公开(公告)号：US07417525B2

公开(公告)日：2008-08-26

申请号：US11416311

申请日：2006-05-03

Applicant: Moon Chul Lee ,  Jong Oh Kwon ,  Woon Bae Kim ,  Jun Sik Hwang ,  Chang youl Moon ,  In Sang Song

Inventor： Moon Chul Lee ,  Jong Oh Kwon ,  Woon Bae Kim ,  Jun Sik Hwang ,  Chang youl Moon ,  In Sang Song

IPC: H01F5/00 ,  H01F27/02

CPC classification number: H01F17/0033 ,  H01F41/041 ,  H01F2017/002 ,  H01L27/08 ,  H01L28/10

Abstract: An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.

Abstract translation: 提供一种电感器，其包括垂直通过基板的多个通孔，该基板具有绝缘性能，填充该通孔的垂直导电部分以及连接该基板顶部和底部上的各个垂直导电部分的水平导电部分 以形成具有垂直导电部分的单个线圈结构。

公开(公告)号：US20080131175A1

公开(公告)日：2008-06-05

申请号：US11783973

申请日：2007-04-13

Applicant: Su Ho Shin ,  Kyu Ho Shin ,  Chang Youl Moon ,  Eung Yeoul Yoon ,  Jin Seung Choi ,  Ki Hwan Kwon

Inventor： Su Ho Shin ,  Kyu Ho Shin ,  Chang Youl Moon ,  Eung Yeoul Yoon ,  Jin Seung Choi ,  Ki Hwan Kwon

IPC: G03G15/20

CPC classification number: G03G15/348 ,  G03G2217/0075

Abstract: An image forming element includes an image drum including a plurality of ring electrodes and a slot. The plurality of ring electrodes are formed to be spaced apart from one another on a circumference of the image drum. The slot is formed in a longitudinal direction on the image drum. A connecting member includes a plurality of connecting electrodes and is disposed inside the image drum so that an end of the connecting member is received in the slot. The connecting electrodes are electrically connected with the ring electrodes one to one on the same line.

Abstract translation: 图像形成元件包括包括多个环形电极和狭槽的图像鼓。 多个环形电极形成为在图像鼓的圆周上彼此间隔开。 狭槽在图像鼓上沿纵向方向形成。 连接构件包括多个连接电极，并且设置在图像鼓内部，使得连接构件的端部容纳在狭槽中。 连接电极在同一条线上一对一地与环形电极电连接。

公开(公告)号：US20080037226A1

公开(公告)日：2008-02-14

申请号：US11651064

申请日：2007-01-09

Applicant: Su-ho Shin ,  Kyu-ho Shin ,  Chang-youl Moon

Inventor： Su-ho Shin ,  Kyu-ho Shin ,  Chang-youl Moon

IPC: H05K7/20

CPC classification number: F21V29/74 ,  F21K9/00 ,  F21V29/004 ,  F21V29/71 ,  F21V29/713 ,  F21V29/767 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/648 ,  Y10S362/80

Abstract: A lighting device is provided. The lighting device includes a light source, a light source supporting member which has a surface to which the light source is attached, and a heat sink on an opposite surface of the light source supporting member, for dissipating heat generated by the light source. In addition, the heat sink includes a heat transfer member which protrudes from the surface of the light source supporting member; a plurality of first fins which are spaced apart from each other at intervals in a length direction of the heat transfer member, and are arranged parallel to the light source supporting member; and a plurality of second fins which are spaced apart from each other at intervals, surround outer portions of the first fins, and are arranged perpendicularly to the light source supporting member.

Abstract translation: 提供照明装置。 照明装置包括光源，具有安装有光源的表面的光源支撑构件和在光源支撑构件的相对表面上的散热器，用于散发由光源产生的热量。 此外，散热器包括从光源支撑构件的表面突出的传热构件; 多个第一翅片，它们在传热构件的长度方向上间隔开并且平行于光源支撑构件布置; 以及间隔地间隔开的多个第二散热片，围绕第一散热片的外部部分，并且与光源支撑部件垂直地配置。

公开(公告)号：US20070096227A1

公开(公告)日：2007-05-03

申请号：US11415099

申请日：2006-05-02

Applicant: Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

Inventor： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

IPC: H01L29/84

CPC classification number: H03H9/1092

Abstract: A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

Abstract translation: 用于声表面波器件的晶片级封装及其制造方法包括在器件晶片的上表面上形成有SAW元件的SAW器件; 接合在所述SAW元件的上部的盖晶片; 在所述盖晶片和所述SAW器件之间容纳所述SAW元件的空腔部; 帽盖，形成在盖晶片的上表面上; 以及金属线，其形成为穿透盖晶片以电连接帽垫和SAW元件，器件晶片和盖晶片由相同的材料制成。

公开(公告)号：US20070085195A1

公开(公告)日：2007-04-19

申请号：US11365838

申请日：2006-03-02

Applicant: Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

Inventor： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

IPC: H01L23/12

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L21/4817 ,  H01L21/50 ,  H01L2924/16235

Abstract: A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.

