公开(公告)号：US20110039507A1

公开(公告)日：2011-02-17

申请号：US12933343

申请日：2008-12-08

申请人： Mitsuru Sato

发明人： Mitsuru Sato

IPC分类号： H04B17/00

CPC分类号： H04L1/0002 ,  H04L1/1887

摘要： A wireless terminal capable of securing the number of station units capable of simultaneous communication with one unit of access point, reducing power consumption, and ensuring stable communication quality. In the wireless terminal (100), an interference determining section (109) determines whether or not an interference wave is at a predetermined level or more on the basis of the RSSI and SNR of the received signals which are calculated by an RSSI (Received Signal Strength Indicator) calculating section (104) and SNR (Signal to Noise Ratio) calculating section (105) and the presence/absence of a demodulation error notified from a demodulation section (108). A number-of-retransmission upper limit setting section (113) sets the upper limit of the number of retransmission smaller than when the interference wave is at the predetermined level or lower if the interference wave is at the predetermined level or more. A WLAN transmitting circuit (115) repeats the transmission of a transmitting signal by the upper limit number of retransmission till the transmission of the transmitting signal is successful.

摘要翻译： 一种无线终端，其能够确保能够与一个接入点同时通信的站单元的数量，降低功耗，并确保稳定的通信质量。 在无线终端（100）中，干扰判定部（109）基于RSSI（接收信号（RSSI））计算出的接收信号的RSSI和SNR，判断干扰波是否处于规定级别以上 强度指示符计算部分（104）和SNR（信噪比）计算部分（105）以及从解调部分（108）通知的解调错误的存在/不存在。 重发次数上限设定部（113）将发送次数的上限设定为比干扰波处于预定电平以上时的干扰波处于规定电平以下的上限。 WLAN发送电路（115）通过重传的上限次数重复发送发送信号，直到发送信号的发送成功为止。

公开(公告)号：US20100205914A1

公开(公告)日：2010-08-19

申请号：US12670021

申请日：2008-07-10

申请人： Keisho Yamamoto ,  Yoshikatsu Aizawa ,  Mitsuru Sato ,  Eiji Tobita

发明人： Keisho Yamamoto ,  Yoshikatsu Aizawa ,  Mitsuru Sato ,  Eiji Tobita

IPC分类号： B65B11/00

CPC分类号： B65B65/003 ,  B65B13/06 ,  B65B13/18

摘要： An automatic banding packing machine and its automatic banding packing system are provided in which conveying lines of an object to be packed can be aligned in a straight direction, an installation space can be small, the entire structure can be simplified, and moreover, band supply into a band guide arch can be conducted surely so as to enable continuous packing work.Solving MeansThe automatic banding packing machine is provided with a packing machine body having an upper-face table on which the object to be packed passes, a pair of vertical band guide arches arranged separately from each other above the upper-face table in a direction parallel with a passage direction of the object to be packed, and a horizontal band guide arch arranged above the upper-face table in the direction parallel with the passage direction of the object to be packed, and the pair of vertical band guide arches is configured to be movable between a standby position separated from the horizontal band guide arch and a communication position communicating with the horizontal band guide arch in a direction orthogonal to the passage direction of the object to be packed.

摘要翻译： 提供一种自动带式包装机及其自动捆扎包装系统，其中待包装物体的输送线可以在直线方向上对齐，安装空间可小，整体结构可以简化，而且带式供应 进入带导轨可以确保进行，以使连续包装工作。 解决方案自动捆扎包装机设有一个包装机主体，该包装机主体具有上表面，待包装物通过该上表面;一对垂直带导向拱，在上表面上方彼此分开设置; 平行于要包装的物体的通过方向;以及水平带引导拱，其在与待包装物体的通过方向平行的方向上布置在上表面上方，并且一对垂直带引导弓构造成 能够在与水平带引导拱顶分离的备用位置与与水平带引导弓连通的连通位置在与待包装物体的通过方向正交的方向上移动。

公开(公告)号：US20090078977A1

公开(公告)日：2009-03-26

申请号：US12277982

申请日：2008-11-25

申请人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

发明人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

IPC分类号： H01L27/146

CPC分类号： H01L27/14601 ,  H01L27/14689 ,  H01L27/14806 ,  H04N5/335

摘要： A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.

