公开(公告)号：US5671117A

公开(公告)日：1997-09-23

申请号：US626667

申请日：1996-03-27

申请人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

发明人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

IPC分类号： B23Q3/15 ,  C23C16/458 ,  H01L21/00 ,  H01L21/683 ,  H02N13/00

CPC分类号： H02N13/00 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23 ,  Y10T29/49117

摘要： An electrostatic chuck for securing a semiconductor wafer on a pedestal having multiple apertures for the introduction of cooling gas beneath the wafer. The multiple apertures reduce overheating near the wafer edge and provide lower temperature gradients across the wafer. The wafer is held by electrostatic force against a laminate of an electrode layer sandwiched between two dielectric layers in such a way that the laminate presents a planar surface to the wafer for a substantial distance beyond the outer edge of the electrode layer. The laminate construction ensures that a large wafer area beyond the outer edge of the electrode is in contact with the laminate, to minimize cooling gas leakage near the edge, and provides a longer useful life by increasing the path length of dielectric material between the electrode layer and potentially damaging plasma material surrounding the chuck.

摘要翻译： 一种用于将半导体晶片固定在具有多个孔的基座上以在晶片下方引入冷却气体的静电卡盘。 多个孔径减小晶片边缘附近的过热，并在晶片上提供较低的温度梯度。 晶片通过静电力抵抗夹在两个电介质层之间的电极层的层压体，使得层压体在晶片上呈现超过电极层的外边缘相当长的平面。 层压结构确保了超过电极外边缘的大的晶片区域与层压体接触，以使边缘附近的冷却气体泄漏最小化，并且通过增加电极层之间的电介质材料的路径长度来提供更长的使用寿命 并可能损坏卡盘周围的等离子体材料。

公开(公告)号：US5883778A

公开(公告)日：1999-03-16

申请号：US503790

申请日：1995-07-18

申请人： Semyon Sherstinsky ,  John F. Cameron ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam ,  Robert E. Ryan

发明人： Semyon Sherstinsky ,  John F. Cameron ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam ,  Robert E. Ryan

IPC分类号： B23Q3/15 ,  C23C16/458 ,  H01L21/00 ,  H01L21/683 ,  H02N13/00

CPC分类号： H02N13/00 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

摘要： An electrostatic chuck 20 of the present invention is capable of maintaining substantially uniform temperatures across a substrate 30. The chuck 20 comprises an electrostatic member 35 that includes (i) an insulator 45 covering an electrode 40, (ii) a substantially planar and conformal contact surface 50 capable of conforming to a substrate 30, and (iii) conduits 105 terminating at the contact surface 50 for providing heat transfer fluid to the contact surface 50. Application of a voltage to the electrode 40 of the electrostatic member 35 electrostatically holds the substrate 30 on the conformal contact surface 50 to define an outer periphery 110 having (1) leaking portions 115 where heat transfer fluid leaks out, and (2) sealed portions 130 where heat transfer fluid substantially does not leak out. A fluid flow regulator 135 is provided for flowing heat transfer fluid at different flow rates through the conduits 105 in the electrostatic member 35 to provide (i) first flow rates of heat transfer fluid through the conduits 105 adjacent to the sealed portions 130 of the outer periphery 110 of the electrostatic member 35, and (ii) second flow rates of heat transfer fluid through the conduits 105 adjacent to the leaking portions 115, the second flow rates being higher than the first flow rates, to maintain substantially uniform temperatures across the substrate 30 held on the chuck 20.

摘要翻译： 本发明的静电卡盘20能够在基板30上保持基本均匀的温度。卡盘20包括静电部件35，静电部件35包括（i）覆盖电极40的绝缘体45，（ii）基本上平面和保形接触 能够与衬底30相符的表面50，以及（iii）终止于接触表面50处的导管105，用于将热传递流体提供给接触表面50.施加电压到静电构件35的电极40，静电地保持衬底 30，以形成具有（1）泄漏部分115（其中传热流体泄漏）的外周110，以及（2）传热流体基本上不会泄漏的密封部分130。 提供流体流量调节器135，用于使不同流速的传热流体流过静电构件35中的管道105，以提供（i）传热流体通过与外部的密封部分130相邻的导管105的第一流量 静电构件35的周边110，以及（ii）通过与泄漏部分115相邻的导管105的传热流体的第二流量，第二流速高于第一流速，以保持基本上均匀的温度 30夹在卡盘20上。

公开(公告)号：US5634266A

公开(公告)日：1997-06-03

申请号：US449135

申请日：1995-05-24

申请人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

发明人： Semyon Sherstinsky ,  Shamouil Shamouilian ,  Manoocher Birang ,  Alfred Mak ,  Simon W. Tam

