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公开(公告)号:US08374698B2
公开(公告)日:2013-02-12
申请号:US11893939
申请日:2007-08-18
申请人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号: A61N1/375
CPC分类号: A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要: The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
摘要翻译: 本发明是用于植入人体的改进的密封包装。 可植入装置包括具有导电通孔的非导电基底。 使用导电凸块将倒装芯片电路连接到基板,并电连接到通孔的第一子集。 倒装芯片电路可以包含一个或多个堆叠或折叠堆叠。 引线键合电路也附接到基板并电连接到通孔的第二子集。 盖子粘合到基底上。 盖,衬底和通孔形成改进的用于植入的密封包装。
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公开(公告)号:US08412339B2
公开(公告)日:2013-04-02
申请号:US11924709
申请日:2007-10-26
申请人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号: A61N1/18
CPC分类号: A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译: 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路,其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖,其结合到所述非导电衬底,所述盖,所述非导电衬底和所述导电通孔形成气密封装。
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公开(公告)号:US08406887B2
公开(公告)日:2013-03-26
申请号:US13224104
申请日:2011-09-01
申请人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号: A61N1/375
CPC分类号: A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要: The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
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公开(公告)号:US20110319963A1
公开(公告)日:2011-12-29
申请号:US13224104
申请日:2011-09-01
申请人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人: Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号: A61F9/08
CPC分类号: A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译: 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路,其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖,其结合到所述非导电衬底,所述盖,所述非导电衬底和所述导电通孔形成气密封装。
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公开(公告)号:US20090118805A1
公开(公告)日:2009-05-07
申请号:US12168740
申请日:2008-07-07
申请人: Robert J. Greenberg , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Kelly H. McClure , Brian V. Mech , Rongqing Dai , David Daomin Zhou , Gaillard R. Nolan
发明人: Robert J. Greenberg , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Kelly H. McClure , Brian V. Mech , Rongqing Dai , David Daomin Zhou , Gaillard R. Nolan
CPC分类号: A61N1/0543 , A61N1/36046 , H05K1/118
摘要: In a visual prosthesis electrodes stimulate retinal tissue to induce the perception of light to a user implanted with the prosthesis. The prosthesis must have a return, or common, electrode to make a complete circuit with the retinal tissue. To avoid stimulating tissue with the return electrode, it is advantageous if the electrode is large.The invention involver a flexible circuit electrode array comprising a polymer base layer, metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue a polymer top layer deposited on said polymer base layer and said metal traces, and a return electrode separate from said stimulating electrodes.The flexible circuit electrode array comprises a secondary coil for receiving visual data; an electronics package electrically coupled to said receiving coil, and a plurality of stimulating electrode electrically coupled to said electronics package.
摘要翻译: 在视觉假体中,电极刺激视网膜组织以诱导植入假体的使用者对光的感知。 假体必须具有返回或常见的电极以与视网膜组织形成完整的电路。 为了避免用返回电极刺激组织,如果电极很大,则是有利的。 本发明涉及柔性电路电极阵列,其包括聚合物基底层,沉积在所述聚合物基底层上的金属迹线,包括适于刺激沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层的神经组织的电极和分离的回流电极 从所述刺激电极。 柔性电路电极阵列包括用于接收视觉数据的次级线圈; 电耦合到所述接收线圈的电子封装,以及电耦合到所述电子封装的多个刺激电极。
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公开(公告)号:US08874239B2
公开(公告)日:2014-10-28
申请号:US12267489
申请日:2008-11-07
申请人: Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
发明人: Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
CPC分类号: A61N1/0541 , A61N1/0472
摘要: A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.
摘要翻译: 耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。 电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。 所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。 该装置还包括具有多层结构的导线迹线,其为电极阵列的导电部分提供减小的宽度。 耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。 该设备旨在通过适当的电极设计实现最佳神经刺激,这是相对于市售的手工设备的显着改进。
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公开(公告)号:US20090143848A1
公开(公告)日:2009-06-04
申请号:US12267489
申请日:2008-11-07
申请人: Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
发明人: Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
IPC分类号: A61N1/05
CPC分类号: A61N1/0541 , A61N1/0472
摘要: A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.
摘要翻译: 耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。 电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。 所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。 该装置还包括具有多层结构的导线迹线,其为电极阵列的导电部分提供减小的宽度。 耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。 该设备旨在通过适当的电极设计实现最佳神经刺激,这是相对于市售的手工设备的显着改进。
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公开(公告)号:US20080288036A1
公开(公告)日:2008-11-20
申请号:US12032627
申请日:2008-02-15
申请人: Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
发明人: Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
IPC分类号: A61N1/04
CPC分类号: A61N1/0543 , A61N1/05 , A61N1/0541 , H05K1/0393 , H05K1/118
摘要: The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
摘要翻译: 本发明涉及柔性电路电极阵列,包括:聚合物基层; 沉积在所述聚合物基层上的金属痕迹,包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及嵌入在所述阵列中的至少一个支撑。 本发明还涉及一种柔性电路电极阵列,包括:聚合物基层; 沉积在所述聚合物基层上的金属痕迹,包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及将电极阵列与互连衬垫连接的折叠柔性电路电缆。 本公开还涉及一种制造柔性电路电极阵列的方法,包括:沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 将所述柔性电路电极阵列加热到模具中以在所述柔性电路电极阵列中形成三维形状,至少在基层,顶层或基底与顶层之间嵌入支撑件,和/或折叠柔性电路电缆 至少一次将电极阵列与互连衬垫连接在一起。
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公开(公告)号:US09861809B2
公开(公告)日:2018-01-09
申请号:US12032627
申请日:2008-02-15
申请人: Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
发明人: Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
CPC分类号: A61N1/0543 , A61N1/05 , A61N1/0541 , H05K1/0393 , H05K1/118
摘要: The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
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10.
公开(公告)号:US09643002B2
公开(公告)日:2017-05-09
申请号:US13167074
申请日:2011-06-23
申请人: Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
发明人: Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
CPC分类号: A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
摘要: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.
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