公开(公告)号：US07399707B2

公开(公告)日：2008-07-15

申请号：US11036632

申请日：2005-01-13

申请人： Padmanabhan Krishnaraj ,  Pavel Ionov ,  Canfeng Lai ,  Michael Santiago Cox ,  Shamouil Shamouilian

发明人： Padmanabhan Krishnaraj ,  Pavel Ionov ,  Canfeng Lai ,  Michael Santiago Cox ,  Shamouil Shamouilian

IPC分类号： H01L21/302

CPC分类号： C23C16/45523 ,  C23C16/045 ,  C23C16/509 ,  C30B25/105 ,  H01J37/32935 ,  H01L21/02164 ,  H01L21/02274 ,  H01L21/31116 ,  H01L21/31612 ,  H01L21/76837

摘要： A continuous in situ process of deposition, etching, and deposition is provided for forming a film on a substrate using a plasma process. The etch-back may be performed without separate plasma activation of the etchant gas. The sequence of deposition, etching, and deposition permits features with high aspect ratios to be filled, while the continuity of the process results in improved uniformity.

摘要翻译： 提供了沉积，蚀刻和沉积的连续原位工艺，用于使用等离子体工艺在衬底上形成膜。 可以在没有蚀刻剂气体的单独的等离子体激活的情况下执行回蚀。 沉积，蚀刻和沉积的顺序允许填充高纵横比的特征，而过程的连续性导致改善的均匀性。

公开(公告)号：US06418874B1

公开(公告)日：2002-07-16

申请号：US09584167

申请日：2000-05-25

申请人： Michael S. Cox ,  Canfeng Lai ,  Robert B. Majewski ,  David P. Wanamaker ,  Christopher T. Lane ,  Peter Loewenhardt ,  Shamouil Shamouilian ,  John P. Parks

发明人： Michael S. Cox ,  Canfeng Lai ,  Robert B. Majewski ,  David P. Wanamaker ,  Christopher T. Lane ,  Peter Loewenhardt ,  Shamouil Shamouilian ,  John P. Parks

IPC分类号： C23C1600

CPC分类号： H01J37/32009 ,  H01J37/321

摘要： A toroidal plasma source (28) within a substrate processing chamber (10). The toroidal plasma source forms a poloidal plasma with theta symmetry. The poloidal plasma current is essentially parallel to a surface of the plasma generating structure, thus reducing sputtering erosion of the inner walls. The plasma current is similarly essentially parallel to a process surface (32) of a substrate (34) within the chamber. In a further embodiment, a shaped member (66) between the substrate and the plasma source controls the plasma density in a selected fashion to enhance plasma processing uniformity.

摘要翻译： 衬底处理室（10）内的环形等离子体源（28）。 环形等离子体源形成具有θ对称性的极向等离子体。 极向等离子体电流基本上平行于等离子体产生结构的表面，从而减少内壁的溅射侵蚀。 等离子体电流类似地基本上平行于腔室内的衬底（34）的工艺表面（32）。 在另一实施例中，衬底和等离子体源之间的成形构件（66）以选定的方式控制等离子体密度，以提高等离子体处理的均匀性。

公开(公告)号：US06280584B1

公开(公告)日：2001-08-28

申请号：US09124317

申请日：1998-07-29

申请人： Ananda H. Kumar ,  Kadthala R. Narendrnath ,  Shamouil Shamouilian

发明人： Ananda H. Kumar ,  Kadthala R. Narendrnath ,  Shamouil Shamouilian

IPC分类号： H02N1300

CPC分类号： H02N13/00

摘要： A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and metal surfaces 30, 35. More preferably, the wire mesh 25 comprises strands having a coefficient of thermal expansion that is about 0.4 to about 1.6 times the average of the coefficients of thermal expansion of the metal and ceramic surfaces 30, 35.