公开(公告)号：US20090072336A1

公开(公告)日：2009-03-19

申请号：US12200424

申请日：2008-08-28

申请人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

发明人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

IPC分类号： H01L31/0216 ,  H01L31/18

CPC分类号： H01L27/14601 ,  H01L27/14689 ,  H01L27/14806 ,  H04N5/335

摘要： A solid-state imaging device having an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.

摘要翻译： 具有用于读取信号电荷的电极的固态成像装置设置在构成像素的光接收传感器部分的一侧; 施加到形成为覆盖除了光接收传感器部分之外的图像拾取区域的遮光膜的预定电压信号; 形成在构成光接收传感器部的光电转换区域的第一导电型半导体区域的表面上的中心的第二导电型半导体区域; 以及在电极侧的端部的第一导电型半导体区域的表面上形成的第二导电型半导体区域的杂质浓度低于位于第一导电型半导体区域 像素分离区域。

公开(公告)号：US20080090388A1

公开(公告)日：2008-04-17

申请号：US11905961

申请日：2007-10-05

申请人： Mitsuru Sato ,  Sumio Utsunomiya

发明人： Mitsuru Sato ,  Sumio Utsunomiya

IPC分类号： H01L21/20

CPC分类号： H01L21/02667 ,  H01L21/02422 ,  H01L21/02532 ,  H01L21/02691 ,  H01L27/1285 ,  H01L29/66757

摘要： A method for fabricating a semiconductor device, comprising: forming a semiconductor film on a substrate; and recrystallizing the semiconductor film using as a heat source flame of a gas burner that uses hydrogen and oxygen gas mixture as a fuel.

摘要翻译： 一种制造半导体器件的方法，包括：在衬底上形成半导体膜; 并且使用使用氢气和氧气混合物作为燃料的气体燃烧器的热源火焰来重结晶半导体膜。

公开(公告)号：US20080026504A1

公开(公告)日：2008-01-31

申请号：US11903873

申请日：2007-09-25

申请人： Yoshiaki Kitano ,  Nobuhiro Karasawa ,  Jun Kuroiwa ,  Hideshi Abe ,  Mitsuru Sato ,  Hiroaki Ohki

发明人： Yoshiaki Kitano ,  Nobuhiro Karasawa ,  Jun Kuroiwa ,  Hideshi Abe ,  Mitsuru Sato ,  Hiroaki Ohki

IPC分类号： H01L31/113

CPC分类号： H01L27/14843 ,  H01L27/14623 ,  H01L27/14689 ,  H01L27/14837

摘要： A solid-state image pickup device includes, in a substrate, a plurality of photoelectric conversion regions for subjecting incoming light to photoelectric conversion, a reading gate for reading a signal charge from the photoelectric conversion regions, and a transfer register (vertical register) for transferring the signal charge read by the reading gate. Therein, a groove is formed on the surface side of the substrate, and the transfer register and the reading gate are formed at the bottom part of the groove. With such a structure, in the solid-state image pickup device, reduction can be achieved for the smear characteristics, a reading voltage, noise, and others.

公开(公告)号：US20080017992A1

公开(公告)日：2008-01-24

申请号：US11826224

申请日：2007-07-13

申请人： Masaru Kito ,  Mitsuru Sato ,  Yuzo Nagata ,  Koji Hashimoto

发明人： Masaru Kito ,  Mitsuru Sato ,  Yuzo Nagata ,  Koji Hashimoto

IPC分类号： H01L21/311 ,  H01L23/48

CPC分类号： H01L21/32139 ,  H01L21/0337 ,  H01L27/105 ,  H01L27/1052

摘要： A first hard mask is formed on a polysilicon film or a target member to be etched, on which a second hard mask composed of amorphous silicon is formed. Ions of boron or the like are implanted into a desired portion of the second hard mask, and then the first hard mask is etched with a mask of the second hard mask. Only the portion not ion-implanted of the second hard mask is etched off by wet etching. A sidewall film is formed on sidewalls of the first hard mask, and then the first hard mask having an upper portion exposed, not covered with the second hard mask is selectively etched off.

