公开(公告)号：US11385196B2

公开(公告)日：2022-07-12

申请号：US15695557

申请日：2017-09-05

Applicant: Brewer Science Inc.

Inventor： Ryan E. Giedd ,  Jonathan J. Fury ,  Erik Harker ,  Christopher Landorf

IPC: G01N27/14 ,  G01N27/12 ,  G01N33/00

Abstract: A process and electronic hardware and software system for rapidly heating and cooling an active sensing layer of a gas sensor is provided. A series of high-energy pulses is run through a CNT electrically-active layer, heating the layer to varying temperatures. The influence by various gases on the electrical conductivity of the layer can be used to identify gases (e.g., water vapor, alcohol, methane, O2, CO2, and CO). Advantageously, the same structure can also be used as a nanoheater, either within or outside the context of the gas sensor. The device can acquire a unique gas spectra in seconds, and thus accurately determine gas type and mixtures of gases based on a library of known spectra.

公开(公告)号：US20210082683A1

公开(公告)日：2021-03-18

申请号：US16865159

申请日：2020-05-01

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  C09D133/16 ,  H01L23/29 ,  H01L23/31

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.

公开(公告)号：US10770813B2

公开(公告)日：2020-09-08

申请号：US16045241

申请日：2018-07-25

Applicant: Brewer Science, Inc.

Inventor： William J. Stone ,  Joseph Demster ,  Robert Christian Cox ,  Alex Bruce Johnson ,  Louis McCarthy

IPC: H01R13/502 ,  H01R12/59 ,  H01R12/53 ,  H01R13/52 ,  H01R12/65

Abstract: An environmentally sealed connector for connecting a spring-loaded terminal to a flexible circuit includes a spring-loaded terminal and a connector cap having a terminal cavity receiving a portion of the spring-loaded terminal therein in order to electrically couple the spring-loaded terminal to the flexible circuit. A connector base is releasably coupled to the connector cap and covers the terminal cavity and the portion of the spring-loaded terminal therein. An elastic member is disposed between the connector cap and the connector base in sealing engagement therewith and surrounds the terminal cavity and the portion of the spring-loaded terminal.

公开(公告)号：US10734239B2

公开(公告)日：2020-08-04

申请号：US15909751

申请日：2018-03-01

Applicant: Brewer Science, Inc.

Inventor： Kui Xu

IPC: H01L21/308 ,  H01L21/311 ,  H01L21/027 ,  C08F12/08 ,  C08F220/14 ,  C08G81/02 ,  H01L21/3213 ,  C08F293/00 ,  C08F2/38

Abstract: Directed self-assembly (DSA) using block copolymers (BCPs) is emerging as a viable alternative to photolithography for creating features 10 nm and smaller. Block copolymers with balanced surface energy between the polymer blocks, tunable χ, and tunable glass transition temperatures (Tg) have been formulated. The block copolymers can achieve perpendicular orientation by simple thermal annealing due to the surface energy balance between the polymer blocks, which allows avoiding solvent annealing or top-coat. The χ value can be tuned up to achieve L0 as low as 12 nm for lamellar-structured BCPs and hole/pillar size as small as 6 nm for cylinder-structured BCPs. The Tg of the BCPs can also be tuned to lower than those of PS-b-PMMA standards. The enhanced polymer chain mobility resulting from the decreased Tg of the block copolymer may help with improving the kinetics of BCP self-assembly during the thermal annealing.

公开(公告)号：US10421878B2

公开(公告)日：2019-09-24

申请号：US14599103

申请日：2015-01-16

Applicant: Brewer Science Inc.

Inventor： Kui Xu ,  Mary Ann Hockey ,  Eric Calderas

IPC: C09D153/00 ,  C08F293/00 ,  G03F7/00

Abstract: Compositions for directed self-assembly (DSA) patterning techniques are provided. Methods for directed self-assembly are also provided in which a DSA composition comprising a block copolymer (BCP) is applied to a substrate and then self-assembled to form the desired pattern. The block copolymer includes at least two blocks and is selected to have a high interaction parameter (χ). The BCPs are able to form perpendicular lamellae by simple thermal annealing on a neutralized substrate, without a top coat. The BCPs are also capable of micro-phase separating into lines and spaces measuring at 10 nm or smaller, with sub-20-nm L0 capability.