IPC分类号： B23Q3/15 ,  C23C16/458 ,  H01L21/00 ,  H01L21/683 ,  H02N13/00 ,  H01R43/00

CPC分类号： H02N13/00 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23 ,  Y10T29/49117

摘要： A method of making a dielectric chuck for securing a semiconductor wafer on a pedestal having multiple apertures for the introduction of cooling gas beneath the wafer. The wafer is held by electrostatic force against a laminate of an electrode layer sandwiched between two dielectric layers in accordance with the method, such that the laminate presents a planar surface to the wafer for a substantial distance beyond the outer edge of the electrode layer. The laminate construction method ensures that a large wafer area beyond the outer edge of the electrode is in contact with the laminate, to minimize cooling gas leakage near the edge, and provides a longer useful life by increasing the path length of dielectric material between the electrode layer and potentially damaging plasma material surrounding the chuck.

摘要翻译： 一种制造用于将半导体晶片固定在具有多个孔的基座上用于在晶片下引入冷却气体的电介质卡盘的方法。 根据该方法，晶片通过静电力保持在夹在两个电介质层之间的电极层的层压体上，使得层压体在晶片上呈现超过电极层的外边缘相当距离的平坦表面。 层叠结构方法确保了超过电极外边缘的大晶圆区域与层压板接触，以使边缘附近的冷却气体泄漏最小化，并且通过增加电极之间的电介质材料的路径长度来提供更长的使用寿命 层和可能损坏的卡盘周围的等离子体材料。

公开(公告)号：US5316278A

公开(公告)日：1994-05-31

申请号：US947212

申请日：1992-09-18

申请人： Semyon Sherstinsky ,  Mei Chang ,  Charles C. Harris ,  Alfred Mak ,  James F. Roberts ,  Simon W. Tam ,  Wen T. Chang

发明人： Semyon Sherstinsky ,  Mei Chang ,  Charles C. Harris ,  Alfred Mak ,  James F. Roberts ,  Simon W. Tam ,  Wen T. Chang

IPC分类号： H01L21/687 ,  B25B1/00

CPC分类号： H01L21/68721 ,  Y10S269/903

摘要： An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.

摘要翻译： 公开了一种改进的夹紧环装置，其包括夹紧环装置，用于可屈服地接合大致圆形的半导体晶片以将晶片周边夹持到支撑基座，以在晶片与面对晶片的基座的表面之间提供周边密封， 通过在夹紧环中提供中心大致圆形的开口，以及从夹紧环装置中的中心开口径向向外延伸的一系列槽，从而将夹紧环装置的内部分成一系列 可伸缩的手指向内延伸朝向夹紧环装置中的中心开口。 在一个实施例中，槽的侧壁相对于夹紧环装置的平坦表面以相对于夹紧环装置的厚度和槽的宽度足够的角度倾斜以防止光线或 来自等离子体的颗粒通过狭槽从垂直于夹紧环装置的表面的平面的方向通过夹紧环装置下方的冲击表面行进。

公开(公告)号：US5740009A

公开(公告)日：1998-04-14

申请号：US758531

申请日：1996-11-29

申请人： Bryan Pu ,  Hongching Shan ,  Kuang-Han Ke ,  Michael Welch ,  Semyon Sherstinsky ,  Alfred Mak ,  Ling Chen ,  Sue Zhang ,  Leonel Arturo Zuniga ,  Samuel C. Wilson

发明人： Bryan Pu ,  Hongching Shan ,  Kuang-Han Ke ,  Michael Welch ,  Semyon Sherstinsky ,  Alfred Mak ,  Ling Chen ,  Sue Zhang ,  Leonel Arturo Zuniga ,  Samuel C. Wilson

IPC分类号： H01L21/683 ,  H01L21/687 ,  H02N13/00

CPC分类号： H01L21/68735 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00

摘要： Apparatus for retaining a wafer having improved wafer and chuck edge protection, contains an protection ring that circumscribes a pedestal and is biased to be in constant contact with the backside of the wafer. A biasing element uniformly biases the protection ring into contact with the circumferential edge of the wafer. The protection ring has an annular plan form that circumscribes an electrostatic chuck for retaining the wafer in a stationery position. Vertical travel of the ring is restricted by a hard stop that is formed by a portion of a focus ring which overhangs the protection ring. After a wafer is placed upon the chuck and the chucking force enabled, the chucking force easily overcomes the bias force upon the protection ring and the wafer rests upon the chuck support surface. The protection ring contacts the backside of the wafer to ensure that pedestal and electrostatic chuck are not exposed to the plasma and, when a silicon protection ring is used, the effective area of the wafer is extended beyond the physical dimensions of the wafer to facilitate a more uniform plasma distribution over the wafer.