摘要翻译： 由柔顺金属40包围的金属丝网25股线50的柔性粘合结构20可用于将陶瓷表面30粘合到金属表面35.金属丝网25包括具有基本平行于陶瓷的纵向轴线的互锁股线50，以及 金属丝网25更优选地，金属丝网25包括热膨胀系数为金属和陶瓷表面30,35的热膨胀系数的平均值的约0.4至约1.6倍的股线。

公开(公告)号：US06055150A

公开(公告)日：2000-04-25

申请号：US188038

申请日：1998-11-06

申请人： Jon Clinton ,  Mark Contreras ,  Anand H. Kumar ,  Shamouil Shamouilian ,  You Wang ,  Surinder Bedi

发明人： Jon Clinton ,  Mark Contreras ,  Anand H. Kumar ,  Shamouil Shamouilian ,  You Wang ,  Surinder Bedi

IPC分类号： H01L21/683 ,  H02N13/00

CPC分类号： H01L21/6833 ,  Y10T279/23

摘要： A failure resistant electrostatic chuck 20 for holding a substrate 35 during processing of the substrate 35 comprises one or more electrodes 25 covered by an insulator 30, the electrodes 25 capable of electrostatically holding a substrate 35 when a voltage is applied thereto. An electrical power bus 40 comprises one or more output terminals 45 that conduct voltage to the electrodes 25. The fuses 50 are positioned in hollow cavities 55 in the insulator 30, and electrically connect the electrodes 25 in series to the output terminals 45 of the power bus 40. Each fuse 50 can electrically disconnect an electrode 25 from an output terminal 45 when the insulator 30 covering the electrode 25 punctures and exposes the electrode 25 to a plasma process environment thereby causing a plasma current discharge to flow through the fuse 50.

摘要翻译： 用于在基板35的处理期间保持基板35的耐破坏静电卡盘20包括由绝缘体30覆盖的一个或多个电极25，当施加电压时能够静电保持基板35的电极25。 电力总线40包括向电极25传导电压的一个或多个输出端子45.保险丝50定位在绝缘体30中的空腔55中，并将电极25串联电连接到电源的输出端子45 总线40.当覆盖电极25的绝缘体30刺穿并将电极25暴露于等离子体处理环境时，每个保险丝50可以将电极25与输出端子45电断开，从而使等离子体电流放电流过保险丝50。

公开(公告)号：US6023405A

公开(公告)日：2000-02-08

申请号：US24917

申请日：1998-02-17

申请人： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

发明人： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

IPC分类号： B25J15/06 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H02N13/00

CPC分类号： C23C16/45521 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00 ,  Y10T279/23 ,  Y10T29/49117

摘要： An electrostatic chuck (20) for holding a substrate (45) is described. One version of the chuck (20) suitable for mounting on a base (25), comprises (i) an electrostatic member (33) having an electrode (50) therein, and (ii) an electrical lead (60) extending through the base (25) to electrically engage the electrode (50) of the electrostatic member (33). When the chuck (20) is used to hold a substrate (45) in a process chamber (80) containing erosive process gas, the substrate (45) covers and substantially protects the electrical lead (60) from erosion by the erosive process gas. In a preferred version of the chuck (20), an electrical connector (55) forming an integral extension of the electrode (50), electrically connects the electrode (50) to a voltage supply terminal (70) used to operate the chuck (20). The electrical connector (55) comprises (i) an electrical lead (60) that extends through the base (25), and (ii) an electrical contact (65) on the electrical lead (60), the contact sized sufficiently large to directly contact and electrically engage the voltage supply terminal (70). The electrode (50) of the chuck (20) can comprise first and second electrodes (130), (135) electrically isolated from one another by an electrical isolation void (52), the electrodes sized and configured so that the electrical isolation void (52) can serve as a cooling groove (105) for holding coolant for cooling the substrate (45) held on the chuck (20). Preferably, the two electrode chuck (20) is used in conjunction with a switching system capable of operating the chuck (20) in either a monopolar mode or in a bipolar mode.

摘要翻译： 描述了用于保持基板（45）的静电卡盘（20）。 适于安装在基座（25）上的卡盘（20）的一个版本包括（i）其中具有电极（50）的静电部件（33）和（ii）延伸穿过底座 （25）电连接静电部件（33）的电极（50）。 当卡盘（20）用于将基板（45）保持在包含腐蚀性处理气体的处理室（80）中时，基板（45）覆盖并基本上保护电引线（60）免受侵蚀性处理气体的侵蚀。 在卡盘（20）的优选形式中，形成电极（50）的整体延伸的电连接器（55）将电极（50）电连接到用于操作卡盘（20）的电压供应端子 ）。 电连接器（55）包括（i）延伸穿过基座（25）的电引线（60）和（ii）电引线（60）上的电触头（65），触头尺寸足够大以直接 接触和电接合电压端子（70）。 卡盘（20）的电极（50）可以包括通过电隔离空隙（52）彼此电隔离的第一和第二电极（130），电极的尺寸和构造使得电隔离空隙（ 52）可以用作用于保持冷却剂的冷却槽（105），以冷却保持在卡盘（20）上的基板（45）。 优选地，两个电极卡盘（20）与能够以单极模式或双极模式操作卡盘（20）的开关系统结合使用。