摘要翻译： 第一硬掩模形成在多晶硅膜或要蚀刻的靶构件上，在其上形成由非晶硅构成的第二硬掩模。 将硼等的离子注入到第二硬掩模的期望部分中，然后用第二硬掩模的掩模蚀刻第一硬掩模。 通过湿式蚀刻仅蚀刻第二硬掩模未离子注入的部分。 在第一硬掩模的侧壁上形成侧壁膜，然后选择性地蚀刻除去未被第二硬掩模覆盖的具有暴露的上部的第一硬掩模。

公开(公告)号：US20080005708A1

公开(公告)日：2008-01-03

申请号：US11589170

申请日：2006-10-30

申请人： Mitsuru Sato ,  Takehiro Yamazaki

发明人： Mitsuru Sato ,  Takehiro Yamazaki

IPC分类号： G06F17/50

CPC分类号： G06F17/5022 ,  G06F17/5081

摘要： According to the present invention, in a CAD apparatus, circuit data for a circuit diagram created through circuit design processing is stored in a circuit database. Based on the circuit data stored in the circuit database, the respective logic types of components are discriminated and set for the component in the circuit data. Moreover, by adding logically transparent nets to the circuit data stored in the circuit database, DRC data dedicated to a DRC is created and stored in a DRC database. A DRC execution unit performs the DRC, by utilizing the DRC data stored in the DRC database.

摘要翻译： 根据本发明，在CAD装置中，通过电路设计处理创建的电路图的电路数据被存储在电路数据库中。 基于存储在电路数据库中的电路数据，对电路数据中的分量鉴别和设置各个逻辑类型的组件。 此外，通过向存储在电路数据库中的电路数据添加逻辑透明网络，创建专用于DRC的DRC数据并将其存储在DRC数据库中。 DRC执行单元通过利用存储在DRC数据库中的DRC数据执行DRC。

公开(公告)号：US07262128B2

公开(公告)日：2007-08-28

申请号：US10875590

申请日：2004-06-25

申请人： Ichio Yudasaka ,  Mitsuru Sato

发明人： Ichio Yudasaka ,  Mitsuru Sato

IPC分类号： H01L21/4763

CPC分类号： H05K3/0017 ,  H01L21/76802 ,  H05K3/4644 ,  H05K2203/0582

摘要： Method of forming a multilayer interconnection structure that includes a contact hole for reliably connecting between layers, without damaging a substrate. A column shaped mask material is formed in a position for forming a contact hole using a resist, and an interlayer insulating film is applied to the whole surface of the substrate excluding the mask material. Then, the mask material is removed by a method such as peeling. As a result, a hole generated thereby is used as a contact hole.

摘要翻译： 形成多层互连结构的方法，其包括用于层之间可靠连接的接触孔，而不损坏基板。 在使用抗蚀剂形成接触孔的位置上形成列状掩模材料，并且将除了掩模材料之外的层间绝缘膜施加到基板的整个表面。 然后，通过剥离等方法除去掩模材料。 结果，由此产生的孔用作接触孔。

公开(公告)号：US20060223328A1

公开(公告)日：2006-10-05

申请号：US11389079

申请日：2006-03-27

申请人： Sumio Utsunomiya ,  Mitsuru Sato

发明人： Sumio Utsunomiya ,  Mitsuru Sato

IPC分类号： H01L21/302 ,  H01L21/461 ,  H01L21/306

CPC分类号： H01L21/02667 ,  F27B17/0025 ,  H01L21/2022 ,  H01L21/67103 ,  H01L27/1214 ,  H01L29/66757

摘要： A method for manufacturing a semiconductor device, comprises providing a semiconductor layer deposited on a substrate with heat treatment by using a flame of a gas burner fueled by a hydrogen-and-oxygen mixed gas as a heat source.

摘要翻译： 一种制造半导体器件的方法，包括通过使用由氢氧混合气体燃烧的气体燃烧器的火焰作为热源，将沉积在基板上的半导体层提供热处理。