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61.发明公开公开(公告)号：US20230197912A1
公开(公告)日：2023-06-22
申请号：US17991411
申请日：2022-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG , Junsik HWANG
IPC: H01L33/50 , G02B5/08 , H01L25/075 , H01L33/60
CPC classification number: H01L33/505 , G02B5/08 , H01L25/0753 , H01L33/502 , H01L33/60 , H01L2933/0041
Abstract: Provided are a color conversion structure, a display apparatus, and a method of manufacturing a color conversion structure. The color conversion structure includes a bank structure including a groove, a color conversion layer accommodated in the groove, and a cover layer provided on the color conversion layer.
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公开(公告)号：US20220344533A1
公开(公告)日：2022-10-27
申请号：US17550851
申请日：2021-12-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsik HWANG , Kyungwook HWANG , Dongho KIM , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG
IPC: H01L33/00
Abstract: A multi-use transfer mold and a method of manufacturing a display apparatus are provided. The multi-use transfer mold includes a transfer substrate and a plurality of grooves provided in the transfer substrate, wherein each of the grooves includes a transfer area for accommodating a transfer micro-light-emitting device and a preliminary area for accommodating a preliminary micro-light-emitting device, wherein the preliminary area is connected to the transfer area.
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63.发明申请公开(公告)号：US20220328733A1
公开(公告)日：2022-10-13
申请号：US17708332
申请日：2022-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Joonyong Park , Dongho Kim , Hyunjoon Kim , Seogwoo Hong , Junsik Hwang
IPC: H01L33/50 , H01L25/075 , H01L25/04 , C09K11/02
Abstract: Disclosed are a color conversion structure, a display apparatus, and a method of manufacturing the display apparatus. The color conversion structure has a transferable film structure which includes a base layer and a quantum dot layer provided on the base layer.
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公开(公告)号：US20220293669A1
公开(公告)日：2022-09-15
申请号：US17525587
申请日：2021-11-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joonyong PARK , Dongho KIM , Hyunjoon KIM , Seogwoo HONG , Kyungwook HWANG , Junsik HWANG
Abstract: A display apparatus includes a driving substrate including a plurality of grooves, micro light-emitting devices provided in the plurality of grooves and configured to emit light of a first color, and a color conversion layer provided on the micro light-emitting devices and configured to convert the light of the first color into light of at least one second color, wherein the color conversion layer includes light blocking patterns spaced apart from the micro light-emitting devices and spaced apart from each other on a same plane, a nano-porous layer provided between adjacent ones of the light blocking patterns, spaced apart from the micro light-emitting devices, and including a plurality of nano-pores, and quantum dots impregnated in the nano-porous layer and configured to convert the light of the first color into the light of the at least one second color.
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公开(公告)号：US20220216368A1
公开(公告)日：2022-07-07
申请号：US17527366
申请日：2021-11-16
Inventor： Kyungwook HWANG , Ho Won JANG , Junsik HWANG , Jehong OH , Jungel RYU , Seungmin LEE
Abstract: Provided are a semiconductor structure and a method of manufacturing the same. The semiconductor structure includes a substrate, a membrane bridge that defines, with the substrate, a plurality of cavities, and a nitride semiconductor layer arranged on the membrane bridge. The membrane bridge and the substrate have the same crystal structure. The membrane bridge has an upper surface with a constant height with respect to a surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20220190193A1
公开(公告)日：2022-06-16
申请号：US17479706
申请日：2021-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo HONG , Hyunjoon KIM , Joonyong PARK , Kyungwook HWANG , Junsik HWANG
IPC: H01L33/00 , H01L25/075 , H01L21/683
Abstract: A display transfer structure includes a base layer, a flexible barrier rib positioned on the base layer and having a plurality of holes therein, and a plurality of micro light emitting diodes (LEDs) positioned respectively in the plurality of holes. A method of manufacturing the display transfer structure includes forming a flexible barrier rib having holes on a base layer, supplying liquid to the holes, supplying micro LEDs to the liquid, and scanning the flexible barrier rib with an absorber capable of absorbing the liquid to align each of the micro LEDs in a respective hole such that electrodes of the micro LEDs face an outside of the holes.
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公开(公告)号：US20220189810A1
公开(公告)日：2022-06-16
申请号：US17383012
申请日：2021-07-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG , Junsik HWANG
IPC: H01L21/68 , H01L21/683 , H01L25/075
Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.
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公开(公告)号：US20220102602A1
公开(公告)日：2022-03-31
申请号：US17197357
申请日：2021-03-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsik HWANG , Seogwoo HONG , Kyungwook HWANG
IPC: H01L33/62 , H01L25/075 , H01L27/12
Abstract: A micro light emitting device, a display apparatus including the same, and a method of manufacturing the micro light emitting device are disclosed. The micro light emitting device includes a first type semiconductor layer; a light emitting layer provided on the first type semiconductor layer; a second type semiconductor layer provided on the light emitting layer; one or more first type electrodes provided on the second type semiconductor layer; one or more second type electrodes provided on the second type semiconductor layer and spaced apart from the one or more first type electrodes; and a bonding spread prevention portion provided between the one or more first type electrodes and the one or more second type electrodes.
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公开(公告)号：US20210397045A1
公开(公告)日：2021-12-23
申请号：US17128609
申请日：2020-12-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Junsik HWANG
IPC: G02F1/1335 , G02F1/13357
Abstract: Provided is a backlight unit configured to emit light to a liquid crystal display device including a plurality of pixels, the backlight unit including a substrate including a driving circuit, and a light source array including a plurality of micro light-emitting elements provided on the substrate, wherein a number of micro light-emitting elements is equal to or greater than a number of the plurality of pixels.
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70.发明申请公开(公告)号：US20210249556A1
公开(公告)日：2021-08-12
申请号：US16933187
申请日：2020-07-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsik HWANG , Kyungwook HWANG
Abstract: A light-emitting diode (LED) device includes a light-emitting layer having a core-shell structure that comprises a first semiconductor layer, an active layer, and a second semiconductor layer; a passivation layer formed to cover at least a portion of a side surface and a portion of an upper surface of the second semiconductor layer; a first electrode formed on a portion of the passivation layer that is located on a side surface of the light-emitting layer, the first electrode electrically connected to the first semiconductor layer and including a reflective material; and a second electrode formed on a portion of the passivation layer that is located on an upper surface of the light-emitting layer, the second electrode contacting a portion of the upper surface of the second semiconductor layer that is exposed.
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