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    LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION
    61.
    发明申请
    LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION 失效
    液体冷却电子设备和制造方法

    公开(公告)号：US20110069454A1

    公开(公告)日：2011-03-24

    申请号：US12566081

    申请日：2009-09-24

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

    IPC分类号： H05K7/20

    CPC分类号： H05K7/2079

    摘要： Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.

    摘要翻译： 提供液冷电子设备和方法。 冷却的电子设备包括液冷冷轨和电子组件。 液冷冷轨具有导热结构和在导热结构内延伸并冷却导热结构的冷却剂承载通道。 电子组件包括电子卡和一个或多个热传递板。 电子卡片包括要冷却的电子设备，并且一个或多个热转印板每个刚性地固定到电子卡的一个或多个电子设备。 每个热传递板是导热的并且将电子组件耦合到液冷冷轨，以将一个或多个电子设备热连接到液冷冷轨，以便电子设备的冷却。 在一个实施例中，电子组件包括多个交错电子卡和热转印板。

    COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN
    63.
    发明申请
    COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN 有权
    具有导热多孔材料的冷却装置和喷射喷嘴（S）延伸

    公开(公告)号：US20100328888A1

    公开(公告)日：2010-12-30

    申请号：US12491325

    申请日：2009-06-25

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： H05K7/20 ,  F28D15/00 ,  B21D53/02

    CPC分类号： H01L23/4735 ,  F28D15/0266 ,  F28F13/187 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.

    摘要翻译： 提供冷却装置和制造方法以便于电子装置的冷却。 冷却装置包括导热多孔材料和液体冷却剂供应。 导热多孔材料（例如金属泡沫材料）被耦合到要冷却的电子设备的表面，或耦合到电子设备的结构。 液体冷却剂供应包括喷射冲击结构，其包括用于将液体冷却剂引导到要冷却的表面上的一个或多个喷嘴。 喷射喷嘴延伸到导热多孔材料中，并且有助于将液体冷却剂输送到待冷却的表面上。 导热多孔材料与要冷却的表面热接触，并且通过沸腾通过多孔材料的液体冷却剂来促进电子器件的冷却。

    AUTO-LOCATING SYSTEM AND METHOD FOR DATA CENTER MAPPING AND MONITORING
    64.
    发明申请
    AUTO-LOCATING SYSTEM AND METHOD FOR DATA CENTER MAPPING AND MONITORING 失效
    自动定位系统和数据中心映射和监控方法

    公开(公告)号：US20090072967A1

    公开(公告)日：2009-03-19

    申请号：US11855185

    申请日：2007-09-14

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： H04Q7/00

    CPC分类号： G01S13/876

    摘要： Automated locating of electronics racks within a data center room is provided. The automated approach employs n wireless identification units associated with respective electronics racks of the data center, and first and second transceiver units positioned within the data center along a common plane at known X,Y locations. A monitor unit is in communication with the transceiver units, and automatically determines X,Y location within the data center room of each respective electronics rack employing, in part, first time differentials between transmission of a first broadcast signal by the first transceiver unit and receipt of response signals from the wireless identification units, second time differentials between transmission of a second broadcast signal from the second transceiver unit and receipt of response signals thereto from the wireless identification units, and the known X,Y locations within the data center of the transceiver units.

    摘要翻译： 提供数据中心室内电子机架的自动定位。 自动化方法采用与数据中心的相应电子机架相关联的n个无线识别单元，以及沿着已知X，Y位置处的公共平面定位在数据中心内的第一和第二收发器单元。 监视器单元与收发器单元通信，并且自动地确定每个相应电子机架的数据中心室内的X，Y位置，其部分地采用第一收发器单元发送第一广播信号和接收之间的第一时差 来自无线识别单元的响应信号，来自第二收发器单元的第二广播信号的传输和从无线识别单元接收的响应信号之间的第二时间差以及收发器的数据中心内的已知X，Y位置 单位。

    THERMAL RESISTANCE-BASED MONITORING OF COOLING OF AN ELECTRONIC COMPONENT
    65.
    发明申请
    THERMAL RESISTANCE-BASED MONITORING OF COOLING OF AN ELECTRONIC COMPONENT 有权
    电子元件的基于耐热性的冷却监测

    公开(公告)号：US20130128918A1

    公开(公告)日：2013-05-23

    申请号：US13300803

    申请日：2011-11-21

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： G01N25/00

    CPC分类号： H05K7/20836

    摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

    摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

    COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S)
    66.
    发明申请
    COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S) 有权
    具有单独可旋转的节气门部分的冷却液喷射（S）

    公开(公告)号：US20130107457A1

    公开(公告)日：2013-05-02

    申请号：US13281495

    申请日：2011-10-26

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

    IPC分类号： H05K7/20 ,  F28D7/10

    CPC分类号： H05K7/20272 ,  H05K7/2079 ,  Y10T29/4935 ,  Y10T29/49389

    摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

    摘要翻译： 提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。

    MULTI-RACK ASSEMBLY WITH SHARED COOLING UNIT
    67.
    发明申请
    MULTI-RACK ASSEMBLY WITH SHARED COOLING UNIT 有权
    具有共享冷却单元的多机架组件

    公开(公告)号：US20130105139A1

    公开(公告)日：2013-05-02

    申请号：US13285116

    申请日：2011-10-31

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： F28F27/00 ,  B21D53/02 ,  F28F13/00

    CPC分类号： H05K7/20263 ,  H05K7/20709 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

    摘要： A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

    摘要翻译： 提供了包括第一和第二电子机架的多机架组件。 第一电子机架包括设置在第一电子机架内的一个或多个冷却单元，其联接成与第一电子机架的主冷却剂回路流体连通，至少部分地将冷却的冷却剂提供给主冷却剂回路，并且促进 冷却一个或多个第一机架电子部件。 第二电子机架包括与布置在第一电子机架内的冷却单元流体连通的二次冷却剂回路。 多机架组件还包括控制器，用于将冷却的冷却剂自动地提供给二次冷却剂回路，并且其中控制器控制冷却的冷却剂从冷却单元到第二冷却剂回路的流动，这至少部分地取决于冷却 第一电子机架的要求。

    THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION METHOD FACILITATING COOLING OF AN ELECTRONIC COMPONENT
    70.
    发明申请
    THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION METHOD FACILITATING COOLING OF AN ELECTRONIC COMPONENT 有权
    热电增强型蒸汽压缩制冷方法，使电子元件冷却

    公开(公告)号：US20120210731A1

    公开(公告)日：2012-08-23

    申请号：US13451668

    申请日：2012-04-20

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： F25B21/02

    CPC分类号： F25B21/02 ,  F25B40/00 ,  H05K7/20836

    摘要： A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

    摘要翻译： 提供了一种便于冷却电子部件的方法。 该方法包括：提供构造成制冷剂流过环路的制冷剂回路; 联接压缩机与环路流体连通，其中环路的第一部分位于压缩机的制冷剂入口的上游，第二部分位于下游; 并配置可控热电阵列与制冷剂回路热连通。 热电阵列设置成与制冷剂回路的第一部分至少部分地与阵列的第一侧热接触，并且环的第二部分至少部分地与阵列的第二侧热接触。 控制阵列以确保进入压缩机的制冷剂回路中的制冷剂处于过热的热力学状态。