摘要翻译： 用于保持具有改进的晶片和卡盘边缘保护的晶片的装置包含限定基座的保护环，并被偏置以与晶片的背面恒定接触。 偏置元件均匀地将保护环偏压成与晶片的周缘接触。 保护环具有环形平面形式，其环绕静电卡盘以将晶片保持在文具位置。 环的垂直行程受到由突出于保护环上的聚焦环的一部分形成的硬停止的限制。 在将晶片放置在卡盘上并且夹持力能够实现之后，夹紧力容易地克服保护环上的偏压力并且晶片搁置在卡盘支撑表面上。 保护环接触晶片的背面以确保基座和静电卡盘不暴露于等离子体，并且当使用硅保护环时，晶片的有效面积延伸超过晶片的物理尺寸以便于 在晶片上更均匀的等离子体分布。

公开(公告)号：US5673922A

公开(公告)日：1997-10-07

申请号：US403141

申请日：1995-03-13

申请人： Semyon Sherstinsky ,  Alfred Mak ,  Leonel Arturo Zuniga ,  Ling Chen

发明人： Semyon Sherstinsky ,  Alfred Mak ,  Leonel Arturo Zuniga ,  Ling Chen

IPC分类号： B23Q3/18 ,  H01L21/68 ,  B25B11/00

CPC分类号： B23Q3/186 ,  H01L21/68 ,  Y10T279/23 ,  Y10T279/26

摘要： A semiconductor processing chamber includes a substrate support member on which the substrate is positioned during processing in the chamber. To align the substrate on the substrate support member, an alignment member extends about the perimeter of the substrate receiving portion of the support member. The alignment member includes an alignment face thereon, which urges a substrate into alignment with the substrate receiving face of the support member as the substrate is deposited on the support member. The alignment member may also include a recessed portion, which ensures the presence of a gap between the edge of the substrate and the support member when the substrate contacts the support member.

摘要翻译： 半导体处理室包括衬底支撑构件，衬底在室中的处理期间被放置在衬底支撑构件上。 为了将衬底对准衬底支撑构件，对准构件围绕支撑构件的衬底容纳部分的周边延伸。 对准构件包括其上的对准面，当衬底沉积在支撑构件上时，该对准面将衬底与支撑构件的衬底接收面对准。 对准构件还可以包括凹陷部分，当凹陷部分基板接触支撑构件时，该部分确保在基板的边缘和支撑构件之间存在间隙。

公开(公告)号：US20110151119A1

公开(公告)日：2011-06-23

申请号：US13038309

申请日：2011-03-01

申请人： Lawrence Chung-Lai Lei ,  Alfred Mak ,  Rex Liu ,  Kon Park ,  Samuel S. Pak ,  Tzy-Chung Terry Wu ,  Simon Zhu ,  Ronald L. Rose ,  Gene Shin ,  Xiaoming Wang

发明人： Lawrence Chung-Lai Lei ,  Alfred Mak ,  Rex Liu ,  Kon Park ,  Samuel S. Pak ,  Tzy-Chung Terry Wu ,  Simon Zhu ,  Ronald L. Rose ,  Gene Shin ,  Xiaoming Wang

IPC分类号： H01L21/677 ,  H01L21/673 ,  C23C16/44 ,  C23C16/458 ,  C23C16/56

CPC分类号： H01L21/67173 ,  H01L21/6719 ,  H01L21/67706 ,  H01L21/67712 ,  H01L21/67727 ,  H01L21/67736 ,  H01L21/67748 ,  Y10S414/135

摘要： In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.

摘要翻译： 根据本文描述的一些实施例，提供了一种用于将衬底转移到两个或更多个工艺模块的方法，包括将至少一个衬底加载到一个或多个移动横向室中，所述移动横向室承载在邻近 两个或更多个处理模块，并且其中每个移动横向室被构造成在输送基板期间保持特定的气体状态。 一个或多个驱动系统被致动以沿着轨道推进一个或多个移动横向室中的至少一个。 所述至少一个移动传送室与所述处理模块中的至少一个对接，并且所述基板从所述移动横向室传送到所述至少一个处理模块。

公开(公告)号：US07501343B2

公开(公告)日：2009-03-10

申请号：US11739545

申请日：2007-04-24

申请人： Jeong Soo Byun ,  Alfred Mak

发明人： Jeong Soo Byun ,  Alfred Mak

IPC分类号： H01L21/44

CPC分类号： C23C16/45529 ,  C23C16/38 ,  C23C16/45531 ,  C23C16/45553 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76846

