Semiconductor device
    64.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US08053758B2

    公开(公告)日:2011-11-08

    申请号:US12549140

    申请日:2009-08-27

    摘要: A semiconductor device for correcting an input signal and outputting a corrected signal are provided. The semiconductor device includes a semiconductor layer, a plurality of first conductors formed on one of faces of the semiconductor layer and serving as input terminals to which a signal is input, second conductors of the number larger than that of the first conductors at density higher than that of the first conductors, formed on the other face of the semiconductor layer, a high impurity concentration region provided on the semiconductor layer side of an interface between the second conductor and the semiconductor layer, an insulating layer formed on the other face, and a plurality of third conductors formed on the insulating layer and serving as output terminals for outputting the processed signal.

    摘要翻译: 提供了用于校正输入信号并输出​​校正信号的半导体器件。 半导体器件包括半导体层,形成在半导体层的一个表面上并用作输入信号的输入端的多个第一导体,第二导​​体的数量大于第一导体的密度高于 在半导体层的另一面形成的第一导体的第一导体的高杂质浓度区域设置在第二导体和半导体层之间的界面的半导体层侧,形成在另一面上的绝缘层, 多个第三导体,形成在绝缘层上并用作用于输出处理信号的输出端。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE
    68.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE 失效
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20090152652A1

    公开(公告)日:2009-06-18

    申请号:US12323770

    申请日:2008-11-26

    IPC分类号: H01L29/78 H01L21/336

    摘要: Described herein is a method of manufacturing a semiconductor device realizing higher performance by reducing contact resistance of an electrode. In the method, a gate insulating film, a gate electrode are formed on a semiconductor substrate. A first metal is deposited substrate, and a metal semiconductor compound layer is formed on the surface of the semiconductor substrate by making the first metal and the semiconductor substrate react each other by a first heat treatment. Ions having a mass equal to or larger than atomic weight of Si are implanted into the metal semiconductor compound layer. A second metal is deposited on the metal semiconductor compound layer. An interface layer is formed by making the second metal segregated at an interface between the metal semiconductor compound layer and the semiconductor substrate by diffusing the second metal through the metal semiconductor compound layer by a second heat treatment.

    摘要翻译: 这里描述的是通过降低电极的接触电阻来制造实现更高性能的半导体器件的方法。 在该方法中,在半导体衬底上形成栅极绝缘膜,栅电极。 第一金属是沉积衬底,并且通过使第一金属和半导体衬底通过第一热处理而彼此反应,在半导体衬底的表面上形成金属半导体化合物层。 将具有等于或大于Si原子量的质量的离子注入到金属半导体化合物层中。 第二金属沉积在金属半导体化合物层上。 通过使第二金属通过第二热处理使金属半导体化合物层扩散而使第二金属在金属半导体化合物层和半导体基板之间的界面分离而形成界面层。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    69.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20090008726A1

    公开(公告)日:2009-01-08

    申请号:US12051947

    申请日:2008-03-20

    IPC分类号: H01L47/00 H01L21/425

    摘要: A method of manufacturing a semiconductor device reducing interface resistance of n-type and p-type MISFETs are provided. According to the method, a gate dielectric film and a gate electrode of the n-type MISFET are formed on a first semiconductor region, a gate dielectric film and a gate electrode of the p-type MISFET are formed on a second semiconductor region, an n-type diffusion layer is formed by ion implantation of As into the first semiconductor region, a first silicide layer is formed by first heat treatment after a first metal containing Ni is deposited on the n-type diffusion layer, the first silicide layer is made thicker by second heat treatment after a second metal containing Ni is deposited on the first silicide layer and second semiconductor region, and third heat treatment is provided after formation of a second silicide layer and ion implantation of B or Mg into the second silicide layer.

    摘要翻译: 提供了制造半导体器件降低n型和p型MISFET的界面电阻的方法。 根据该方法,在第一半导体区域上形成栅极电介质膜和n型MISFET的栅电极,在第二半导体区域上形成p型MISFET的栅极电介质膜和栅电极, 通过将As离子注入第一半导体区域形成n型扩散层,在n型扩散层上沉积含有Ni的第一金属之后,通过第一热处理形成第一硅化物层,制作第一硅化物层 在第一硅化物层和第二半导体区域上沉积含有Ni的第二金属沉积第二热处理之后,在形成第二硅化物层和在第二硅化物层中离子注入B或Mg之后提供第三热处理。

    DIRECT TYPE FUEL CELL POWER GENERATOR
    70.
    发明申请
    DIRECT TYPE FUEL CELL POWER GENERATOR 有权
    直接型燃料电池发电机

    公开(公告)号:US20080107955A1

    公开(公告)日:2008-05-08

    申请号:US11970609

    申请日:2008-01-08

    IPC分类号: H01M8/02

    摘要: A direct type fuel cell power generator comprises an anode electrode including an anode catalyst layer, a cathode electrode including a cathode catalyst layer, a fuel container comprising at least two electromotive portion units, each of which comprises an electrolyte film disposed between the anode electrode and the cathode electrode, the fuel container housing a fuel therein, and a fuel flow path to supply a fuel in the electromotive portion unit. In the power generator, the fuel flow path has a flow path which produces flow-back again from the fuel container to the first electromotive portion unit via the first electromotive portion unit and the second electromotive portion unit, and which is not branched during the flow-back.

    摘要翻译: 直接型燃料电池发电机包括阳极电极,阳极电极包括阳极催化剂层,包括阴极催化剂层的阴极电极,包括至少两个电动部分单元的燃料容器,每个电极部分包括设置在阳极电极和 阴极电极,容纳燃料的燃料容器和用于在电动部分单元中供应燃料的燃料流动路径。 在发电机中,燃料流路具有经由第一电动部分单元和第二电动部分单元从燃料容器再次回流到第一电动部分单元的流动路径,并且在流动期间不分支 -背部。