公开(公告)号：US06476467B2

公开(公告)日：2002-11-05

申请号：US09870824

申请日：2001-06-01

申请人： Hisao Nakamura ,  Seiichi Ichihara ,  Ryosuke Kimoto ,  Hiroshi Kawakubo ,  Ryo Haruta ,  Hiroshi Koyama

发明人： Hisao Nakamura ,  Seiichi Ichihara ,  Ryosuke Kimoto ,  Hiroshi Kawakubo ,  Ryo Haruta ,  Hiroshi Koyama

IPC分类号： H01L23495

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599

摘要： The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.

摘要翻译： 具有半导体芯片的带状载体封装的厚度在焊盘集中在半导体芯片的一侧上时是均匀的。 磁带载体封装是这样的，即，虚拟焊盘6b布置在与半导体芯片中布置有焊盘（有效引脚）6a的一侧相对的一侧上。 虚拟引线5形成在绝缘带4上。半导体芯片由连接到相应的接合焊盘6a的内部引线部分5a和连接到相应的虚设焊盘6b的虚拟引线5的内部引线部分5a支撑。

公开(公告)号：US06307269B1

公开(公告)日：2001-10-23

申请号：US09113500

申请日：1998-07-10

申请人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

发明人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L2348

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/3025

摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

摘要翻译： 一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到 绝缘胶带

公开(公告)号：US5886228A

公开(公告)日：1999-03-23

申请号：US980359

申请日：1997-11-28

申请人： Hiroshi Koyama ,  Etsuo Takemoto

发明人： Hiroshi Koyama ,  Etsuo Takemoto

IPC分类号： C07C213/10 ,  C07C215/10 ,  C07C211/03

CPC分类号： C07C215/10 ,  C07C213/10

摘要： 1-aminopropanediol-2,3 containing 2-aminopropanediol-1,3 of less than 0.30% by weight can be prepared by the present purification process, which comprises distilling a 1-aminopropanediol-2,3 containing at least 0.3% of 2-aminopropanediol-1,3 based on the weight of 1-aminopropanediol-2,3 with a distillation column, said distillation column having low pressure loss.

摘要翻译： 可以通过本纯化方法制备含有小于0.30重量％的2-氨基丙二醇-1,3-的1-氨基丙二醇-2,3，其包括蒸馏含有至少0.3％的2-氨基丙二醇-2,3-二 氨基丙二醇-1,3-基于1-氨基丙二醇-2,3的重量与蒸馏塔，所述蒸馏塔具有低压力损失。

公开(公告)号：US5474966A

公开(公告)日：1995-12-12

申请号：US268453

申请日：1994-06-30

申请人： Harumitsu Asazuma ,  Hiroshi Koyama

发明人： Harumitsu Asazuma ,  Hiroshi Koyama

IPC分类号： B41M5/28 ,  B41M5/30 ,  B41M5/40 ,  B41M5/41 ,  B41M5/035 ,  B41M5/38

CPC分类号： B41M5/41

摘要： A thermal recording material comprising (1) a synthetic paper support having on one side thereof (2) a thermal color forming layer, the support comprising (B) a biaxially stretched resin film as a base layer having (A) a uniaxially stretched thermoplastic resin film containing from 1 to 8% by weight calcium carbonate powder as a calcium carbon powder containing layer on one side thereof, and (C) a uniaxially stretched thermoplastic resin film containing from 15 to 55% by weight inorganic fine powder as a back surface layer on the other side thereof, the thermal color forming layer being provided on the calcium carbon powder containing layer (A), in which (i) the support has an opacity of not more than 45% as measured according to JIS P-8138, (ii) the calcium carbon powder containing layer (A) has a Bekk's index of from 1,000 to 3,500 seconds and a center-line average roughness (Ra) of not more than 0.5 .mu.m, (iii) the back surface layer (C) has a Bekk's index of from 100 to 900 seconds and a center-line average roughness (Ra) of from 0.6 to 1 .mu.m, and (iv) the support has a density of from 0.91 to 1.1 g/cm.sup.3 as measured according to JIS P-8118. The thermal recording material has improved image definition, including dot reproducibility, is suitable for diazo copying and high-speed printing, and can be written on with a pencil.

摘要翻译： 一种热敏记录材料，包括（1）合成纸支撑体，其一侧具有热成型层（2），所述支撑体包含（B）作为基层的双轴拉伸树脂膜，所述双轴拉伸树脂膜具有（A）单轴拉伸热塑性树脂 含有1〜8重量％的碳酸钙粉末，其一面为含有碳酸钙粉末的层，和（C）含有15〜55重量％无机细粉末作为背面层的单轴拉伸热塑性树脂膜 在其另一面上，在含碳酸钙粉末的层（A）上设置热成型层，其中（i）所述载体的不透明度根据JIS P-8138测量为不大于45％（ ii）含碳粉碳粉层（A）的Bekk指数为1,000〜3,500秒，中心线平均粗糙度（Ra）为0.5μm以下，（iii）背面层（C）具有 Bekk的指数从100到900秒 中心线平均粗糙度（Ra）为0.6〜1μm，（iv）根据JIS P-8118测定，载体的密度为0.91〜1.1g / cm 3。 热敏记录材料具有改进的图像清晰度，包括点重现性，适用于重复复印和高速打印，可以用铅笔写入。