摘要： In one embodiment, a method for depositing a boride-containing barrier layer on a substrate is provided which includes exposing the substrate sequentially to a boron-containing compound and a metal precursor to form a first boride-containing layer during a first sequential chemisorption process and exposing the substrate to the boron-containing compound, the metal precursor, and a second precursor to form a second boride-containing layer on the first boride-containing layer during a second sequential chemisorption process. In one example, the metal precursor contains tungsten hexafluoride and the boron-containing compound contains diborane. In another embodiment, a contact layer is deposited over the second boride-containing layer. The contact layer may contain tungsten and be deposited by a chemical vapor deposition process. Alternatively, the contact layer may contain copper and be deposited by a physical vapor deposition process. In other examples, boride-containing layers may be formed at a temperature of less than about 500° C.

摘要翻译： 在一个实施例中，提供了一种用于在衬底上沉积含硼化物阻挡层的方法，其包括在第一顺序化学吸附过程期间将衬底依次暴露于含硼化合物和金属前体以形成第一含硼化物层， 在第二顺序化学吸附过程期间，将基底暴露于含硼化合物，金属前体和第二前体，以在第一含硼化物层上形成第二含硼化物层。 在一个实例中，金属前体含有六氟化钨，含硼化合物含有乙硼烷。 在另一个实施方案中，在第二含硼化物层上沉积接触层。 接触层可以含有钨并通过化学气相沉积工艺进行沉积。 或者，接触层可以含有铜并通过物理气相沉积工艺进行沉积。 在其他实例中，含硼化物的层可以在小于约500℃的温度下形成。

公开(公告)号：US20070007660A1

公开(公告)日：2007-01-11

申请号：US11530676

申请日：2006-09-11

申请人： Khiem Nguyen ,  Peter Satitpunwaycha ,  Alfred Mak

发明人： Khiem Nguyen ,  Peter Satitpunwaycha ,  Alfred Mak

IPC分类号： H01L23/52

CPC分类号： H01L21/68707 ,  H01J37/321 ,  H01J37/32623 ,  H01L21/68735

摘要： Method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system are provided. In one aspect, an apparatus is provided for supporting a substrate comprising a cover ring comprising a base having a bore disposed therethough, the base having an upper surface and one or more raised surfaces disposed adjacent the bore, wherein the raised surface comprise one or more first substrate support members disposed adjacent an edge of the bore and a capture ring disposed on the cover ring, the capture ring comprising a semi-circular annular ring having an inner perimeter corresponding to the bore of the cover ring and one or more second substrate support members disposed on the inner perimeter and adapted to receive a substrate, wherein the capture ring is adapted to mate with the cover ring and form one contiguous raised surface on the cover ring.

摘要翻译： 提供了用于在半导体晶片处理系统中支撑和转移衬底的方法和装置。 在一个方面，提供了一种用于支撑衬底的装置，其包括盖环，该盖环包括其上设置有孔的基部，所述基部具有上表面和邻近所述孔布置的一个或多个凸起表面，其中所述凸起表面包括一个或多个 第一衬底支撑构件邻近孔的边缘设置，并且捕获环设置在覆盖环上，捕获环包括半圆环形环，其具有对应于盖环的孔的内周边和一个或多个第二衬底支撑件 设置在内周上并适于接收基底的构件，其中捕获环适于与盖环配合并在盖环上形成一个连续的凸起表面。

公开(公告)号：US20060223286A1

公开(公告)日：2006-10-05

申请号：US11423535

申请日：2006-06-12

申请人： Barry Chin ,  Alfred Mak ,  Lawrence Lei ,  Ming Xi ,  Hua Chung ,  Ken Lai ,  Jeong Byun

发明人： Barry Chin ,  Alfred Mak ,  Lawrence Lei ,  Ming Xi ,  Hua Chung ,  Ken Lai ,  Jeong Byun

IPC分类号： C23C16/00 ,  H01L21/20

CPC分类号： C23C16/45544 ,  C23C16/45525 ,  C23C16/45548 ,  C23C16/45551 ,  C23C16/4583

摘要： A method and apparatus for atomic layer deposition (ALD) is described. The apparatus comprises a deposition chamber and a wafer support. The deposition chamber is divided into two or more deposition regions that are integrally connected one to another. The wafer support is movable between the two or more interconnected deposition regions within the deposition chamber.

摘要翻译： 描述了用于原子层沉积（ALD）的方法和装置。 该装置包括沉积室和晶片支架。 沉积室被分成两个或更多个彼此一体地连接的沉积区域。 晶片支撑件可在沉积室内的两个或更多互连的沉积区域之间移动。