摘要:
Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell. For example, a compensated operation voltage can be provided that is higher near the center of the memory array and lower near an edge of the memory array, thereby lessening the effect of distributed substrate resistance and providing increased operation speed uniformity throughout the memory array.
摘要:
A semiconductor memory device (104) selectably connectable to an external high voltage power supply (122) is provided. The semiconductor memory device (104) includes a switch (314), a detector (316) and a timing device (318). The switch (314) is connected to external voltage supply signals and selectably couples the external voltage supply signals to memory cells (305) of the semiconductor memory device (104) for memory operations thereof. The external voltage supply signals including a high voltage signal (412) provided from the external high voltage power supply (122) and an operational voltage signal Vcc (402). The detector (316) is connected to the external voltage supply signals for generating a timer activation signal (404) in response to detecting an operational voltage power-on period. The timing device (318) signals the switch (314) to decouple the high voltage signal (412) and the operational voltage signal (402) from the memory cells (305) in response to the timer activation signal (404) and to recouple the high voltage signal (412) and the operational voltage signal (402) to the memory cells (305) a time delay interval thereafter. The time delay interval is determined in response to the high voltage signal (412).
摘要:
One embodiment of the invention relates to a method for accessing a memory cell. In this method, at least one bit of the memory cell is erased. After erasing the at least one bit, a soft program operation is performed to bias the memory cell thereby improving the reliability of data stored in the memory cell.Other methods and systems are also disclosed.
摘要:
A voltage regulator may include an operational-amplifier section, a capacitor connected to an output of the operational-amplifier section, and a switch configured to connect the capacitor to a voltage supply. The switch is configured to charge the capacitor before activating the operational-amplifier section. The capacitor is configured to store charge to supplement current being supplied from the operational-amplifier section. The voltage regulator may be used to supply power to non-volatile memory cells.
摘要:
A method and apparatus are provided for improved power conservation in a semiconductor device (100) which includes a high voltage generating circuit (200) such as a drain pump. The operation frequency of the drain pump (200) is controlled in response to the high voltage level detected at the output thereof. In addition, highly efficient operation of the drain pump (200) can be achieved by enabling and disabling the drain pump (200) in response to the high voltage level to provide an output signal at a relatively constant high voltage level. The drain pump (200) is enabled in response to a high voltage detector (202, 402, 502) detecting a high voltage level lower than a first predetermined voltage level and is disabled in response to detecting a voltage level higher than a second predetermined voltage level, the second predetermined voltage level being higher than the first predetermined voltage level.
摘要:
In one example, the method includes forming a patterned hard mask feature above a layer of gate electrode material, the hard mask feature having a photoresist feature formed thereabove and the hard mask feature having a critical dimension. The method further includes performing an etching process on the patterned hard mask feature to produce a reduced hard mask feature having a critical dimension that is less than the critical dimension of the patterned hard mask feature and performing an anisotropic etching process on the layer of gate electrode material using the reduced hard mask feature as a mask to define a gate electrode.
摘要:
A process technology effectuates production of low defect homogeneous oxynitride, which can be applied in tunneling dielectrics with high dielectric constants and low barrier heights for flash memory devices, and as gate oxide for ultra-thin logic devices. The process technology involves varying the oxygen content in a the homogeneous oxynitride film comprising a part of the flash memory device, which effectively increases the dielectric constant of the oxynitride film and lowers its barrier height. In one such process, a controlled co-flow of N2O is introduced into a CVD deposition process. This process effectuates production of a oxynitride film with uniform distributions of nitrogen and oxygen throughout.
摘要翻译:一种工艺技术可以实现低缺陷均匀氮氧化物的生产,其可以应用于具有高介电常数的隧道电介质和用于闪存器件的低屏障高度,以及用作超薄逻辑器件的栅极氧化物。 该工艺技术涉及改变包括闪存器件的一部分的均匀氮氧化物膜中的氧含量,其有效地增加氧氮化物膜的介电常数并降低其势垒高度。 在一种这样的方法中,将N 2 O 2的受控共流引入到CVD沉积工艺中。 该方法实现了氮气和氧气的均匀分布的氮氧化物膜的生产。
摘要:
Techniques for erasing memory devices of a flash memory array having a plurality of operative wordlines and at least one dummy wordline adjacent an end one of the operative wordlines are disclosed. Erasing the memory devices can include applying a gate voltage to the wordlines and applying a bias voltage to the dummy wordlines. In one arrangement, an electrical connection is established between the dummy wordline and the end one of the operative wordlines.
摘要:
According to one exemplary embodiment, a memory array comprises first and second isolation regions situated in a substrate, where the first and second isolation regions are separated by a separation distance. The memory array further comprises a trench situated between the first and second isolation regions, where the trench defines trench sidewalls and a trench bottom in the substrate. The memory array further comprises a tunnel oxide layer situated between the first and second isolation regions, where the tunnel oxide layer is situated on the trench sidewalls and the trench bottom. According to this embodiment, the memory array further comprises a channel region situated underneath the tunnel oxide layer and extending along the trench sidewalls and the trench bottom, where the channel region has an effective channel width, where the effective channel width increases as a height of the trench sidewalls increases.
摘要:
A method of protecting a stacked gate structure of a flash memory device during fabrication is disclosed. Additionally, the manner of protecting the stacked gate structure during fabrication is simple to implement and is cost-effective. In particular, a protective layer is deposited on the stacked gate structure to protect the stacked gate structure before a resist removal process is performed a second time. Despite undergoing two resist removal processes, the stacked gate structure suffers less damage than the convention fabrication techniques, increasing the yield and reliability of the flash memory device.