公开(公告)号：US5225008A

公开(公告)日：1993-07-06

申请号：US851989

申请日：1992-03-13

申请人： Hiroshi Koyama ,  Yasuo Sato ,  Katsuyuki Nishioka ,  Akira Tange ,  Tadayoshi Akutsu

发明人： Hiroshi Koyama ,  Yasuo Sato ,  Katsuyuki Nishioka ,  Akira Tange ,  Tadayoshi Akutsu

IPC分类号： B24C1/10 ,  C21D7/04 ,  C21D7/06 ,  C21D9/02 ,  C22C38/00 ,  C22C38/46 ,  F16F1/02

CPC分类号： C21D9/02 ,  C21D7/04 ,  C21D7/06 ,  Y10S148/908

摘要： A spring steel containing 0.35 to 0.50% of carbon is refined to the hardness of .phi. 2.50 to 2.70 mm in Brinell indentation diameter (HBD) by rapid cooling for quenching and tempering. This spring steel is subjected to warm shot peening at a temperature of 150.degree. to 300.degree. C. (423 to 573 K.) by using long-lived practical shots with the normal hardness of .phi. 2.65 to 2.80 mm in HBD, whereupon a high-strength spring is obtained having a compressive residual stress in its surface and enjoying the maximum shearing stress of 110 to 135 kgf/mm.sup.2 (1080 to 1325 MPa).

摘要翻译： 通过快速冷却淬火和回火，含有0.35-0.50％碳的弹簧钢被精炼至布氏压痕直径（HBD）为2.50mm至2.70mm的硬度。 通过使用HBD中正常硬度为2.65〜2.80mm的长寿命实际射击，在150℃〜300℃（423〜573K）的温度下对该弹簧钢进行温喷丸硬化，结果为高 获得在其表面具有压缩残余应力并且享受110至135kgf / mm2（1080至1325MPa）的最大剪切应力的强度弹簧。

公开(公告)号：US5107114A

公开(公告)日：1992-04-21

申请号：US685434

申请日：1991-04-15

申请人： Tadashi Nishioka ,  Takao Yasue ,  Hiroshi Koyama

发明人： Tadashi Nishioka ,  Takao Yasue ,  Hiroshi Koyama

IPC分类号： G01B7/34 ,  G01B21/30 ,  G01N37/00 ,  G01Q10/04 ,  G01Q60/10 ,  G01Q60/24 ,  H01J37/28 ,  H01L41/09

CPC分类号： G01Q10/04 ,  B82Y35/00 ,  Y10S977/872

摘要： A fine scanning mechanism for an atomic force microscope includes a three-dimensionally displaceable cylindrical piezolectric element, a first probe attaching portion attached to an end of the said cylindrical piezoelectric element, a first probe attached to the first probe attaching portion, a bimorph piezoelectric element attaching portion attached to the end of the cylindrical piezoelectric element, a one-dimensionally displaceable bimorph piezoelectric element attached to the bimorph piezoelectric element attaching portion, a cantilever attaching portion attached to a side of the one-dimensionally displaceable bimorph piezoelectric element, the cantilever having a displacement portion and being attached to the cantilever attaching portion, a second probe attaching portion attached to a side of the displacement portion of the cantilever, a second probe attached to the second probe attaching portion, and a stationary sample tray disposed opposite the second probe.

公开(公告)号：US5101196A

公开(公告)日：1992-03-31

申请号：US425601

申请日：1989-10-23

申请人： Hiroshi Koyama

发明人： Hiroshi Koyama

IPC分类号： G09G3/36

CPC分类号： G09G3/3622

摘要： A display device for a microcomputer including a RAM for display, a ROM for a character generator, a changeover gate, a parallel/serial conversion circuit, a display circuit, and a display controlling circuit. A plurality of registers and a plurality of counters are incorporated in the display controlling circuit.

