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89 条记录 (耗时 0.031 秒)

    Parts feeder
    61.
    发明申请
    Parts feeder 有权
    零件进料器

    公开(公告)号：US20060054656A1

    公开(公告)日：2006-03-16

    申请号：US10537406

    申请日：2003-11-28

    申请人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    发明人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    IPC分类号： B23Q15/00

    CPC分类号： H01L21/67144 ,  H01L21/67132

    摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

    摘要翻译： 根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作 通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

    Electronic component mounting apparatus
    62.
    发明授权
    Electronic component mounting apparatus 失效
    电子元件安装装置

    公开(公告)号：US06178621B2

    公开(公告)日：2001-01-30

    申请号：US09029627

    申请日：1998-04-23

    申请人： Satoshi Shida ,  Wataru Hirai ,  Muneyoshi Fujiwara ,  Hiroshi Ohta ,  Hirokazu Honkawa

    发明人： Satoshi Shida ,  Wataru Hirai ,  Muneyoshi Fujiwara ,  Hiroshi Ohta ,  Hirokazu Honkawa

    IPC分类号： H05K330

    CPC分类号： H05K13/0409 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

    摘要： By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

    摘要翻译： 通过减轻对电子元件的冲击负荷并大大提高负载范围，提高了对电子元器件的适应性，消除了人工操作，从而提高了生产效率，实现了无人操作。 真空夹紧喷嘴单元包括用于真空夹紧电子部件的可自动拆卸的真空夹紧喷嘴（2），用于将真空夹紧喷嘴（2）沿旋转方向和垂直方向定位的定位部分（3） 用于通过使用流体向下推动所述真空夹紧喷嘴（2）的推动部分（4），用于切换所述推动力的流体压力切换部分，用于切换所述真空夹紧喷嘴的作用力的正时的定时切换部分 以及用于将负载控制到期望负载的压力控制部。 可以在将电子部件安装在电子电路板上之前或之前进行推压力的定时切换。

    Light source
    64.
    发明授权
    Light source 有权
    光源

    公开(公告)号：US08410501B2

    公开(公告)日：2013-04-02

    申请号：US12519506

    申请日：2008-01-10

    申请人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    发明人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.

    摘要翻译： 限制荧光体中的热积聚的光源。 光源包括：基板5; 已经实现在基板5的主表面上的LED元件D21，D22，D23，D41，D42; 已经形成在其中没有实现任何LED元件D21，D22，D23，D41，D42的基板5的主表面的区域中的突起11; 以及在LED元件D21，D22，D23，D41，D42和突起11被密封构件7覆盖和密封的状态下在基板上形成的半透明密封构件7.密封构件7包括荧光体 将来自LED元件D21，D22，D23，D41，D42的光转换为预定颜色的光。 突起11的导热率高于密封部件7的导热率。

    Bulb-type lighting source
    65.
    发明授权
    Bulb-type lighting source 有权
    灯泡型照明源

    公开(公告)号：US08337049B2

    公开(公告)日：2012-12-25

    申请号：US12996523

    申请日：2009-06-30

    申请人： Satoshi Shida ,  Takaari Uemoto

    发明人： Satoshi Shida ,  Takaari Uemoto

    IPC分类号： F21V29/00

    CPC分类号： F21V3/02 ,  F21K9/23 ,  F21K9/233 ,  F21V3/061 ,  F21V3/062 ,  F21V23/002 ,  F21V29/713 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10

    摘要： A bulb-type lighting source employs a light-emitting element in a structure that facilitates heat dispersal. The lighting source includes a first heat sink member mounted in a bowl shaped case supporting a power supply circuit. A mounting substrate is positioned in surface contact with a surface of the heat sink member and is capable of supporting a light-emitting unit. A globe covers the light-emitting unit to permit light emission. A second heat sink member has a surface in contact with a perimeter of the mounting substrate and offset from the light-emitting unit to provide a second part in surface contact with the first heat member to facilitate the release of heat.

    摘要翻译： 灯泡式照明源采用促进散热的结构中的发光元件。 照明源包括安装在支撑电源电路的碗状壳体中的第一散热构件。 安装基板被定位成与散热构件的表面表面接触并且能够支撑发光单元。 地球覆盖发光单元以允许发光。 第二散热构件具有与安装基板的周边接触并与发光单元偏移的表面，以提供与第一加热构件表面接触的第二部分，以便于释放热量。

    Component feeder
    67.
    发明授权
    Component feeder 有权
    组件馈线

    公开(公告)号：US07731469B2

    公开(公告)日：2010-06-08

    申请号：US10537406

    申请日：2003-11-28

    申请人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    发明人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    IPC分类号： B65H1/00

    CPC分类号： H01L21/67144 ,  H01L21/67132

    摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

    摘要翻译： 根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作 通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

    LIGHT SOURCE
    68.
    发明申请
    LIGHT SOURCE 有权
    光源

    公开(公告)号：US20090321772A1

    公开(公告)日：2009-12-31

    申请号：US12519506

    申请日：2008-01-10

    申请人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    发明人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.

    摘要翻译： 限制荧光体中的热积聚的光源。 光源包括：基板5; 已经实现在基板5的主表面上的LED元件D21，D22，D23，D41，D42; 已经形成在其中没有实现任何LED元件D21，D22，D23，D41，D42的基板5的主表面的区域中的突起11; 以及在LED元件D21，D22，D23，D41，D42和突起11被密封构件7覆盖和密封的状态下在基板上形成的半透明密封构件7.密封构件7包括荧光体 将来自LED元件D21，D22，D23，D41，D42的光转换为预定颜色的光。 突起11的导热率高于密封部件7的导热率。