Semiconductor device with structured current spread region and method
    62.
    发明授权
    Semiconductor device with structured current spread region and method 有权
    具有结构电流扩散区域和方法的半导体器件

    公开(公告)号:US07772621B2

    公开(公告)日:2010-08-10

    申请号:US11858264

    申请日:2007-09-20

    IPC分类号: H01L29/78

    摘要: A semiconductor device with structured current spread region and method is disclosed. One embodiment provides a drift portion of a first conductivity type, a current spread portion of the first conductivity type and first portions of the first conductivity type. The current spread portion and the first portions are arranged in a first plane on the drift portion, wherein the current spread portion surrounds at least partially the first portions. The semiconductor body further includes spaced apart body regions of a second conductivity type which are arranged on the current spread portion. Further, the doping concentration of the current spread portion is higher than the doping concentrations of the drift portion and of the first portions.

    摘要翻译: 公开了一种具有结构化电流扩展区域和方法的半导体器件。 一个实施例提供第一导电类型的漂移部分,第一导电类型的电流扩展部分和第一导电类型的第一部分。 电流扩展部分和第一部分布置在漂移部分上的第一平面中,其中电流扩展部分至少部分地围绕第一部分。 半导体本体还包括布置在电流扩展部分上的间隔开的第二导电类型的主体区域。 此外,电流扩展部分的掺杂浓度高于漂移部分和第一部分的掺杂浓度。

    Semiconductor device and method for forming same
    63.
    发明授权
    Semiconductor device and method for forming same 有权
    半导体器件及其形成方法

    公开(公告)号:US07745273B2

    公开(公告)日:2010-06-29

    申请号:US11830542

    申请日:2007-07-30

    IPC分类号: H01L21/337 H01L21/425

    摘要: A method for manufacturing a semiconductor device. The method includes providing a semiconductor body of a conductivity type, wherein the semiconductor body comprises a first surface. At least one buried region of a second conductivity type is formed in the semiconductor body and at least a surface region of the second conductivity type is formed at the first surface of the semiconductor body, wherein the buried region and the surface region are formed such that they are spaced apart from each other. The buried region is formed by deep implantation of a first dopant of the second conductivity type.

    摘要翻译: 一种半导体器件的制造方法。 该方法包括提供导电类型的半导体本体,其中半导体主体包括第一表面。 在半导体本体中形成至少一个第二导电类型的掩埋区域,并且至少在第二导电类型的表面区域形成在半导体本体的第一表面处,其中形成掩埋区域和表面区域使得 它们彼此间隔开。 埋入区域通过深度注入第二导电类型的第一掺杂剂形成。

    Apparatus for controlling safety-critical processes
    66.
    发明授权
    Apparatus for controlling safety-critical processes 有权
    用于控制安全关键过程的装置

    公开(公告)号:US06832343B2

    公开(公告)日:2004-12-14

    申请号:US10072558

    申请日:2002-02-08

    IPC分类号: G06F1100

    CPC分类号: G05B9/03

    摘要: The present invention relates to an apparatus for controlling safety-critical processes. The apparatus includes at least one safe control unit for controlling the safety-critical processes and at least two safe signal units which are connected via I/O channels to the safety-critical processes. The safe control unit and the safe signal units are connected to a common fieldbus. The safe signal units communicate with the safe control unit, but not with one another, when the apparatus is in the control mode. The safe signal units have an evaluator for evaluating a fault message which is broadcasted across the fieldbus, as well as a switching device which autonomously change the safety-critical process to a safe state when a fault message which is evaluated as being relevant occurs.

    摘要翻译: 本发明涉及一种用于控制安全关键过程的装置。 该装置包括用于控制安全关键过程的至少一个安全控制单元和经由I / O通道连接到安全关键过程的至少两个安全信号单元。 安全控制单元和安全信号单元连接到公共现场总线。 当设备处于控制模式时,安全信号单元与安全控制单元通信,但彼此不通信。 安全信号单元具有用于评估跨现场总线广播的故障消息的评估器,以及当被评估为相关的故障消息发生时,将安全关键过程自主地改变为安全状态的交换设备。

    Electronic safety switching device and method
    67.
    发明授权
    Electronic safety switching device and method 有权
    电子安全开关装置及方法

    公开(公告)号:US06784571B2

    公开(公告)日:2004-08-31

    申请号:US10414795

    申请日:2003-04-16

    IPC分类号: B60Q1100

    CPC分类号: G05B9/03 H03K19/0075

    摘要: The present invention relates to an electronic safety switching device having at least a first and a second signal processing channel. The channels can be supplied with input signals for signal processing, and they provide redundantly processed output signals. According to one aspect of the invention, the signal processing channels are arranged monolithically on a common semiconductor substrate. The semiconductor structures of each signal processing channel are spaced apart physically by a multiple of their width from the semiconductor structures of every other signal processing channel.

    摘要翻译: 本发明涉及至少具有第一和第二信号处理通道的电子安全开关装置。 通道可以提供输入信号进行信号处理,并提供冗余处理的输出信号。 根据本发明的一个方面,信号处理通道单片地布置在公共半导体衬底上。 每个信号处理通道的半导体结构在物理上与其它信号处理通道的半导体结构的宽度的倍数隔开。

    Protection configuration for schottky diode
    68.
    发明授权
    Protection configuration for schottky diode 有权
    肖特基二极管的保护配置

    公开(公告)号:US06714397B2

    公开(公告)日:2004-03-30

    申请号:US10213419

    申请日:2002-08-05

    IPC分类号: H02H908

    摘要: A protection device for a Schottky diode is described. The protection device has a cascade circuit with at least two Si-PIN diodes provided parallel to the Schottky diode. The protection device protects against momentary over-current pulses reliably and without a high outlay in terms of cost and necessary materials for forming the protection device.

    摘要翻译: 描述了用于肖特基二极管的保护装置。 保护装置具有级联电路,其具有平行于肖特基二极管提供的至少两个Si-PIN二极管。 保护装置能够可靠地保护瞬时过电流脉冲,并且在成本方面没有高昂的费用和用于形成保护装置的必要材料。

    Process for the thermal annealing of implantation-doped silicon carbide semiconductors
    70.
    发明授权
    Process for the thermal annealing of implantation-doped silicon carbide semiconductors 失效
    注入掺杂碳化硅半导体的热退火工艺

    公开(公告)号:US06406983B1

    公开(公告)日:2002-06-18

    申请号:US09538797

    申请日:2000-03-30

    IPC分类号: H01L21265

    摘要: A process for the thermal annealing of implantation-doped silicon carbide semiconductors in a gas stream brings practically no carbon to the silicon carbide semiconductor. In one embodiment, a container, a carrier, radiation shields and a baseplate are composed of a metal or a metal compound such as, for example, tantalum or tantalum carbide, at least at locations which come into contact with the gas stream.

    摘要翻译: 用于气体流中注入掺杂碳化硅半导体的热退火的方法对碳化硅半导体几乎不产生碳。 在一个实施例中,至少在与气流接触的位置处,容器,载体,辐射屏蔽和基板由金属或金属化合物例如钽或碳化钽组成。