摘要:
A non-volatile semiconductor memory system includes a memory cell array having floating gate type MOS transistors, and a boosting circuit for boosting a write voltage applied to the memory system. A distributing circuit is further contained for selectively distributing a boosted voltage from the boosting circuit to at least a part of the memory system, for example, row lines in response to a control signal.
摘要:
A non-volatile semiconductor memory system includes a memory cell array having floating gate type MOS transistors, and a boosting circuit for boosting a write voltage applied to the memory system. A distributing circuit is further contained for selectively distributing a boosted voltage from the boosting circuit to at least a part of the memory system, for example, row lines in response to a control signal.
摘要:
A nonvolatile semiconductor memory device is provided having a MOS transistor and a floating gate type MOS transistor. The length of an overlap between a floating gate and a drain region of the floating gate type MOS transistor is made smaller than that of an overlap between the gate and the drain region of the MOS transistor.
摘要:
A non-volatile semiconductor memory cell including: a plurality of blocks each having a plurality of floating gate transistors as memory cells, the floating gate transistor having a drain, a source, a floating gate, and a control gate capacitively coupled to the floating gate, and a data program of the floating gate transistor being effected by data write through injection of electrons into the floating gate and by data erase through emission of electrons from the floating gates; a circuit unit for applying an erase signal to a selected one of the blocks to emit electrons from the floating gates of a plurality of memory cells in the selected block and to erase data in all of the memory cells in the selected block at the same time; and a circuit unit for applying a write signal to the drains of the floating gate transistors within the selected block, without applying the write signal to the drains of the floating gate transistors of non-selected blocks.
摘要:
There is disclosed an improved semiconductor memory device having a regular memory cell array and a spare memory cell array. Each spare memory cell constituting the spare memory cell array includes a first transistor selected by a read word line, whose drain is connected to a spare bit line and source is connected via a fuse to a power supply, and a second transistor connected between the interconnection between the first transistor and fuse and a ground. The fuse is selectively blown by flowing a blowing current through the fuse by selecting the second transistor through a write line to thereby disconnect a discharge current path of the spare bit line. The threshold voltage of the second transistor of the spare memory cell which is made conductive upon selection by the write line when the blowing current flows through the fuse is higher than a potential difference between a potential generated at the write line connected with another spare memory cell and a ground potential. Such a high threshold voltage is obtained by including in manufacture of the memory cell the steps of implanting impurity ions of a first conductivity type to the channel area of a region on the surface of a semiconductor substrate where transistors including the second transistor of a second conductivity type different from the first conductivity type are formed; and implanting impurity ions of the one conductivity type to the channel area of the second transistor and to the channel area of transistors of a conductivity type different from the second transistor; whereby the impurity ions are implanted twice to the channel area of the second transistor.
摘要:
A semiconductor memory device includes word lines selectively driven by a signal from a row decoder, memory cells connected to word lines, first and second data lines, a bit line connected to receive data from the memory cell and to supply received data to the first data lines, dummy cells connected to word lines, first and second dummy data lines, a dummy bit lines connected to receive data from the dummy memory cell and to supply received data to the first dummy data line, a data sensing circuit for generating an output signal corresponding to a potential difference between the second data line and second dummy data line, a first MOS transistor connected between the first and second data lines, a first load circuit for charging the second data line, a second MOS transistor connected between the first and second dummy data lines, and a second load circuit for charging the second dummy data lines. The memory device further includes a first equalizer circuit connected between the second data line and dummy data line and equalizing potentials at both ends during a predetermined period of time after the semiconductor memory device is set in the active mode, and a second equalizer circuit connected between the data line and dummy data line and equalizing potential as at both ends during a predetermined period of time after the memory device is set in the active mode.
摘要:
A main memory cell array is divided into a plurality of blocks, and a spare memory cell group is arranged apart from the main memory cell array. The spare memory cell group uses bit lines or word lines different from those of the main memory cell array and includes spare memory cells which are different in structure from the memory cells of the main memory cell array. The number of the memory cells of the spare memory cell group is the same as that of the main memory cells of one row or column in each block of the main memory cell array, and data can be programmed into the spare memory cells after the completion of the manufacturing process. The operation of programming data into the spare memory cells of the spare memory cell array is effected by use of a write-in address buffer and a write-in decoder. When a row or column including a defective memory cell is designated in the main memory cell array, the row or column of the spare memory cells in the spare memory cell group is activated.
摘要:
A semiconductor memory device comprising a first Electrically Erasable Programmable Read Only Memory (EEPROM) cell array, a first row decoder, a first column decoder, two second EEPROM arrays each having a storage area equal in capacity to the specified storage area defined in the first EEPROM array, a second row decoder, a second column decoder, and a majority logic circuit. The first row decoder and the first column decoder access one of the memory cells of the first EEPROM array. The second row decoder and the second column decoder access one of the memory cells of either the second EEPROM array when one of the memory cells of first EEPROM array is accessed. The majority logic circuit carries out a majority logic operation on the data items read from the accessed memory cell of the first EEPROM array and the data items read from the accessed memory cells of the second EEPROM arrays, thereby to determine which data item is to be read out to an external device.
摘要:
A semiconductor memory device comprises memory cell transistors each having a double layered gate having a floating gate and a control gate. The memory device comprises a transistor for receiving a predetermined voltage from a source external to the memory device and providing it as a reference voltage in response to a control signal, and a sense amplifier for comparing a voltage dependent on the data read from the memory cell with the reference voltage.
摘要:
A semiconductor integrated circuit includes a MOS transistor, and a transistor circuit in which one end of a current path is connected to a drain of this MOS transistor and which has an avalanche breakdown voltage lower than a breakdown voltage of the MOS transistor.