Abstract:
An along-track alignment and formatting system (ATAFS) formats synthetic aperture radar (SAR) data to align and format signals from scatterers in a scene to achieve an ideal data format in the along-track dimension in which such ideal data format leads to improved image quality of an image based on the SAR data and/or reduced computational burden for generating an image based on the SAR data. Two aspects of the ATAFS include: 1) the division of data stabilization into two distinct steps; and 2) the along-track (or slow-time) migration of signal support of scatterers as a function of their along-track location. A suite of SAR image formation algorithms use the ATAFS in conjunction with conventional signal processing stages to transform input coherent signal data into a complex image with image quality and geometric accuracy commensurate with the inherent information content of the input data.
Abstract:
A fluid conduit is provided for use in a hydraulic actuating system for controlling an instrumentality disposed on a rotating portion of a machine. The fluid conduit transports pressurized fluid between a fluid source disposed on a non-rotating portion of the machine and the instrumentality and comprises a rigid tubular member formed in the shape of a helix having at least about 2 revolutions and a non-constant pitch length. The ends of the tube are adapted to be sealingly connected between the fluid source and the instrumentality. The fluid conduit is used, for example, in an apparatus and system for controlling a hydraulic actuator mounted on a rotating blade.
Abstract:
The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board.
Abstract:
A channel in a telemetry system is described. The channel includes a sample-and-hold circuit, a variable resistor circuit, and a control element. The sample-and-hold circuit is configured to hold a sample of a signal. The variable resistor circuit is communicatively coupled to the sample-and-hold circuit, and is configured to present a variable impedance to one or more signal lines during a time period designated for the channel. The variable impedance is representative of the sample held by the sample-and-hold circuit. The control element is configured to control the variable resistor circuit to present to the one or more signal lines an open circuit equivalent impedance during times other than the time period designated for the channel.
Abstract:
A system and method for rotating a source image by a first non-zero angle is provided. The method includes: defining a template for the source image, the template representing a rotation of the source image about an axis of the source image by second angle, where the second angle is the negative of the first non-zero angle; determining overlap between the template and the source image; separating the template into a plurality of strips covering at least the area of overlap; and for each strip: indentifying an initial pixel in the source image within the strip and storing the image data of the initial pixel; storing the image data of all remaining pixels within both the strip and the overlap in a database format in which the all remaining pixels is defined by a Y and X offset from the initial pixel.
Abstract:
A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.
Abstract:
An interferometer and method for interferometric analysis are provided. The methodology includes generating first and second light beams from a light source, interacting the first light beam with an object under inspection, forming, from light emanating from the object under inspection in response to the interacting, an image of the light source on an image sensor, projecting the second light beam on the image on the image sensor, the combination of the light emanating from the object under inspection and the second light beam forming a collective image on the image sensor, applying a Fourier transform to the collective image formed on the image sensor, thereby forming a phase image, and isolating a wavefront map of the object under inspection from within the phase image.
Abstract:
The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board.
Abstract:
A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above the polyimide layer to define caps, removing portions of the copper layer to form conductive pads, and filling gaps between the conductive pads with an insulator, wherein individual conductive pads are in electrical contact with corresponding individual caps.
Abstract:
A system and method of implementing quantum key distribution are provided that possess increased data rates and enhanced security. These increased data rates are provided through the use of biphotons. Through encoding bits of information on the intra-biphoton delay time and enabling separate polarization bases for each of the photons comprising each biphoton, the system and method increase data bandwidth available for quantum key distribution.