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175 条记录 (耗时 0.028 秒)

    Two-part microprobes for contacting electronic components and methods for making such probes
    71.
    发明授权
    Two-part microprobes for contacting electronic components and methods for making such probes 有权
    用于接触电子部件的两部分微探针和用于制造这种探针的方法

    公开(公告)号：US07567089B2

    公开(公告)日：2009-07-28

    申请号：US11636147

    申请日：2006-12-07

    申请人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

    发明人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

    摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

    摘要翻译： 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及两部分探针元件，可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中，例如，探针在安装结构中具有滑动，在安装结构中扭转，包括柔顺元件的安装结构等。

    Atherectomy and Thrombectomy Devices, Methods for Making, and Procedures for Using
    72.
    发明申请
    Atherectomy and Thrombectomy Devices, Methods for Making, and Procedures for Using 审中-公开
    动脉粥样硬化切除术和血栓切除术装置，制造方法和使用程序

    公开(公告)号：US20100094320A1

    公开(公告)日：2010-04-15

    申请号：US12614006

    申请日：2009-11-06

    申请人： Vacit Arat ,  Richard T. Cohen ,  Ming Ting Wu ,  Pavel B. Lembrikov ,  Adam L. Cohen

    发明人： Vacit Arat ,  Richard T. Cohen ,  Ming Ting Wu ,  Pavel B. Lembrikov ,  Adam L. Cohen

    IPC分类号： A61B17/22

    CPC分类号： A61B17/320725 ,  A61B17/320758 ,  A61B2017/003 ,  A61B2017/22071 ,  A61B2017/320004 ,  A61B2017/320008

    摘要： Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.

    摘要翻译： 实施例涉及用于从血管内壁移除材料的装置，例如在动脉粥样硬化切除术或血栓切除术过程期间，其中装置包括消融工具和至少一个消融工具稳定器，其可用于将消融工具径向定位在容器内的期望位置处 。 在一些实施例中，消融工具可以具有旋转切割元件，旋转切割元件具有大致平行于待清除的容器的局部轴线的旋转轴线。 在一些实施例中，消融工具可以具有允许清除材料并且能够经由稳定装置或装置进行径向定位和旋转定位的单侧和/或顶部，并且还可以通过稳定性轴向运动 设备。

    Method of and apparatus for measuring and controlling fluid level in stereolithography
    75.
    发明授权
    Method of and apparatus for measuring and controlling fluid level in stereolithography 失效
    用于测量和控制立体光刻中液位的方法和装置

    公开(公告)号：US5258146A

    公开(公告)日：1993-11-02

    申请号：US880190

    申请日：1992-05-06

    申请人： Thomas A. Almquist ,  Borzo Modrek ,  Paul F. Jacobs ,  Charles W. Lewis ,  Mark A. Lewis ,  Abraham Liran ,  Adam L. Cohen ,  Dennis R. Smalley

    发明人： Thomas A. Almquist ,  Borzo Modrek ,  Paul F. Jacobs ,  Charles W. Lewis ,  Mark A. Lewis ,  Abraham Liran ,  Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： B29C35/08 ,  B29C41/02 ,  B29C41/12 ,  B29C41/52 ,  B29C67/00 ,  G01F23/292 ,  G01F23/36 ,  G05D9/12

    CPC分类号： G05D9/12 ,  B29C41/12 ,  B29C67/0066 ,  G01F23/2921 ,  G01F23/366 ,  B29K2995/0073 ,  Y10T156/17

    摘要： Improved apparatus and methods for forming a layer of material over a surface of a previously-formed cross-section of a three-dimensional object in anticipation of forming a next cross-section of the object out of the layer. A volume of material, including at least some excess material, is placed over the surface, and the excess material is swept off by placing the excess material in the predetermined path of a sweeping member, the path being substantially in a plane spaced from a working surface of material. The member may be directed to sweep the excess material away through a successive number of sweeps, which may vary for each cross-section, at least a velocity which may vary for each sweep. Additionally, the clearance between the member and the surface of the previous cross-section may vary for each sweep. A "winged" member is also provided, comprising two legs extending from a base, and a "Trident" embodiment is also provided, comprising three legs extending from a base.

    摘要翻译： 改进的用于在三维物体的预先形成的横截面的表面上形成材料层的装置和方法，以期将物体的下一个横截面形成在该层之外。 将一定体积的材料（包括至少一些多余的材料）放置在表面上，并且通过将多余的材料放置在扫掠构件的预定路径中来清除多余的材料，该路径基本上处于与工作 材料表面。 该构件可以被引导以通过连续数量的扫描来扫过多余的材料，该扫描对于每个横截面可以变化，至少每个扫描可能变化的速度。 此外，构件和前一横截面的表面之间的间隙可以针对每个扫掠而变化。 还提供了一个“翼形”构件，其包括从基座延伸的两个腿部，并且还提供了“三叉戟”实施例，其包括从底座延伸的三个腿部。