公开(公告)号：US10329451B2

公开(公告)日：2019-06-25

申请号：US14968058

申请日：2015-12-14

Applicant: Brewer Science Inc.

Inventor： Robert Christian Cox ,  Raymond Devaughn

IPC: C09D5/33 ,  C08G73/06 ,  C08G75/025 ,  C09D179/04 ,  C09D181/02 ,  C08G75/0227

Abstract: Novel hyper-branched, dense, high-refractive-index polymers, and compositions utilizing those polymers are provided, along with methods of forming high refractive index films with those compositions. The refractive index of the material is at least about 1.8 at 400 nm. Further, it can be made into optically transparent thin films of only a couple hundred angstroms thickness to thick films of several micrometers thick, as well as into “bulk” solids. The use of a thermal acid or a photo acid generator facilitates crosslinking after the coating process.

公开(公告)号：US20190036246A1

公开(公告)日：2019-01-31

申请号：US16045241

申请日：2018-07-25

Applicant: Brewer Science, Inc.

Inventor： William J. Stone ,  Joseph Demster ,  Robert Christian Cox ,  Alex Bruce Johnson ,  Louis McCarthy

IPC: H01R12/59 ,  H01R13/52 ,  H01R12/53

CPC classification number: H01R12/592 ,  H01R12/53 ,  H01R12/65 ,  H01R13/521 ,  H01R13/5219

Abstract: An environmentally sealed connector for connecting a spring-loaded terminal to a flexible circuit includes a spring-loaded terminal and a connector cap having a terminal cavity receiving a portion of the spring-loaded terminal therein in order to electrically couple the spring-loaded terminal to the flexible circuit. A connector base is releasably coupled to the connector cap and covers the terminal cavity and the portion of the spring-loaded terminal therein. An elastic member is disposed between the connector cap and the connector base in sealing engagement therewith and surrounds the terminal cavity and the portion of the spring-loaded terminal.

公开(公告)号：US20180254189A1

公开(公告)日：2018-09-06

申请号：US15909751

申请日：2018-03-01

Applicant: Brewer Science, Inc.

Inventor： Kui Xu

IPC: H01L21/308 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/027 ,  C08F12/08 ,  C08F220/14 ,  C08G81/02

Abstract: Directed self-assembly (DSA) using block copolymers (BCPs) is emerging as a viable alternative to photolithography for creating features 10 nm and smaller. Block copolymers with balanced surface energy between the polymer blocks, tunable χ, and tunable glass transition temperatures (Tg) have been formulated. The block copolymers can achieve perpendicular orientation by simple thermal annealing due to the surface energy balance between the polymer blocks, which allows avoiding solvent annealing or top-coat. The χ value can be tuned up to achieve L0 as low as 12 nm for lamellar-structured BCPs and hole/pillar size as small as 6 nm for cylinder-structured BCPs. The Tg of the BCPs can also be tuned to lower than those of PS-b-PMMA standards. The enhanced polymer chain mobility resulting from the decreased Tg of the block copolymer may help with improving the kinetics of BCP self-assembly during the thermal annealing.

公开(公告)号：US20180163003A1

公开(公告)日：2018-06-14

申请号：US15841472

申请日：2017-12-14

Applicant: Brewer Science Inc.

Inventor： Daniel Sweat ,  Kui Xu

IPC: C08G81/02 ,  C08F293/00 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  C08L87/00 ,  H01L21/027

Abstract: The present invention is broadly concerned with novel directed self-assembly compositions, processes utilizing those compositions, and the resulting structures that are formed. The composition comprises a block copolymer of polystyrene and a polymethylmethacrylate block with polylactic acid side chains (“PS-b-P(MMA-LA)”). The block copolymer is capable of crosslinking and micro-phase separating into lines and spaces measuring about 10-nm or smaller with sub-20 nm L0 capability. Additionally, PS-b-P(MMA-LA) can be thermally annealed without a top-coat for simpler processing than the prior art. The polylactic acid side chains also increase the etch rate of the poly(methylmethacrylate) block when exposed to oxygen plasma, as well as lower the Tg.

公开(公告)号：US09865490B2

公开(公告)日：2018-01-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andrew Wong

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/50 ,  C08G77/14 ,  C08G77/20 ,  C08G77/18 ,  C08G77/26 ,  C09J145/00 ,  C09J183/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  C09J5/06

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.