摘要翻译： 一种微型计算机的显示装置，包括用于显示的RAM，用于字符发生器的ROM，转换门，并行/串行转换电路，显示电路和显示控制电路。 多个寄存器和多个计数器并入显示控制电路中。

公开(公告)号：US5032700A

公开(公告)日：1991-07-16

申请号：US339790

申请日：1989-02-07

申请人： Ikuo Sugiyama ,  Kazuhisa Ishibashi ,  Nobuyuki Takakusaki ,  Yoshitsugu Maruhashi ,  Yasushi Nishimura ,  Hiroshi Koyama ,  Setsuko Iida ,  Koji Sato

发明人： Ikuo Sugiyama ,  Kazuhisa Ishibashi ,  Nobuyuki Takakusaki ,  Yoshitsugu Maruhashi ,  Yasushi Nishimura ,  Hiroshi Koyama ,  Setsuko Iida ,  Koji Sato

IPC分类号： B29C33/02 ,  B29C33/06 ,  B29C35/08 ,  B29C35/12 ,  B29C49/06 ,  B29C49/64 ,  B29C49/68

CPC分类号： B29C49/6445 ,  B29C33/02 ,  B29C33/06 ,  B29C35/08 ,  B29C49/68 ,  B29C2037/90 ,  B29C2049/0089 ,  B29C35/12 ,  B29C49/06 ,  B29K2105/258 ,  B29L2031/7158 ,  Y10S264/908

摘要： This invention relates to a heating method for forming a thermoplastic bottle in which a heating member is inserted into the interior of a preform made from a thermoplastic material or the bottle and the preform or plastic bottle is heated by the heating member and a heating device located externally so as to thereby heat the same simultaneously internally and externally thereof, the temperature of the respective heating member being controlled respectively. Radiant heat energy distribution is variable along the longitudinal direction of the heating member so as to carry out the heating process in comformity with the bottle to be formed so as to manufacture the plastic bottle with high quality. A metal to be melted within a predetermined temperature range is enclosed within the heating member and the predetermined temperature of the heating member is maintained for a long period of time by the utilization of the latent heat of the metal so as to manufacture the plastic bottle with high quality under precise temperature setting conditions. The heating means is also utilized for the heating of a mouth portion of the plastic bottle so as to obtain a suitable crystallization of the mouth portion.

摘要翻译： PCT No.PCT / JP88 / 00553 Sec。 371日期1989年2月7日 102（e）日期1989年2月7日PCT Filed 1988年6月8日PCT Pub。 出版物WO88 / 09717 日本特开昭通1988年12月15日。本发明涉及一种用于形成热塑性瓶的加热方法，其中将加热构件插入由热塑性材料或瓶子制成的预成型件的内部，并且预成型件或塑料瓶被 加热构件和位于外部的加热装置，从而同时在内部和外部对其加热，分别控制各个加热构件的温度。 辐射热能分布沿着加热部件的纵向是可变的，以便与要形成的瓶子相一致地执行加热过程，以便制造高质量的塑料瓶。 将要在预定温度范围内熔化的金属封闭在加热构件内，并且通过利用金属的潜热来长时间地保持加热构件的预定温度，从而制造具有 高品质的精密温度设定条件。 加热装置还用于加热塑料瓶的口部，以获得口部的合适的结晶。

公开(公告)号：US4843238A

公开(公告)日：1989-06-27

申请号：US155101

申请日：1988-02-11

申请人： Tadashi Nishioka ,  Hiroaki Morimoto ,  Yoji Mashiko ,  Hiroshi Koyama

发明人： Tadashi Nishioka ,  Hiroaki Morimoto ,  Yoji Mashiko ,  Hiroshi Koyama

IPC分类号： H01L21/66 ,  G01N23/225 ,  G01Q60/00 ,  H01J37/28

CPC分类号： G01N23/2255

摘要： In a method for identifying blistered film in layered films, a focused ion beam irradiates the approximate center of the blister and a portion which has no blister, and individual sets of the measurement data relating to the respective numbers of secondary electrons generated by the irradiation are compared to determine which film of layered films has blistered. Since the focused ion beam is employed, the present method is applicable to the detection of a small blister in layered films. Furthermore, since an enormous number of cutting operations as might have been required in the prior art are eliminated, the present method can be carried out, stably, positively and economically.

摘要翻译： 在层状膜中识别起泡膜的方法中，聚焦离子束照射泡囊的大致中心和没有起泡的部分，并且与由照射产生的二次电子的相应数量有关的各组测量数据是 相比之下确定哪一层分层膜已经起泡。 由于采用聚焦离子束，因此本方法适用于分层膜中小泡的检测。 此外，由于消除了现有技术中可能需要的大量切割操作，因此可以稳定，积极和经济地执行本方法。

公开(公告)号：US4636400A

公开(公告)日：1987-01-13

申请号：US773918

申请日：1985-09-09

申请人： Tadashi Nishioka ,  Hiroshi Koyama ,  Yoji Mashiko

发明人： Tadashi Nishioka ,  Hiroshi Koyama ,  Yoji Mashiko

IPC分类号： H01L21/318 ,  C23C16/34 ,  C23C16/56 ,  H01L21/263 ,  B05D3/06

CPC分类号： C23C16/56 ,  C23C16/345

摘要： A method of treating a silicon nitride film formed by plasma deposition and deposited on a substrate, which comprises: (1) irradiating the silicon nitride film, and (2) heating the silicon nitride film during the irradiating.

摘要翻译： 一种处理通过等离子体沉积形成并沉积在衬底上的氮化硅膜的方法，包括：（1）照射氮化硅膜，和（2）在照射期间加热氮化硅膜。