公开(公告)号：US5880924A

公开(公告)日：1999-03-09

申请号：US980591

申请日：1997-12-01

申请人： Ananda H. Kumar ,  Shamouil Shamouilian

发明人： Ananda H. Kumar ,  Shamouil Shamouilian

IPC分类号： B25J15/06 ,  B23Q3/15 ,  H01L21/683 ,  H02N13/00

CPC分类号： H01L21/6831 ,  H02N13/00 ,  Y10T279/23

摘要： An electrostatic chuck 20 for holding a substrate 12 comprises a dielectric 70 having a receiving surface 75 for receiving the substrate thereon. The dielectric 70 comprises a charging electrode 80 for generating electrostatic charge for electrostatically holding the substrate 12 to the receiving surface 75, and a discharge electrode 85 electrically isolated from the charging electrode for removing electrostatic charge accumulated in the chuck 20.

摘要翻译： 用于保持基板12的静电卡盘20包括具有用于在其上接收基板的接收表面75的电介质70。 电介质70包括用于产生用于将基板12静电保持到接收表面75的静电电荷的充电电极80以及与充电电极电隔离以去除积聚在卡盘20中的静电电荷的放电电极85。

公开(公告)号：US5822171A

公开(公告)日：1998-10-13

申请号：US410449

申请日：1995-03-24

申请人： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspiel ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

发明人： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspiel ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

IPC分类号： B25J15/06 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H02N13/00

CPC分类号： C23C16/45521 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00 ,  Y10T279/23 ,  Y10T29/49117

摘要： An electrostatic chuck (20) for holding a substrate (45) is described. One version of the chuck (20) suitable for mounting on a base (25), comprises (i) an electrostatic member (33) having an electrode (50) therein, and (ii) an electrical lead (60) extending through the base (25) to electrically engage the electrode (50) of the electrostatic member (33). When the chuck (20) is used to hold a substrate (45) in a process chamber (80) containing erosive process gas, the substrate (45) covers and substantially protects the electrical lead (60) from erosion by the erosive process gas. In a preferred version of the chuck (20), an electrical connector (55) forming an integral extension of the electrode (50), electrically connects the electrode (50) to a voltage supply terminal (70) used to operate the chuck (20). The electrical connector (55) comprises (i) an electrical lead (60) that extends through the base (25), and (ii) an electrical contact (65) on the electrical lead (60), the contact sized sufficiently large to directly contact and electrically engage the voltage supply terminal (70). The electrode (50) of the chuck (20) can comprise first and second electrodes (130), (135) electrically isolated from one another by an electrical isolation void (52), the electrodes sized and configured so that the electrical isolation void (52) can serve as a cooling groove (105) for holding coolant for cooling the substrate (45) held on the chuck (20). Preferably, the two electrode chuck (20) is used in conjunction with a switching system capable of operating the chuck (20) in either a monopolar mode or in a bipolar mode. Erosion resistance of the chuck (20) is further enhanced by a masking gas assembly (115) which directs a masking gas at an exposed portion of the insulator (35), to protect the exposed portion of the insulator (35) from the erosive gas contained in the process chamber (80).

公开(公告)号：US5634266A

公开(公告)日：1997-06-03

申请号：US449135

申请日：1995-05-24

申请人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

发明人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

IPC分类号： B23Q3/15 ,  C23C16/458 ,  H01L21/00 ,  H01L21/683 ,  H02N13/00 ,  H01R43/00

CPC分类号： H02N13/00 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23 ,  Y10T29/49117

摘要： A method of making a dielectric chuck for securing a semiconductor wafer on a pedestal having multiple apertures for the introduction of cooling gas beneath the wafer. The wafer is held by electrostatic force against a laminate of an electrode layer sandwiched between two dielectric layers in accordance with the method, such that the laminate presents a planar surface to the wafer for a substantial distance beyond the outer edge of the electrode layer. The laminate construction method ensures that a large wafer area beyond the outer edge of the electrode is in contact with the laminate, to minimize cooling gas leakage near the edge, and provides a longer useful life by increasing the path length of dielectric material between the electrode layer and potentially damaging plasma material surrounding the chuck.

