Vapor condenser with three-dimensional folded structure
    71.
    发明授权
    Vapor condenser with three-dimensional folded structure 有权
    蒸汽冷凝器具有三维折叠结构

    公开(公告)号:US08739406B2

    公开(公告)日:2014-06-03

    申请号:US13788722

    申请日:2013-03-07

    Abstract: A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

    Abstract translation: 提供一种制造蒸汽冷凝器的方法,其包括三维折叠结构,该三维折叠结构至少部分限定一组冷却剂传送通道和一组蒸气冷凝通道,其中冷却剂传送通道与 平行于蒸气冷凝通道延伸。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面,并且片材的相对侧是冷却剂冷却的表面,冷却剂冷却表面的至少一部分限定了冷却剂传送通道,并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板,以及第一和第二端部歧管,其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

    Protective cover assembly for air-moving assembly

    公开(公告)号:US11147190B2

    公开(公告)日:2021-10-12

    申请号:US16246661

    申请日:2019-01-14

    Abstract: Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

    Effectiveness-weighted control of cooling system components

    公开(公告)号:US11019755B2

    公开(公告)日:2021-05-25

    申请号:US16749134

    申请日:2020-01-22

    Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

    Thermoelectric-enhanced, inlet air-cooled thermal conductors

    公开(公告)号:US10694644B2

    公开(公告)日:2020-06-23

    申请号:US15819487

    申请日:2017-11-21

    Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

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