Abstract translation: 提供了一种用于在其上覆盖器件晶片的晶片级封装盖及其制造方法。 该方法包括在晶片上形成多个连接槽的操作，在连接槽上形成种子层，通过用金属材料填充连接槽来形成连接部分，在晶片的顶表面上形成电极盖 连接到连接部分，将支撑膜与其上形成有盖垫的晶片的顶表面接合，在晶片的底表面上形成空腔，以通过空腔露出连接部分，并在其上形成金属线 晶片的底表面电连接到连接部分。

公开(公告)号：US20060279949A1

公开(公告)日：2006-12-14

申请号：US11405567

申请日：2006-04-18

Applicant: Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

Inventor： Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

IPC: F21V5/04 ,  H01L33/00 ,  H01S4/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

公开(公告)号：US20060138579A1

公开(公告)日：2006-06-29

申请号：US11282045

申请日：2005-11-18

Applicant: Kyu-ho Shin ,  Chang-youl Moon ,  Arthur Darbinian

Inventor： Kyu-ho Shin ,  Chang-youl Moon ,  Arthur Darbinian

IPC: H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00

Abstract: An image sensor package and a solid state imaging device. The image sensor package includes an image sensor having an image sensor and connection pads on a wafer. A transparent plate is attached to the upper surface of the image sensor chip via an adhesive. The connection pads include connectors, and the image sensor package exchanges signals with a main board of the solid image device through the connectors.

Abstract translation: 图像传感器封装和固态成像装置。 图像传感器封装包括具有图像传感器和晶片上的连接焊盘的图像传感器。 透明板通过粘合剂附着到图像传感器芯片的上表面。 连接垫包括连接器，并且图像传感器封装通过连接器与固体图像器件的主板交换信号。

公开(公告)号：US20060056161A1

公开(公告)日：2006-03-16

申请号：US11221935

申请日：2005-09-09

Applicant: Kyu-ho Shin ,  Chang-youl Moon ,  Yong-jun Kim

Inventor： Kyu-ho Shin ,  Chang-youl Moon ,  Yong-jun Kim

IPC: H05K7/06

CPC classification number: H01L23/5389 ,  G01L19/146 ,  H01L23/5387 ,  H01L24/24 ,  H01L2224/24051 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K1/189 ,  H01L2924/00

Abstract: A flexible device, a flexible pressure sensor, and a fabrication method thereof. The present flexible device includes: a first flexible substrate formed of a flexible material to have a flexibility; an active element formed to have a predetermined thickness and a flexibility, and being attached on the first flexible substrate; and a second flexible substrate formed of a flexible material to have a flexibility, and being deposited on the active element. The flexible device and the flexible pressure sensor have a high flexibility, so that they may be applied for a medical treatment such as implantation to a living body, a human body and so forth. In addition, the flexible device has a high flexibility, so that it may be inserted to a curved surface, which contributes to remove the limit of space where the semiconductor package device may be inserted.

Abstract translation: 柔性装置，柔性压力传感器及其制造方法。 本发明的柔性装置包括：由柔性材料形成以具有柔性的第一柔性基底; 活性元件，其形成为具有预定厚度和柔性，并且附着在所述第一柔性基板上; 以及由柔性材料形成以具有柔性并且沉积在有源元件上的第二柔性基板。 柔性装置和柔性压力传感器具有高的柔性，使得它们可以用于医疗处理，例如植入生物体，人体等。 此外，柔性器件具有高的柔性，从而可以将其插入弯曲表面，这有助于消除可插入半导体封装器件的空间极限。

公开(公告)号：US5669752A

公开(公告)日：1997-09-23

申请号：US680871

申请日：1996-07-16

Applicant: Chang-youl Moon

Inventor： Chang-youl Moon

IPC: H01L21/68 ,  B65G49/07

CPC classification number: H01L21/68 ,  Y10S414/136 ,  Y10S414/141

Abstract: A semiconductor wafer pre-aligning apparatus includes a wafer transfer unit for transferring a semiconductor wafer, and a wafer stopping unit for stopping and disposing the transferred semiconductor wafer on a predetermined position of a transferring path. The wafer stopping unit includes a stop elevatably disposed on the wafer transferring path and having a plurality of stepped and arc-shaped walls whose radii are different from one another but whose curvature centers coincide, and a device for elevating the wafer stopping unit. Thus, changes in wafer size can be dealt with easily and a clean work environment for wafer treatment can be maintained.

Abstract translation: 半导体晶片预对准装置包括用于传送半导体晶片的晶片转移单元和用于在转印路径的预定位置上停止并布置转印的半导体晶片的晶片停止单元。 晶片停止单元包括可升降地设置在晶片传送路径上并具有多个阶梯状和弧形的壁的停止，其半径彼此不同但其曲率中心重合，以及用于升高晶片停止单元的装置。 因此，可以容易地处理晶片尺寸的变化，并且可以保持用于晶片处理的清洁的工作环境。