain electrode layer (or the source electrode layer) when seen in a cross section, whereby the buffer layer can relieve the concentration of electric field. The buffer layer is a single layer or a stacked layer including a plurality of layers, and includes, for example, an In—Ga—Zn—O film containing nitrogen, an In—Sn—O film containing nitrogen, an In—Sn—O film containing SiOx, or the like.

    Abstract translation: 提供具有新颖结构的半导体器件或半导体器件的制造方法。 例如,提高了以高电压或大电流驱动的晶体管的可靠性。 为了提高晶体管的可靠性,在漏电极层(或源极电极层)和氧化物半导体层之间设置缓冲层,使得缓冲层的端部超出漏电极层的侧面 (或源电极层),从而缓冲层能够缓和电场的集中。 缓冲层是包含多个层的单层或层叠层,例如包含氮的In-Ga-Zn-O膜,含有氮的In-Sn-O膜,In-Sn-O系膜, O膜等。

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