公开(公告)号：US07544542B2

公开(公告)日：2009-06-09

申请号：US11462993

申请日：2006-08-07

申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

IPC分类号： H01L21/44

CPC分类号： H01L23/10 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.

摘要翻译： 提供了用于封装集成电路的各种方法和装置。 一方面，提供一种封装集成电路的方法，其包括将集成电路耦合到基板，将粘合剂与多个颗粒混合，以及用盖子将盖子与粘合剂连接。 粘合剂中多个颗粒的至少一部分与来自盖的压缩力相反，以限制盖相对于基底的旋转。

公开(公告)号：US06488158B1

公开(公告)日：2002-12-03

申请号：US09659826

申请日：2000-09-11

申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。

公开(公告)号：US06417563B1

公开(公告)日：2002-07-09

申请号：US09617102

申请日：2000-07-14

申请人： Jonathan Halderman ,  Mohammad Khan ,  Alexander C. Tain ,  Tom Ley

发明人： Jonathan Halderman ,  Mohammad Khan ,  Alexander C. Tain ,  Tom Ley

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit arrangement comprising an integrated circuit package having a package board. An integrated circuit die is mounted to a surface of the package board. A spring frame is mounted to the package board surface at a pair of opposite frame bends. The spring frame has a central opening that receives the integrated circuit die. Sides of the spring frame away from the bends are raised from the package surface. A heat sink is mounted to the spring frame such that a bottom of the heat sink contacts an upper surface of the integrated circuit die as the heat sink pushes the sides of the spring frame toward the package surface.

摘要翻译： 一种集成电路装置，包括具有封装板的集成电路封装。 集成电路管芯安装到封装板的表面。 弹簧框架以一对相对的框架弯曲部安装到封装板表面。 弹簧框架具有接收集成电路管芯的中心开口。 弹簧框架远离弯头的侧面从包装表面升高。 散热器安装到弹簧框架上，使得当散热器将弹簧框架的侧面朝向封装表面推动时，散热器的底部接触集成电路管芯的上表面。