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公开(公告)号：US09095709B2
公开(公告)日：2015-08-04
申请号：US11893260
申请日：2007-08-15
申请人： Kelly H. McClure , Richard Agustin Castro , Sanjay Gaikwad , Da-Yu Chang , Scott M. Loftin , Rongqing Dai , Robert J. Greenberg
发明人： Kelly H. McClure , Richard Agustin Castro , Sanjay Gaikwad , Da-Yu Chang , Scott M. Loftin , Rongqing Dai , Robert J. Greenberg
CPC分类号： A61N1/36046 , A61N1/0543
摘要： A visor for retinal stimulation of visually impaired. The visor comprises a frame, an external coil, a camera and a mounting system. A connector allows the external coil to be positioned along a first direction. A sliding device allows the external coil to be positioned along a second direction. Positioning of the visor on a subject's nose allows the external coil to be positioned along a third direction. Positioning of the external coil along the first, second or third direction is useful to maximize coupling RF coupling between the external coil and an internal coil implanted on a subject wearing the visor.
摘要翻译： 视网膜刺激视力障碍的遮阳板。 遮阳板包括框架，外部线圈，照相机和安装系统。 连接器允许外部线圈沿第一方向定位。 滑动装置允许外部线圈沿第二方向定位。 遮阳板在被检者的鼻子上的定位允许外部线圈沿第三方向定位。 外部线圈沿着第一，第二或第三方向的定位对于使外部线圈和植入戴着遮阳板的物体上的内部线圈之间的耦合RF耦合最大化是有用的。
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公开(公告)号：US08412339B2
公开(公告)日：2013-04-02
申请号：US11924709
申请日：2007-10-26
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/18
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译： 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。
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公开(公告)号：US20090143848A1
公开(公告)日：2009-06-04
申请号：US12267489
申请日：2008-11-07
申请人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
发明人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
IPC分类号： A61N1/05
CPC分类号： A61N1/0541 , A61N1/0472
摘要： A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.
摘要翻译： 耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。 电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。 所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。 该装置还包括具有多层结构的导线迹线，其为电极阵列的导电部分提供减小的宽度。 耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。 该设备旨在通过适当的电极设计实现最佳神经刺激，这是相对于市售的手工设备的显着改进。
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公开(公告)号：US20090124965A1
公开(公告)日：2009-05-14
申请号：US12180436
申请日：2008-07-25
IPC分类号： A61N1/00
CPC分类号： A61N1/0531 , A61N1/0534 , A61N1/0539 , A61N1/36082 , A61N1/37229 , A61N1/375 , A61N1/3758 , A61N1/3787 , H05K1/028 , H05K1/111 , H05K1/141 , H05K1/147 , H05K3/284
摘要： The present invention consists of an implantable device with at least one package that houses electronics that receives input data or signals, and optionally power, from an external system through at least one coil attached to the at least one package, processes the input data and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
摘要翻译： 本发明包括具有至少一个封装的可植入装置，所述至少一个封装容纳电子装置，所述电子装置通过连接到所述至少一个封装件的至少一个线圈从外部系统接收输入数据或信号以及可选地供电，处理所述输入数据并传送 通过至少一个连接到至少一个封装的多个电极阵列的电脉冲到神经组织。 本发明或其组分旨在安装在头部，或在头颅或硬脑膜上，或脑中或脑中。
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公开(公告)号：US08406887B2
公开(公告)日：2013-03-26
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/375
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
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公开(公告)号：US20110319963A1
公开(公告)日：2011-12-29
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61F9/08
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译： 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。
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公开(公告)号：USD599313S1
公开(公告)日：2009-09-01
申请号：US29291134
申请日：2007-08-15
申请人： Kelly H. McClure , Richard Agustin Castro , Sanjay Gaikwad , Da-Yu Chang , Scott M. Loftin , Rongqing Dai , Robert J. Greenberg
设计人： Kelly H. McClure , Richard Agustin Castro , Sanjay Gaikwad , Da-Yu Chang , Scott M. Loftin , Rongqing Dai , Robert J. Greenberg
CPC分类号： A61N1/36046 , A61N1/37247 , A61N1/37258
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公开(公告)号：USD565082S1
公开(公告)日：2008-03-25
申请号：US29291115
申请日：2007-08-15
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公开(公告)号：US08874239B2
公开(公告)日：2014-10-28
申请号：US12267489
申请日：2008-11-07
申请人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
发明人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
CPC分类号： A61N1/0541 , A61N1/0472
摘要： A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.
摘要翻译： 耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。 电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。 所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。 该装置还包括具有多层结构的导线迹线，其为电极阵列的导电部分提供减小的宽度。 耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。 该设备旨在通过适当的电极设计实现最佳神经刺激，这是相对于市售的手工设备的显着改进。
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公开(公告)号：US08374698B2
公开(公告)日：2013-02-12
申请号：US11893939
申请日：2007-08-18
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/375
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
摘要翻译： 本发明是用于植入人体的改进的密封包装。 可植入装置包括具有导电通孔的非导电基底。 使用导电凸块将倒装芯片电路连接到基板，并电连接到通孔的第一子集。 倒装芯片电路可以包含一个或多个堆叠或折叠堆叠。 引线键合电路也附接到基板并电连接到通孔的第二子集。 盖子粘合到基底上。 盖，衬底和通孔形成改进的用于植入的密封包装。
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