摘要:
An optical multilayer filter having an inorganic thin film composed of a plurality of layers on a substrate includes a fluorinated organic silicon compound film formed on a surface of the inorganic thin film, a low-density formation section forming a part of the inorganic thin film, having one or more layers including the most superficial layer of the inorganic thin film, the one or more layers being formed of at least one of a low-density titanium oxide layer and a low-density silicon oxide layer, and a high-density formation section forming another part of the inorganic thin film, disposed between the low-density formation section and the substrate, having silicon oxide layers with a density higher than the low-density silicon oxide layer and titanium oxide layers with a density higher than the low-density titanium oxide layer in a stacked manner. A total thickness of the low-density formation section is equal to or smaller than 280 nm.
摘要:
A piezoelectric oscillator includes: a piezoelectric resonator; an oscillation circuit including a variable resistance circuit and a transistor for oscillation; a constant current circuit, the constant current circuit including a first current mirror circuit, and a current control circuit having an output terminal and controlling a current flowing in the first current circuit so as to enable an output current of the constant current circuit to be adjusted, the output terminal of the first current mirror circuit being coupled to at least one of a collector and a base of the transistor for oscillation with the variable resistance circuit; and a control circuit coupled to the current control circuit and the variable resistance circuit, the control circuit controlling the current control circuit and a resistance value of the variable resistance circuit.
摘要:
A laminated wave plate that corresponds to a plurality of wavelengths including at least two wavelengths of λA and λB, and includes a first wave plate disposed on an incident side and a second wave plate disposed on an emitting side, the first wave plate and the second wave plate being laminated in such a manner that their optical axes are intersected each other, includes the following equations from (1) to (5): ΓA1=360°+360°×2NA (1); ΓA2=180°+360°×NA (2); ΓB1=360°×2NB (3); ΓB2=360°×NB (4); and NB=(ΔnB/ΔnA)×(λA/λB)×(0.5+NA) (5), in which ΓA1 is a phase difference of the wavelength λA at the first wave plate, ΓA2 is a phase difference of the wavelength λA at the second wave plate, ΓB1 is a phase difference of the wavelength λB at the first wave plate, ΓB2 is a phase difference of the wavelength λB at the second wave plate, θ1 is an in-plane azimuth of the first wave plate, θ2 is an in-plane azimuth of the second wave plate, ΔnA is a birefringent difference that is a difference (neA−noA) between a normal ray refractive index noA and an abnormal ray refractive index neA of the wavelength λA, and ΔnB is a birefringent difference that is a difference (neB−noB) between a normal ray refractive index noB and an abnormal ray refractive index neB of the wavelength λB, under conditions of θ1=−21°, and θ2=45°.
摘要:
An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.
摘要:
[Problem to be Solved]A piezoelectric device is provided in which, when the piezoelectric device is miniaturized, drive level characteristics are favorable, stress does not remain in a bonding portion of a housing body, and a factor causing deterioration of characteristics does not remain.[Solution]A piezoelectric device includes a base substrate 54, a resonator element 55 with a frame, and a lid 56 layered over and fixed to the resonator element with a frame, in which the base substrate, the resonator element with a frame, and the lid are all formed from a same material. The resonator element 55 with a frame includes a resonator element main body 32 and a frame section 53. Each bonding surface bonding the base substrate, the resonator element with a frame, and the lid is bonded by surface activation bonding and hermetically sealed. An electrode for driving of the resonator element main body 32 is routed to the frame section as an extraction electrode. As a result of bonding, the extraction electrode of the frame section is electrically connected to a mounting electrode serving as an external terminal provided on the base substrate, via a conductive pattern formed on the bonding surface of the base substrate.
摘要:
A piezoelectric oscillator includes: a package including a first recessed portion formed on a first surface, a second recessed portion formed on a second surface with at least a part of a side surface being open, and a conductor wired from at least one of an inside surface of the first recessed portion and an inside surface of the second recessed portion to an outside surface; a piezoelectric element accommodated in the first recessed portion; a lid being in contact with the first surface and air-tightly sealing the first recessed portion; a circuit element accommodated in the second recessed portion and connected with the conductor; a resin portion formed in the second recessed portion to cover the circuit element; and an electrical check terminal connected with the conductor of the package.
摘要:
A piezoelectric device includes a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a side surface and a bottom surface thereof, a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package, an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element, an external electrode formed on a bottom surface of the resin portion, and a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode on the resin portion.
摘要:
A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.
摘要:
A SAW chip (11) where ones are balanced signal terminals and the others are unbalanced signal terminals is mounted on a mounting board (12) in a flip chip manner, and the mounting board (12) and a surface of the SAW chip are covered with resin (19). At that time, grounds of first and second SAW filters (1, 2) in the SAW chip (11) are connected together and an annular pattern (14) is formed so as to surround a signal pattern of the SAW chip (11) on the mounting board (12) on which the SAW chip (11) is mounted, and the annular electrode (14) is connected to a ground pattern.
摘要:
A frequency stability measuring apparatus for measuring a frequency fluctuation of a signal outputted from a given signal source includes: a reference signal output unit that outputs a reference frequency signal; a mixer that mixes a signal outputted from the signal source with the reference frequency signal outputted from the reference signal output unit and outputs a resultant signal; a filter that allows a low-frequency component of the signal outputted from the mixer to pass therethrough; a waveform-shaping circuit that shapes a waveform of a signal outputted from the filter; a counter that counts a number of pulses of a signal shaped by the waveform-shaping circuit; and a control unit that calculates average frequencies of the signal outputted from the filter within respective measurement periods of a predetermined length, and calculates and outputs a standard deviation of the average frequencies calculated