摘要:
There is provided a method for repairing a member comprising a fiber-reinforced plastic, which method can repair a through hole easily at a low cost. When a through hole 20 is repaired, a temporary hole 11 is formed, a fabric sheet 30 comprising reinforcing fibers is rolled into a cylindrical shape and inserted into the temporary hole 11, the fabric sheet 30 is impregnated with a resin, the resin is cured, and a new through hole 20′ is formed.
摘要:
A resin transfer molding (RTM) molding device is designed to mold a fiber-reinforced plastic (FRP) molded body by injecting a resin composition into a mold and by impregnating the molded body therewith. The resin composition is a chain curing polymer (CCP). A CCP accommodating layer is disposed adjacent to an outer side of the molded body. The layer contains the CCP. The layer is provided with a Vf limit value, the value defined by the curing characteristics of the CCP and the characteristics of dissipation of heat from the CCP to the exterior. An element for separating the molded body is disposed between the body and the layer.
摘要:
A fluid filled vibration damping device including: a fluid passage interconnecting a pressure receiving chamber partially defined by a rubber elastic body connecting a first and second mounting members, and an equilibrium chamber partially defined by a flexible film; a movable valve body provided for switching the fluid passage between a communicating state and a blocked state through reciprocating operation; an electric motor employed for actuating the movable valve body; an actuating force converter mechanism provided on an actuating force transmission path from the electric motor to the movable valve body. A rotational actuating force of the electric motor is transmitted as reciprocating actuating force to the movable valve body by the actuating force converter mechanism.
摘要:
There is provided a power source device capable of obtaining power not only when springs or the like return but also when a handle for winding up the springs or the like are operated. The power source device comprises a main shaft connected to both the handle and a main power generation device, an auxiliary shaft connected to an auxiliary power generation device arranged side by side in parallel with the main shaft, the main spring and the auxiliary spring requiring less load to wind up than the main spring being installed between the main shaft and the auxiliary shaft via drums such that accumulation and release of elastic force of the springs are alternated on both shafts, wherein when the main shaft is normally rotated by the handle, elastic force accumulated in the auxiliary spring is applied in the direction of rotation of the main shaft as releasing force.
摘要:
Provided are a bending sensor that is less dependent on an input speed of a strain and in which a response delay is unlikely to occur, and a deformed shape measurement method using the bending sensor. The bending sensor is configured to include a base material; a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles filled in the matrix resin at a filling rate of 30% by volume or more, and in which three-dimensional conductive paths are formed by contact among the conductive filler particles, and electrical resistance increases as an deformation amount increases; an elastically deformable cover film arranged so as to cover the sensor body; and a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances. In the sensor body, cracks are formed in advance in such a direction that the conductive paths are cut off during a bending deformation.
摘要:
An instruction fetch apparatus is disclosed which includes: a program counter configured to manage the address of an instruction targeted to be executed in a program in which instructions belonging to a plurality of instruction sequences are placed sequentially; a change designation register configured to designate a change of an increment value on the program counter; an increment value register configured to hold the changed increment value; and an addition control section configured such that if the change designation register designates the change of the increment value on the program counter, then the addition control section increments the program counter based on the changed increment value held in the increment value register, the addition control section further incrementing the program counter by an instruction word length if the change designation register does not designate any change of the increment value on the program counter.
摘要:
Disclosed herein is a floating-point number arithmetic circuit for efficiently supplying data to be performed arithmetic operation. The floating-point number arithmetic circuit includes an floating-point number arithmetic unit for performing a predetermined floating-point number arithmetic operation on a floating-point number of a predetermined precision, and a converting circuit for converting data into the floating-point number of predetermined precision and supplying the floating-point number of the predetermined precision to at least either one of input terminals of the floating-point number arithmetic unit.
摘要:
Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.
摘要:
Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric constant, and a package molding resin (sealing resin) provided so as to cover the semiconductor chip and the film. As a result, deterioration in contact property with the sealing resin is suppressed and a high frequency characteristic can be enhanced.
摘要:
A manufacturing method for a code wheel for a rotary encoder is provided. The code wheel includes, in a central portion, a hole into which a rotary shaft of a rotary member is fitted and a code portion including a radial code pattern in a circumferential edge portion. The manufacturing method is configured to include the steps of forming the code portion and a reference circle in a plate so that the reference circle has a radius larger than a radius of the hole by a tolerance of deviation between a center position of the code portion and a center position of the hole and has a same center as that of the code portion; and forming the hole in the plate in which the code portion and the reference circle are formed, so as to be contained in the reference circle.