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公开(公告)号：US10692302B2
公开(公告)日：2020-06-23
申请号：US15661556
申请日：2017-07-27
Inventor： Ercan M. Dede , Shailesh N. Joshi
Abstract: A method includes collecting, via processing circuitry, a first set of multi-load data from a power control unit of a vehicle and usage data at a first servicing of the vehicle, computing, via the processing circuitry, a Mahalanobis Distance (MD) using the first set of multi-load data, defining, via the processing circuitry, a healthy state and an anomaly threshold based on the MD, correlating, via the processing circuitry, the first set of usage data to the anomaly threshold; generating, via the processing circuitry, a usage based servicing schedule for a vehicle; collecting, via the processing circuitry, a next set of multi-load data and usage data at a next servicing of the vehicle; updating, via the processing circuitry, the MD, a servicing schedule and evaluating the performance of the vehicle; determining, via the processing circuitry, whether the MD crosses the anomaly threshold; and transmitting, via a network, a servicing alert.
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公开(公告)号：US10686085B2
公开(公告)日：2020-06-16
申请号：US16505011
申请日：2019-07-08
Inventor： Ercan M. Dede
IPC: H01L31/024 , H01L31/0224 , H01C1/082 , H01L31/028 , H01L31/0304 , H01L31/0232
Abstract: An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.
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公开(公告)号：US20200091677A1
公开(公告)日：2020-03-19
申请号：US16131842
申请日：2018-09-14
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Ottawa , Broadcom Inc.
Inventor： Ercan M. Dede , Christopher Valdivia , Matthew Wilkins , Karin Hinzer , Philippe-Olivier Provost , Denis Masson , Simon Fafard
Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.
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公开(公告)号：US10579069B2
公开(公告)日：2020-03-03
申请号：US15728217
申请日：2017-10-09
Inventor： Ercan M. Dede
Abstract: An autonomous driving system includes an aerial vehicle and an autonomous vehicle. The aerial vehicle includes an imaging device configured to obtain map data, an optical-to-electrical transducer configured to convert optical power to electrical power for operating the aerial vehicle, one or more processors, one or more memory modules, and machine readable instructions stored in the one or more memory modules of the aerial vehicle that, when executed by the one or more processors, cause the aerial vehicle to output the map data. The autonomous vehicle includes an optical power generator configured to transmit an optical power beam to the optical-to-electrical transducer of the aerial vehicle. The autonomous vehicle receives the map data output by the imaging device from the aerial vehicle.
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公开(公告)号：US10574152B2
公开(公告)日：2020-02-25
申请号：US15682392
申请日：2017-08-21
Inventor： Chi-Ming Wang , Ercan M. Dede , George C. Bucsan
Abstract: Bridge circuits provide a reduced amplitude of gate-source voltage oscillation when the switches switch states during short circuit triggered turnoff for protection. Bridge circuits reduce an amplitude of an oscillation voltage between a gate and a source of a transistor that is utilized as a switch in the bridge circuit. This is beneficial because the reduced amplitude reduces the likelihood of damage to the transistor. A bridge circuit includes a first power rail and a second power rail. The bridge circuit further includes a first circuit having a first switch and a second switch connected in parallel between the first power rail and the second power rail. The bridge circuit further includes at least one passive circuit element connected in parallel with a primary energy flow path of the first circuit to damp oscillation voltage of the first circuit.
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Patent Agency Ranking
公开(公告)号：US20200059120A1
公开(公告)日：2020-02-20
申请号：US16103605
申请日：2018-08-14
Inventor： Ercan M. Dede , Chungchih Chu , Paul Schmalenberg
Abstract: Methods, systems, and apparatus for a wireless charging apparatus. The wireless charging apparatus includes a layer or sheet of polymeric or similarly compliant material. The wireless charging apparatus includes an inductive loop embedded within the layer or sheet of polymeric material. The inductive loop has a first shape and a first size. The wireless charging apparatus includes one or more actuators. The one or more actuators are configured to move or shape the layer or sheet of polymeric material and the inductive loop. The wireless charging apparatus includes a controller. The controller is configured to determine a second shape or a second size for the inductive loop. The controller is configured to move or adjust the one or more actuators to form the inductive loop into a second shape or a second size.
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公开(公告)号：US10479218B2
公开(公告)日：2019-11-19
申请号：US15432845
申请日：2017-02-14
Inventor： Jae Seung Lee , Jongwon Shin , Ercan M. Dede
Abstract: Methods, systems, and apparatus for an electric vehicle. The system includes a battery control unit configured to be in a grid-connected mode or a stand-alone mode. The system includes a shared boost converter connected to a battery. The shared boost converter receives alternating current (AC) power, steps up voltage and converts the AC power to direct current (DC) power when the battery control unit is in the grid-connected mode. The shared boost converter receives DC power from the battery and steps up voltage when the battery control unit is in the stand-alone mode. The system also includes an inverter configured to receive the stepped up DC power when the battery control unit is in the stand-alone mode and convert the DC power to AC power. The system also includes a motor/generator connected to the inverter and configured to receive AC power for powering a drivetrain of the electric vehicle.
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68.发明申请公开(公告)号：US20190232437A1
公开(公告)日：2019-08-01
申请号：US15883890
申请日：2018-01-30
Inventor： Shailesh N. Joshi , Ercan M. Dede
Abstract: A multilayer composite bonding material with a plurality of thermal stress compensation layers is provided. The plurality of thermal stress compensation layers include a metal core layer, a pair of particle layers extending across the metal core layer such that the metal core layer is sandwiched between the pair of particle layers, and a pair of metal outer layers extending across the pair of particle layers such that the pair of particle layers are sandwiched between the pair of metal outer layers. A pair of low melting point (LMP) bonding layers extend across the pair of metal outer layers. The metal core layer, the pair of particle layers, and the pair of metal outer layers each have a melting point above a transient liquid phase (TLP) sintering temperature, and the pair of LMP bonding layers each have a melting point below the TLP sintering temperature.
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公开(公告)号：US20190229037A1
公开(公告)日：2019-07-25
申请号：US15879183
申请日：2018-01-24
Inventor： Feng Zhou , Ki Wook Jung , Ercan M. Dede
IPC: H01L23/473 , H01L23/498 , H01L21/48
Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.
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公开(公告)号：US20190118657A1
公开(公告)日：2019-04-25
申请号：US15789863
申请日：2017-10-20
Inventor： Chi-Ming Wang , Ercan M. Dede
Abstract: Methods, systems, and devices for an external vehicle charging system. The external vehicle charging system includes a first set of inductive coils. The first set of inductive coils include a first inductive coil and a second inductive coil and are configured to provide an alternating magnetic field to one or more inductive loops of a vehicle. The external vehicle charging system includes a sensor configured to detect a position of the one or more inductive loops and a processor. The processor is configured to determine a first threshold distance between the first inductive coil and the second inductive coil to reduce or eliminate interference. The processor is configured to activate the first inductive coil and the second inductive coil so that the first inductive coil and the second inductive coil align with the one or more inductive loops based on the detected position and the first threshold distance.
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