Amorphous, fine silica particles, and method for their production and their use
    62.
    发明授权
    Amorphous, fine silica particles, and method for their production and their use 失效
    无定形,细二氧化硅颗粒及其制备方法及其用途

    公开(公告)号:US07083770B2

    公开(公告)日:2006-08-01

    申请号:US10049902

    申请日:2001-06-20

    IPC分类号: C01B33/18 C08K3/36

    摘要: The amorphous-silica particle having 0.1–0.7 μm of the average particle diameter, 5–30 m2/g of the specific surface area, less than 40% of the dispersion coefficient, and 20 μC/m2 of the absolute value of the triboelectrostatic charge, can be obtained, by setting flame temperature to more than melting point of silica, raising the silica concentration in a flame, and staying the generated silica particle in the flame for a short time to be grew up. Since this silica particle has a particle shape being near a true sphere, and a particle size of said particle is remarkably uniform, so it is suitable for a filler of a semiconductor sealing agent or various materials, etc. In addition, since said particle has strong electrification, it is also suitable for an outer or an inner additional agent of a toner for an electronic photograph, a photo conductor material for a electronic photograph, and a material of an electric charge transportation layer, etc.

    摘要翻译: 平均粒径为0.1-0.7μm,比表面积为5-30m 2 / g,分散系数小于40%的非晶二氧化硅颗粒和20μm/ m 2 通过将火焰温度设定为大于二氧化硅的熔点,提高火焰中的二氧化硅浓度,并将所产生的二氧化硅粒子停留在火焰中,可以获得摩擦电沉积电荷的绝对值的“2” 在短时间内长大。 由于该二氧化硅粒子具有接近真实球体的粒子形状,并且所述粒子的粒径非常均匀,因此适合于半导体密封剂或各种材料等的填料。此外,由于所述粒子具有 强电气化,也适用于电子照相用调色剂的外部或内部附加剂,电子照相用光导体材料和电荷输送层的材料等。

    Layered product and capacitor
    65.
    发明授权
    Layered product and capacitor 失效
    分层产品和电容器

    公开(公告)号:US06879481B2

    公开(公告)日:2005-04-12

    申请号:US10117249

    申请日:2002-04-05

    IPC分类号: H01G4/06 H01G4/228 H01G4/30

    CPC分类号: H01G4/30

    摘要: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 μm or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 μm or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

    摘要翻译: 包括多个沉积单元的分层产品,每个沉积单元包括薄树脂层和薄金属层,其中薄树脂层的表面粗糙度为0.1μm或更小,突起形成组分不添加到薄树脂层或 薄金属层的表面粗糙度为0.1μm以下。 无论层叠体的厚度如何,表面特性均有所提高,因层叠体不含异物,能够满足高性能薄膜的要求。 层叠体适用于电子部件,例如电容器,特别是片状电容器。

    Layered product and capacitor
    67.
    发明授权

    公开(公告)号:US06721165B2

    公开(公告)日:2004-04-13

    申请号:US10117249

    申请日:2002-04-05

    IPC分类号: H01G406

    摘要: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

    Layered product and capacitor
    68.
    发明授权

    公开(公告)号:US06611420B2

    公开(公告)日:2003-08-26

    申请号:US10138228

    申请日:2002-05-01

    IPC分类号: H01G406

    CPC分类号: H01G4/30

    摘要: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

    Method for manufacturing a layered product

    公开(公告)号:US06270832B1

    公开(公告)日:2001-08-07

    申请号:US09257109

    申请日:1999-02-25

    IPC分类号: C23C1430

    摘要: Before forming resin layers and metal thin film layers on a rotating supporting base, a belt-shaped object is run over the supporting base to remove foreign particles adhering to the supporting base. After a resin layer and a metal thin film layer are formed on the belt-shaped object and their formation conditions are optimized, the belt-shaped object is removed, and subsequently a layered product is formed on the supporting base. Thus, foreign objects adhering to the supporting base can be removed, and resin layers and metal thin film layers can be formed as desired.