    Method for electrochemically forming structures including non-parallel mating of contact masks and substrates
    76.
    发明授权
    Method for electrochemically forming structures including non-parallel mating of contact masks and substrates 有权
    用于电化学形成结构的方法，包括接触掩模和基底的非平行配合

    公开(公告)号：US07291254B2

    公开(公告)日：2007-11-06

    申请号：US10724515

    申请日：2003-11-26

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C25D5/02

    CPC分类号： B81C1/00126 ,  B33Y10/00 ,  B81C2201/019

    摘要： Treatment of substrates, formation of structures, and formation of multilayer structures using contact masks are disclosed where a non-parallel or non-simultaneous mating of various mask contact surfaces to a substrate surface occurs. Some embodiments involve bringing a relative planar mask contact surface and a relative planar substrate surface together at a small angle (but larger than an alignment tolerance associated with the system). Some embodiments involve flexing a mask to make it non-planar and bringing it into contact with a substrate such that progressively more contact between the mask and substrate occur until complete mating is achieved. Some embodiments involve use of gas or liquid pressure to bow a flexible or semi-flexible mask and use a linear actuator to bring the mating surfaces together and to bring the mask into a more planar configuration.

    摘要翻译： 公开了基板的处理，结构的形成和使用接触掩模的多层结构的形成，其中发生各种掩模接触表面与基板表面的非平行或非同时的配合。 一些实施例涉及将相对平面的掩模接触表面和相对平面的基板表面以小角度（但大于与系统相关联的对准公差）组合在一起。 一些实施例涉及弯曲掩模以使其非平面并使其与基底接触，使得在掩模和基底之间逐渐更多的接触发生直到完成配合。 一些实施例涉及使用气体或液体压力来弯曲柔性或半柔性掩模，并且使用线性致动器将配合表面合在一起并使掩模进入更平面的构型。

    Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
    77.
    发明授权
    Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures 失效

    公开(公告)号：US07235166B2

    公开(公告)日：2007-06-26

    申请号：US10677498

    申请日：2003-10-01

    申请人： Adam L. Cohen ,  Dennis R. Smalley ,  Gang Zhang

    发明人： Adam L. Cohen ,  Dennis R. Smalley ,  Gang Zhang

    IPC分类号： C25D5/02

    CPC分类号： C25D5/022 ,  B33Y10/00 ,  C25D1/08 ,  C25D5/10

    摘要： Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

    Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric
    79.
    发明授权
    Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric 有权
    在多孔电介质上制造多层三维结构的电化学制造方法

    公开(公告)号：US07527721B2

    公开(公告)日：2009-05-05

    申请号：US10841378

    申请日：2004-05-07

    申请人： Pavel B. Lembrikov ,  Dennis R. Smalley ,  Adam L. Cohen

    发明人： Pavel B. Lembrikov ,  Dennis R. Smalley ,  Adam L. Cohen

    IPC分类号： C25D5/10

    CPC分类号： C25D5/022 ,  B33Y10/00 ,  C25D5/10 ,  C25D5/48

    摘要： Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.

    摘要翻译： 多层结构在多孔电介质基片上电化学形成。 在一些实施例中，衬底具有至少一个被牺牲导电材料渗透的表面，所有孔（例如衬底的电介质区域之间的开口）或衬底表面附近的选定孔被打开，结构材料是 沉积以填充至少一部分打开的孔。 如果比已经填充的孔更多的孔被打开，或者将被结构材料填充，则可以沉积牺牲材料以填充附加的孔。 在衬底上形成初始图案化表面之后，在衬底上形成多个层（例如通过电沉积操作），并且在层形成完成之后，去除填充孔的导电牺牲材料。

    Electrochemical Fabrication Method and Apparatus for Producing Three-Dimensional Structures Having Improved Surface Finish
    80.
    发明申请
    Electrochemical Fabrication Method and Apparatus for Producing Three-Dimensional Structures Having Improved Surface Finish 审中-公开
    用于生产具有改进的表面光洁度的三维结构的电化学制造方法和装置

    公开(公告)号：US20090095632A1

    公开(公告)日：2009-04-16

    申请号：US12242792

    申请日：2008-09-30

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C25D5/02

    CPC分类号： C25D5/02 ,  B81C1/00373 ,  B81C2201/019 ,  C23F1/00 ,  C25D1/003 ,  H01P11/003

    摘要： An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or conditioning operations are varied between layers or between different portions of a layer such that different surface qualities are obtained. In other embodiments varying surface quality may be obtained without varying removal or conditioning operations but instead by relying on differential interaction between removal or conditioning operations and different materials encountered by these operations.

    摘要翻译： 电化学制造工艺从多个沉积材料层产生三维结构（例如组件或器件），其中通过去除沉积材料的选定表面的材料或条件的操作产生一些层的至少一些部分的形成。 在一些实施例中，去除或调节操作在层之间或层的不同部分之间变化，使得获得不同的表面质量。 在其它实施例中，可以在不改变去除或调节操作的情况下获得变化的表面质量，而是通过依赖于去除或调节操作与这些操作遇到的不同材料之间的差异相互作用。