公开(公告)号：US20200083412A1

公开(公告)日：2020-03-12

申请号：US16563529

申请日：2019-09-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/50 ,  H01L33/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.

公开(公告)号：US10533253B2

公开(公告)日：2020-01-14

申请号：US15369042

申请日：2016-12-05

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: C23C16/455 ,  C25D11/24 ,  B01D67/00 ,  C25D11/04 ,  C23C16/44 ,  B01D71/02 ,  H01J37/32 ,  B01D69/06

Abstract: A fluid permeable anodic oxide film includes a plurality of regularly-disposed pores formed by anodizing metal and a plurality of permeation holes having an inner width larger than an inner width of the pores and extending through the fluid permeable anodic oxide film. Also provided is a fluid permeable body which makes use of the fluid permeable anodic oxide film.

公开(公告)号：US20190308332A1

公开(公告)日：2019-10-10

申请号：US16377083

申请日：2019-04-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN ,  Tae Hwan SONG

IPC: B25J15/06 ,  B65G47/91

Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.

公开(公告)号：US20190304818A1

公开(公告)日：2019-10-03

申请号：US16370810

申请日：2019-03-29

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  B65G47/91

Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.

公开(公告)号：US10433370B2

公开(公告)日：2019-10-01

申请号：US15634626

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05B1/02 ,  H05B3/00 ,  G01N27/12 ,  H05B3/08 ,  H05B3/26

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

公开(公告)号：US20190064094A1

公开(公告)日：2019-02-28

申请号：US16112554

申请日：2018-08-24

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N27/12 ,  G01N27/30 ,  G01N27/406

Abstract: The present invention relates to a gas sensor that measures the concentration of gas through a sensing membrane and a gas sensor package having the same and, more particularly, to a gas sensor and a gas sensor package having the same that can ensure high thermal efficiency and uniform heat transfer to make it possible to be sufficiently heated with low power consumption and to precisely measure gas concentration.

公开(公告)号：US10163567B2

公开(公告)日：2018-12-25

申请号：US14816182

申请日：2015-08-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park

IPC: H01G4/008 ,  H01G4/26 ,  H01G4/12 ,  H01G4/30 ,  H01G4/232

Abstract: The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al2O3 insulation layer is formed by anodizing the aluminum layer without forming an extra insulation layer after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-layered capacitor having a high capacitance and a high reliability can be provided by stacking capacitors comprising a plurality of aluminum oxide layers using a more simplified process according to the present invention.

公开(公告)号：US09865787B2

公开(公告)日：2018-01-09

申请号：US14931432

申请日：2015-11-03

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park

IPC: H01L33/00 ,  H01L33/64 ,  H05K1/00 ,  H01L33/58 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L33/644 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/00 ,  H01L2924/00

Abstract: A chip substrate includes conductive portions, insulation portions, cavities and a heat dissipating portion. The insulation portions are alternately bonded to the conductive portions to electrically isolate the conductive portions. The lens insertion portions are formed on an upper surface of the chip substrate at a predetermined depth so as to extend across each of the insulation portions. Each of the lens insertion portions includes a predetermined number of straight sides and a predetermined number of arc-shaped corners formed in regions where the straight sides meet with each other. The cavities are formed inward of the lens insertion portions at a predetermined depth so as to extend across each of the insulation portions. The heat dissipating portion is bonded to a lower surface of the chip substrate.

公开(公告)号：US20180007740A1

公开(公告)日：2018-01-04

申请号：US15634626

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05B1/02 ,  H05B3/00 ,  G01N27/12 ,  H05B3/26 ,  H05B3/08

CPC classification number: H05B1/0294 ,  G01N27/123 ,  G01N27/125 ,  G01N27/128 ,  H05B3/0019 ,  H05B3/08 ,  H05B3/26 ,  H05B2203/002

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

公开(公告)号：US20180003661A1

公开(公告)日：2018-01-04

申请号：US15634645

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  G01N27/14 ,  G01N33/00

CPC classification number: G01N27/128 ,  G01N27/14 ,  G01N33/0016 ,  G01N33/0031

Abstract: A micro multi-array sensor includes a substrate, a sensor electrode formed on the substrate, and a heater electrode formed on the substrate. The sensor electrode includes a first sensor electrode formed on the substrate and a second sensor electrode formed on an opposite surface of the substrate from the first sensor electrode. The heater electrode is disposed more adjacent to the first sensor electrode than the second sensor electrode.