公开(公告)号：US20230152350A1

公开(公告)日：2023-05-18

申请号：US17912518

申请日：2021-03-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Sung Hyun BYUN ,  Dong Hyeok SEO

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R31/2886

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.

公开(公告)号：US20220411340A1

公开(公告)日：2022-12-29

申请号：US17851061

申请日：2022-06-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Tae Hwan SONG

IPC: C04B41/45 ,  H01L21/67 ,  C04B41/00 ,  C04B41/50 ,  C04B41/87 ,  C23C16/04 ,  C23C16/455 ,  C23C16/56

Abstract: Proposed are a part having a corrosion-resistant layer that minimizes peeling off and particle generation of a porous ceramic layer, a manufacturing process apparatus having the same, and a method of manufacturing the part.

公开(公告)号：US20210199696A1

公开(公告)日：2021-07-01

申请号：US17131443

申请日：2020-12-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01R3/00 ,  G01R31/26 ,  G01R1/073

Abstract: A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.

公开(公告)号：US20210116478A1

公开(公告)日：2021-04-22

申请号：US17038642

申请日：2020-09-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073 ,  H05K3/46 ,  H05K3/10 ,  H05K1/02

Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.

公开(公告)号：US20200290150A1

公开(公告)日：2020-09-17

申请号：US16814865

申请日：2020-03-10

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: B23K20/12 ,  C23C16/455 ,  H01L21/67

Abstract: The present invention relates to a joined component formed by friction stir welding and, more particularly, to a joined component formed in a structure in which no interface exists between flow paths formed therein.

公开(公告)号：US20200251373A1

公开(公告)日：2020-08-06

申请号：US16777794

申请日：2020-01-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/683 ,  H01L33/00 ,  H05K13/04

Abstract: The present invention relates to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head, in which the lowering position of the micro LED transfer head is limited.

公开(公告)号：US20200065545A1

公开(公告)日：2020-02-27

申请号：US16546108

申请日：2019-08-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G06K9/00 ,  H01L27/146

Abstract: Disclosed is a biometric sensor capable of reliably obtaining a biometric image optically. Further disclosed is a display device including the biometric sensor. The biometric sensor includes a photo-detector and an anodic oxide film. The anodic oxide film is provided with a through hole vertically extending through the anodic oxide film from an upper surface to a lower surface, having a larger width than pores formed in the anodic oxide film during anodic oxidation, and providing an optical path leading to the photo-detector.

公开(公告)号：US20200013648A1

公开(公告)日：2020-01-09

申请号：US16459457

申请日：2019-07-01

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  H01L21/683 ,  B65G47/91

Abstract: The present invention relates to a micro LED transfer head improving efficiency of transferring micro LEDs.

公开(公告)号：US20200006110A1

公开(公告)日：2020-01-02

申请号：US16447852

申请日：2019-06-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/683 ,  H01L33/00

Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.

公开(公告)号：US20190314533A1

公开(公告)日：2019-10-17

申请号：US16383406

申请日：2019-04-12

Applicant: POINT ENGINEERING CO.,LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

IPC: A61L2/10 ,  A61L2/26

Abstract: The present invention relates generally to an ultraviolet sterilization module for sterilizing a fluid using ultraviolet light. More particularly, the present invention relates to an ultraviolet sterilization module, configured such that an increase in amount of ultraviolet irradiation is achieved, thus efficiently sterilizing a fluid inside a light transmission member without requiring an increase in size of the light transmission member.