摘要:
A stack package may include a plurality of individual packages arranged in a stack. Each individual package may have a circuit substrate disposed on the upper and lower surfaces of a semiconductor chip. Through bonding wires, a lower circuit substrate may be electrically connected to the semiconductor chip, and an upper circuit substrate may be electrically connected to the lower circuit substrate. An upper package in the stack may be mechanically and electrically connected to the upper circuit substrate of a lower package in the stack through conductive bumps. The semiconductor chip may be surrounded by the upper and the lower circuit substrates, and molding resins. The individual packages may have the same conductive bump layout.
摘要:
An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.
摘要:
The present invention relates to a novel bipyridinyl derivative having a structure of formula (1) and its pharmaceutically acceptable salts, optical isomer and method for preparing it as a highly selective cyclooxygenase-2 inhibitor, wherein R is defined in this specification.
摘要:
A semiconductor device having a trench isolation structure and a method of fabricating the same are provided. The device has a trench region and an isolation structure. The trench region is disposed to define an active region at a predetermined region of an SOI substrate formed by sequentially stacking a buried insulating layer and an upper silicon layer on a base substrate. The isolation structure fills an inside of the trench region. The trench region has a deep trench region where the upper silicon layer penetrates to the buried insulating layer and a shallow trench region existing at an outside of the deep trench region. The method of forming a trench region with deep and shallow trench regions includes patterning an upper silicon layer of an SOI substrate. A trench oxide layer and a trench liner are conformally formed on a sidewall and a bottom of the trench region. The trench liner on the bottom of the trench region, the trench oxide layer, and the upper silicon layer are successively patterned to form the deep trench region where the buried insulating layer is exposed. The trench region existing at an outside of the deep trench region corresponds to the shallow trench region.
摘要:
A semiconductor device having a trench isolation structure and a method of fabricating the same are provided. The device has a trench region and an isolation structure. The trench region is disposed to define an active region at a predetermined region of an SOI substrate formed by sequentially stacking a buried insulating layer and an upper silicon layer on a base substrate. The isolation structure fills an inside of the trench region. The trench region has a deep trench region where the upper silicon layer penetrates to the buried insulating layer and a shallow trench region existing at an outside of the deep trench region. The method of forming a trench region with deep and shallow trench regions includes patterning an upper silicon layer of an SOI substrate. A trench oxide layer and a trench liner are conformally formed on a sidewall and a bottom of the trench region. The trench liner on the bottom of the trench region, the trench oxide layer, and the upper silicon layer are successively patterned to form the deep trench region where the buried insulating layer is exposed. The trench region existing at an outside of the deep trench region corresponds to the shallow trench region.
摘要:
A textured semiconductor wafer for a solar cell includes a plurality of grooves being formed on a surface of the semiconductor wafer. The grooves are formed in the step of depositing a protector in the form of islands on the surface by spray process or screen-printing process, dipping the wafer into an isotropic etching solution to etch a portion of the surface where the protector is not deposited, and removing the protector.
摘要:
Thin film AMA in an optical projection system and a method for manufacturing the same are disclosed. The thin film AMA has a substrate having an electrical wiring for receiving a first signal applied from outside and transmitting the first signal, a first metal layer having a connecting terminal, a first passivation layer, a second metal layer, an actuator, and a reflecting member. The actuator has a supporting layer, a bottom electrode, an active layer, and a top electrode. An incident light from a light source may be excluded by means of the second metal layer formed on the first metal layer. Mis-operation of actuator due to a photo leakage current caused by an incident light can be prevented before a first signal and a second signal are respectively applied to the bottom electrode and the top electrode.
摘要:
The present invention relates to a composition for inducing embryonic stem cell differentiation comprising a MEK/ERK (mitogen-activated protein kinase kinase/extracellular regulated kinase) signal transduction inhibitor and BMP (bone morphogenetic protein), and a method for inducing differentiation of embryonic stem cells into mesodermal cells using the same. Further, the mesodermal cells obtained by the above method are able to differentiate into various mesenchymal tissue cells. In particular, the present invention relates to a method for inducing differentiation into hemangioblast by culturing the mesodermal cells obtained by the above method in the presence of VEGF (vascular endothelial cell growth factor) and bFGF (basic fibroblast growth factor). The differentiated hemangioblasts can be further differentiated into vascular endothelial cells, vascular smooth muscle cells, and hematopoietic stem cells under various culture conditions.
摘要:
A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.
摘要:
An apparatus for a cargo insulation panel and an insulation panel using the fixing apparatus are provided. By providing a fixing apparatus of a cargo insulation panel and an insulation panel using the fixing apparatus, which include a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate, the present invention can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally, and solve the problem of damage by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.