-
公开(公告)号:USD1005964S1
公开(公告)日:2023-11-28
申请号:US29689980
申请日:2019-05-03
Applicant: Samtec, Inc.
Designer: Chadrick Paul Faith , Dale Schmelz
Abstract: FIG. 1 is a bottom, right, rear perspective view of an electrical connector showing our new design;
FIG. 2 is a top, left, front perspective view thereof;
FIG. 3 is an enlarged top, right, rear perspective view thereof;
FIG. 4 is an enlarged bottom, left, front perspective view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is an enlarged right side elevation view thereof;
FIG. 8 is an enlarged left side elevation view thereof;
FIG. 9 is a rear elevation view thereof; and,
FIG. 10 is a front elevation view thereof.
The broken lines in the drawings depict portions of the electrical connector that form no part of the claimed design. The dash-dot broken lines in the drawings depict the boundaries of the claimed design and form no part thereof.-
公开(公告)号:US20230335960A1
公开(公告)日:2023-10-19
申请号:US17760138
申请日:2021-02-04
Applicant: SAMTEC, INC.
Inventor: Brandon Thomas GORE , Richard MELLITZ , Gauss YANG , Kelly GARRISON , Norman S. MCMORROW
CPC classification number: H01R25/003 , H01R12/75 , H01R12/722 , G01R31/2896 , H01R2201/20
Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
-
公开(公告)号:US11769969B2
公开(公告)日:2023-09-26
申请号:US17265845
申请日:2019-10-24
Applicant: Samtec, Inc.
Inventor: Jignesh H. Shah , Jean Karlo Williams Barnet
IPC: H01R13/646 , H01R13/6474 , H01R12/72 , H01R13/6581
CPC classification number: H01R13/6474 , H01R12/72 , H01R13/6581
Abstract: A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.
-
公开(公告)号:US20230299520A1
公开(公告)日:2023-09-21
申请号:US17768681
申请日:2020-11-12
Applicant: Samtec, Inc.
Inventor: Christina KOZLOVSKY , Jignesh H. SHAH , Eric J. ZBINDEN
IPC: H01R12/70 , H01R12/75 , H01R13/6583 , H01R12/71
CPC classification number: H01R12/7082 , H01R12/716 , H01R12/75 , H01R13/6583 , H04B1/38
Abstract: An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.
-
公开(公告)号:US20230251441A1
公开(公告)日:2023-08-10
申请号:US18134647
申请日:2023-04-14
Applicant: Samtec, Inc.
Inventor: Eric J. ZBINDEN , Randall E. MUSSER , Jean-Marc A. VERDIELL , John A. MONGOLD , Brian R. VICICH , Keith R. GUETIG
IPC: G02B6/42 , H04B10/25 , H04B1/3827 , H04B10/40 , H04B10/27 , H04B10/80 , H05K7/20 , H01R13/639 , H01R12/71
CPC classification number: G02B6/4284 , G02B6/428 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/4292 , G02B6/4293 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H04B10/25891 , H05K7/20418 , H01L2224/48091 , H01L2224/49175
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
-
公开(公告)号:US20230221504A1
公开(公告)日:2023-07-13
申请号:US18122166
申请日:2023-03-16
Applicant: Samtec, Inc.
Inventor: Jignesh H. SHAH , William J. KOZLOVSKY , David A. LANGSAM , Raymond J. LEE , R. Brad BETTMAN , Eric Jean ZBINDEN
IPC: G02B6/42
CPC classification number: G02B6/4246
Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
-
公开(公告)号:US20230178917A1
公开(公告)日:2023-06-08
申请号:US18096605
申请日:2023-01-13
Applicant: Samtec, Inc.
Inventor: John A. MONGOLD , Jonathan E. BUCK , Jignesh H. SHAH , Chadrick P. FAITH , Randall E. MUSSER , Jean Karlo WILLIAMS BARNET , Norman S. MCMORROW
IPC: H01R12/79 , H01R13/518
CPC classification number: H01R12/79 , H01R13/518
Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
-
公开(公告)号:US11652325B2
公开(公告)日:2023-05-16
申请号:US17950458
申请日:2022-09-22
Applicant: Samtec, Inc.
Inventor: John A. Mongold , Jonathan E. Buck , Jignesh H. Shah , Chadrick P. Faith , Randall E. Musser , Jean Karlo Williams Barnet , Norman S. McMorrow
IPC: H01R13/648 , H01R13/6587 , H01R12/59 , H01R12/79 , H01R13/11
CPC classification number: H01R13/6587 , H01R12/594 , H01R12/79 , H01R13/113
Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
-
公开(公告)号:US11600956B2
公开(公告)日:2023-03-07
申请号:US17950458
申请日:2022-09-22
Applicant: Samtec, Inc.
Inventor: John A. Mongold , Jonathan E. Buck , Jignesh H. Shah , Chadrick P. Faith , Randall E. Musser , Jean Karlo Williams Barnet , Norman S. McMorrow
IPC: H01R13/648 , H01R13/6587 , H01R12/59 , H01R12/79 , H01R13/11
Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
-
公开(公告)号:US20230014513A1
公开(公告)日:2023-01-19
申请号:US17936013
申请日:2022-09-28
Applicant: SAMTEC, INC.
Inventor: Eric Zbinden , Jignesh H. Shah
IPC: H01R12/71 , H01R12/72 , H01R13/187
Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.
-
-
-
-
-
-
-
-
-