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    Integrated control module for communication system on a chip for silicon photonics
    71.
    发明授权
    Integrated control module for communication system on a chip for silicon photonics 有权
    硅光子学芯片通信系统集成控制模块

    公开(公告)号：US09225422B1

    公开(公告)日：2015-12-29

    申请号：US14265185

    申请日：2014-04-29

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04B10/00 ,  H04B10/2575 ,  H04B10/40

    CPC classification number: H04B10/40 ,  H04B10/2575 ,  H04B10/503 ,  H04B10/541 ,  H04J14/02 ,  H04L7/0075 ,  H04L12/40045 ,  H04L25/03006 ,  H04L2025/03433

    Abstract: In an example, an integrated system-on-chip device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. A control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    Abstract translation: 在一个示例中，集成片上系统器件配置在单个硅衬底构件上。 该设备具有设置在基板部件上的数据输入/输出接口。 该装置具有设置在基板部件上并与数据输入/输出接口耦合的输入/输出块。 该装置具有设置在基板构件上并耦合到输入/输出块的信号处理块。 该装置具有设置在基板部件上并与信号处理块相连的驱动器模块。 在一个示例中，该设备具有设置在该衬底构件上的驱动器接口并且耦合到该驱动器模块并被配置为耦合到硅光子器件。 控制块被配置为以数字格式接收和发送指令给通信块，并且被配置为以模拟格式接收和发送信号以与硅光子器件通信。

    LASER CHIP FOR FLIP-CHIP BONDING ON SILICON PHOTONICS CHIPS
    72.
    发明申请
    LASER CHIP FOR FLIP-CHIP BONDING ON SILICON PHOTONICS CHIPS 有权

    公开(公告)号：US20220123518A1

    公开(公告)日：2022-04-21

    申请号：US17076162

    申请日：2020-10-21

    Applicant: INPHI CORPORATION

    Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan

    IPC: H01S5/0238 ,  H01S5/02 ,  H01S5/028 ,  H01S5/0234 ,  H01S5/227 ,  H01S5/22 ,  H01S5/0237

    Abstract: A laser chip for flip-chip bonding on a silicon photonics chip with passive alignment features. The laser chip includes a chip body made of a p-region and a n-region in vertical direction and extended from a front facet to a rear facet in longitudinal direction, a pair of first vertical stoppers formed respectively beyond two sides of the chip body based on a wider width of the n-region, an active region buried in the chip body between the p-region and the n-region in the vertical direction and extended from the front facet to the rear facet in the longitudinal direction, an alignment mark formed on a top surface of the p-region near the front facet with a lateral distance defined in sub-micron precision relative to the active region; and a thin metal film on the surface of the p-region having a cleaved edge shared with the front facet.

    Package structure for photonic transceiving device
    73.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10908370B2

    公开(公告)日：2021-02-02

    申请号：US16793550

    申请日：2020-02-18

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Integrated coherent optical transceiver, light engine
    75.
    发明授权
    Integrated coherent optical transceiver, light engine 有权

    公开(公告)号：US10754091B1

    公开(公告)日：2020-08-25

    申请号：US16357095

    申请日：2019-03-18

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: G02B6/12 ,  G02B6/126 ,  G02B6/122 ,  G02B6/42 ,  H01S5/022 ,  H04B10/40 ,  H01S5/00 ,  H04J14/02

    Abstract: An coherent transceiver includes a single silicon photonics substrate configured to integrate a laser diode chip flip-mounted and coupled with a wavelength tuning section to provide a laser output with tuned wavelengths which is split in X:Y ratio partly into a coherent receiver block as local-oscillator signals and partly into a coherent transmitter block as a light source. The coherent receiver includes a polarization-beam-splitter-rotator to split a coherent input signal to a TE-mode signal and a TM*-mode signal respectively detected by two 90-deg hybrid receivers and a flip-mounted TIA chip assisted by two local-oscillator signals from the tunable laser device. The coherent transmitter includes a driver chip flip-mounted on the silicon photonics substrate to drive a pair of Mach-Zehnder modulators with 90-degree shift in quadrature-phase branches to modulate the laser output to two polarized signals with I/Q modulation and uses a polarization-beam-rotator-combiner to combine them as a coherent output signal.

    Optical module
    76.
    发明授权
    Optical module 有权

    公开(公告)号：US10749622B2

    公开(公告)日：2020-08-18

    申请号：US16813504

    申请日：2020-03-09

    Applicant: INPHI Corporation

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04J14/02 ,  H04B10/40

    Abstract: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.

    Light engine based on silicon photonics TSV interposer
    77.
    发明授权
    Light engine based on silicon photonics TSV interposer 有权

    公开(公告)号：US10566287B1

    公开(公告)日：2020-02-18

    申请号：US15887758

    申请日：2018-02-02

    Applicant: INPHI CORPORATION

    Inventor： Liang Ding ,  Radhakrishnan L. Nagarajan

    IPC: H01L21/768 ,  H01L23/538 ,  G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  G02B6/12

    Abstract: A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.

    Optical module
    79.
    发明授权
    Optical module 有权

    公开(公告)号：US10355804B2

    公开(公告)日：2019-07-16

    申请号：US16034668

    申请日：2018-07-13

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04J14/02 ,  H04B10/40

    Abstract: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.

    Built-in self test for loopback on communication system on chip
    80.
    发明授权
    Built-in self test for loopback on communication system on chip 有权

    公开(公告)号：US10187143B2

    公开(公告)日：2019-01-22

    申请号：US15975688

    申请日：2018-05-09

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04B10/071 ,  H04B10/40 ,  H04L12/26 ,  H04L12/933 ,  H04Q11/00

    Abstract: In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

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