摘要翻译： 一种制造用于将半导体晶片固定在具有多个孔的基座上用于在晶片下引入冷却气体的电介质卡盘的方法。 根据该方法，晶片通过静电力保持在夹在两个电介质层之间的电极层的层压体上，使得层压体在晶片上呈现超过电极层的外边缘相当距离的平坦表面。 层叠结构方法确保了超过电极外边缘的大晶圆区域与层压板接触，以使边缘附近的冷却气体泄漏最小化，并且通过增加电极之间的电介质材料的路径长度来提供更长的使用寿命 层和可能损坏的卡盘周围的等离子体材料。

公开(公告)号：US5486975A

公开(公告)日：1996-01-23

申请号：US189811

申请日：1994-01-31

申请人： Shamouil Shamouilian ,  Yoshi Tanase

发明人： Shamouil Shamouilian ,  Yoshi Tanase

IPC分类号： B23Q3/15 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H02N13/00

CPC分类号： H01L21/6831

摘要： A corrosion resistant electrostatic chuck 10 for holding a silicon wafer 18 during processing with a corrosive gas has an electrically insulative layer 12 thereon protected from corrosion by a guard 14. The insulative layer 12 has a top surface 20 covered by the silicon wafer 18 and an exposed side surface 16. The guard 14 substantially encloses the exposed side surface 16 of the insulative layer 12 and protects the insulative layer 12 from a corrosive gas. The guard 14 is made of sacrificial material that corrodes at least as fast as the insulative layer 12 corrodes when exposed to the corrosive gas. The sacrificial material positioned near the exposed side surface 16 corrodes and reduces the concentration of the corrosive gas at the exposed side surface 16, thereby reducing the rate of corrosion of the insulative layer 12.

摘要翻译： 用于在用腐蚀性气体加工的过程中保持硅晶片18的耐腐蚀静电卡盘10具有一个电绝缘层12，保护层不受防护层14的腐蚀。绝缘层12具有被硅晶片18覆盖的顶表面20和 防护罩14基本上包围绝缘层12的暴露的侧表面16，并保护绝缘层12免受腐蚀性气体的影响。 防护件14由牺牲材料制成，其腐蚀至少与暴露于腐蚀性气体时绝缘层12腐蚀一样快。 位于暴露侧表面16附近的牺牲材料腐蚀并降低暴露侧表面16处的腐蚀性气体的浓度，从而降低绝缘层12的腐蚀速率。

公开(公告)号：US4940508A

公开(公告)日：1990-07-10

申请号：US371211

申请日：1989-06-26

申请人： Shamouil Shamouilian ,  Paul N. Ludwig

发明人： Shamouil Shamouilian ,  Paul N. Ludwig

IPC分类号： B23K26/06 ,  B23K26/36 ,  H01L21/3213 ,  H01L21/768

CPC分类号： H01L21/32131 ,  B23K26/066 ,  B23K26/362 ,  H01L21/76886 ,  H01L21/76894

摘要： The present invention is directed to a system for removing material from a structure. The system includes an excimer laser for removing material by ablative photodecomposition and means for increasing the energy density of the laser beam. The system further includes an aperture structure having a plurality of openings of different sizes and shapes. At least one of these openings may be selectively positioned in the laser beam. Additionally, the system includes a stage for supporting the structure wherein the stage is moveable in at least the x and y directions.

摘要翻译： 本发明涉及一种用于从结构中去除材料的系统。 该系统包括用于通过烧蚀光分解去除材料的准分子激光器和用于增加激光束的能量密度的装置。 该系统还包括具有不同尺寸和形状的多个开口的孔结构。 这些开口中的至少一个可以选择性地定位在激光束中。 另外，该系统包括用于支撑该结构的平台，其中该台可在至少x和y方向上移动。