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    LASER REFLOW METHOD
    61.
    发明公开
    LASER REFLOW METHOD 审中-公开

    公开(公告)号：US20230256546A1

    公开(公告)日：2023-08-17

    申请号：US18162466

    申请日：2023-01-31

    Applicant: DISCO CORPORATION

    Inventor： Teppei NOMURA ,  Yuki IKKU ,  Zhiwen CHEN

    IPC: B23K26/57 ,  B23K26/046 ,  H01L23/00

    CPC classification number: B23K26/57 ,  B23K26/046 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75263 ,  H01L2224/81224

    Abstract: A laser reflow method includes a preparation step of preparing a workpiece including a board and semiconductor chips that each have bumps formed on one surface thereof and are placed on the board with the bumps interposed therebetween and a laser beam irradiation step of irradiating the semiconductor chips with a laser beam from a side of another surface opposite to the one surface, thereby reflowing bumps formed within an irradiated area of the workpiece. In the laser beam irradiation step, the irradiation with the laser beam is carried out while an irradiation range of the laser beam is changed in stages from a region including an outer peripheral portion of the irradiated area toward a region including a central portion of the irradiated area.

    PROCESSING SYSTEM
    62.
    发明公开
    PROCESSING SYSTEM 审中-公开

    公开(公告)号：US20230256537A1

    公开(公告)日：2023-08-17

    申请号：US18017936

    申请日：2020-07-29

    Applicant: NIKON CORPORATION

    Inventor： Shinji SATO

    IPC: B23K26/08 ,  B25J9/16 ,  B25J13/08 ,  B23K26/046 ,  B23K26/03 ,  G05B15/02

    CPC classification number: B23K26/0884 ,  B25J9/1697 ,  B25J9/1679 ,  B25J13/088 ,  B23K26/046 ,  B23K26/032 ,  G05B15/02

    Abstract: A processing system, which processes an object by irradiating the object with a processing light through an irradiation optical system, includes: an irradiation apparatus including at least a terminal optical element of the irradiation optical system; a movement apparatus that moves the irradiation apparatus; a first measurement apparatus that is disposed at the irradiation apparatus and measures a position of the object; a second measurement apparatus that measures the position of the object through at least the terminal optical element; and a third measurement apparatus that emits, from a position which is away from the irradiation apparatus, a measurement light toward the irradiation apparatus and measures the position of the irradiation apparatus by detecting the measurement light.

    LASER PROCESSING HEAD HAVING WIDE RANGE ZOOM
    63.
    发明公开
    LASER PROCESSING HEAD HAVING WIDE RANGE ZOOM 审中-公开

    公开(公告)号：US20230226640A1

    公开(公告)日：2023-07-20

    申请号：US17579917

    申请日：2022-01-20

    Applicant: II-VI Delaware, Inc.

    Inventor： Axel Heinrici

    IPC: B23K26/06 ,  G02B27/30 ,  B23K26/046

    CPC classification number: B23K26/0648 ,  G02B27/30 ,  B23K26/046

    Abstract: A laser processing head directs laser energy along an optical axis from a fiber to perform brazing or welding operations. A collimating stage collimates a diverging beam of the laser energy from the fiber into a collimated beam, and a focusing stage focuses the collimated beam into a converging beam to a focus spot for the desired operation. At least one of the stages has a changeable effective focal length for zoom functionality. A freeform refractive optic can be positioned in at least one of the diverging and collimated beams. For example, a freeform refractive optic in a first position is placed out of the diverging beam. However, the freeform refractive optic in a second position placed in the diverging beam can field map or intensity map the diverging beam to produce the mapped diverging beam, which increases an image of the fiber tip to the collimating stage.

    METHOD AND SYSTEM FOR LASER WELDING OF A SEMICONDUCTOR MATERIAL
    65.
    发明申请
    METHOD AND SYSTEM FOR LASER WELDING OF A SEMICONDUCTOR MATERIAL 有权

    公开(公告)号：US20230129245A1

    公开(公告)日：2023-04-27

    申请号：US18010550

    申请日：2021-06-15

    Applicant: Friedrich-Schiller-Universität Jena ,  Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

    Inventor： Maxime CHAMBONNEAU ,  Stefan NOLTE ,  Qingfeng LI

    IPC: B23K26/21 ,  B23K26/046

    Abstract: The invention relates to a method for welding a first workpiece (11) to a second workpiece (12) by means of a laser. It is an object of the invention to provide a reliable, repeatable and reproducible approach for laser welding of two workpieces one of which consists of a semiconductor material. The method proposed by the invention comprises the following steps: Irradiating the first workpiece (11) with a beam of pulsed laser radiation, wherein the first workpiece (11) consists of a semiconductor material which is transparent at the wavelength of the laser radiation, so that the beam enters the first workpiece (11) through an entrance surface and leaves it through an exit surface, the geometric focus of the beam being positioned in the plane of the exit surface; determining a delocalization of the focus caused by nonlinear interaction of the laser radiation with the semiconductor material; placing the second workpiece (12) against the first workpiece (11); and, again, irradiating the first workpiece (11) with the laser beam of pulsed laser radiation, the focus of the laser radiation being positioned along the beam direction taking into account the determined delocalization so that the intensity maximum is located in the plane of the exit surface forming the interface of the two workpieces (11, 12), whereby the first workpiece (11) is welded to the second workpiece (12). Moreover, the invention relates to a system for welding a first workpiece (11) to a second workpiece (12).

    Surface texturing using energy pulses
    67.
    发明授权
    Surface texturing using energy pulses 有权

    公开(公告)号：US11548092B2

    公开(公告)日：2023-01-10

    申请号：US16353119

    申请日：2019-03-14

    Applicant: Medtronic, Inc.

    Inventor： Xiangnan He ,  David A. Ruben

    IPC: B23K26/0622 ,  B23K26/046 ,  B23K26/352 ,  B23K26/122 ,  B23K26/12 ,  B23K26/082 ,  A61N1/04

    Abstract: A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

    LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD
    68.
    发明申请
    LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD 有权

    公开(公告)号：US20220390757A1

    公开(公告)日：2022-12-08

    申请号：US17779300

    申请日：2020-11-20

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Yotaro WANI ,  Yasunori IGASAKI

    IPC: G02B27/28 ,  B23K26/53 ,  B23K26/046

    Abstract: There is provided a laser processing device that performs laser processing on an object made of a birefringent material, the device including: a light source that outputs laser light; a spatial light modulator that modulates the laser light output from the light source; a focusing lens that focuses the laser light toward the object; and a polarized light component control unit that is a function of the spatial light modulator to control polarized light components of the laser light such that the laser light is focused on one point in the object in a Z direction (optical axis direction).

    LASER PROCESSING DEVICE, AND METHOD FOR MANUFACTURING CHIP
    69.
    发明申请
    LASER PROCESSING DEVICE, AND METHOD FOR MANUFACTURING CHIP 有权

    公开(公告)号：US20220371130A1

    公开(公告)日：2022-11-24

    申请号：US17763379

    申请日：2020-08-07

    Applicant: NICHIA CORPORATION ,  HAMAMATSU PHOTONICS K.K.

    Inventor： Hiroaki TAMEMOTO ,  Minoru YAMAMOTO ,  Yusuke SEKIMOTO ,  Ryota SUGIO ,  Tominori NAKAMURA

    IPC: B23K26/53 ,  B23K26/046 ,  B23K26/0622

    Abstract: This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an in-axis direction of the sapphire substrate.

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