公开(公告)号：US08608291B2

公开(公告)日：2013-12-17

申请号：US13191558

申请日：2011-07-27

申请人： Yimin Guan ,  Eunki Hong

发明人： Yimin Guan ,  Eunki Hong

IPC分类号： B41J2/045

CPC分类号： B41J2/161 ,  B41J2/1628 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14241 ,  H01L41/0805 ,  H01L41/0815 ,  H01L41/0973 ,  H01L41/1876 ,  H01L41/314

摘要： A piezoelectric inkjet printhead is monolithically fabricated on a substrate. The printhead includes a plurality of cavities formed into the substrate, piezoelectric actuators disposed over the top of the cavities, a fluidic structure and an ink supply channel. The piezoelectric actuators are formed over the cavities using a sacrificial material which fills the cavities and is removed after the actuators are formed. The fluidic structure defines pressurizing chambers and channels connected to the ink supply channel. The fluidic structure has a plurality of nozzle holes formed on the top surface. The cavities are connected to either a venting channel formed from the backside of the substrate or a venting chamber formed inside the fluidic structures.

摘要翻译： 压电喷墨打印头被单片地制造在基板上。 打印头包括形成在基板中的多个空腔，设置在空腔顶部的压电致动器，流体结构和供墨通道。 使用填充空腔的牺牲材料在空腔上形成压电致动器，并且在致动器形成之后被移除。 流体结构限定了连接到供墨通道的加压室和通道。 流体结构具有形成在顶表面上的多个喷嘴孔。 空腔连接到从基板的背面形成的排气通道或形成在流体结构内部的排气室。

公开(公告)号：US20130202278A1

公开(公告)日：2013-08-08

申请号：US13556495

申请日：2012-07-24

申请人： EUNKI HONG ,  Steven Bergstedt ,  Yimin Guan

发明人： EUNKI HONG ,  Steven Bergstedt ,  Yimin Guan

IPC分类号： F24H1/10

CPC分类号： F04B19/24 ,  F04B19/006 ,  F28F3/12

摘要： A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation.

摘要翻译： 微流体泵包括一个或多个通道，其具有电阻加热器阵列，入口，出口和作为散热器的基板以及冷却装置的装置。 泵的运行时间为火焰延迟和/或周期到周期的延迟，以控制泵送速率并最大限度地减少泵在运行过程中液体的加热。

公开(公告)号：US07673972B2

公开(公告)日：2010-03-09

申请号：US11683572

申请日：2007-03-08

申请人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

发明人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2202/03 ,  B41J2202/11 ,  Y10T29/49401

摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.

摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

公开(公告)号：US07414262B2

公开(公告)日：2008-08-19

申请号：US11241221

申请日：2005-09-30

申请人： Frank E. Anderson ,  Robert W. Cornell ,  Yimin Guan

发明人： Frank E. Anderson ,  Robert W. Cornell ,  Yimin Guan

IPC分类号： H01L29/06

CPC分类号： H01L29/78603 ,  H01L27/1292 ,  H01L29/66757 ,  H01L29/74

摘要： Electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the printed material and substrate are part of an electronic device having at least three terminals, wherein the electronic device has a charge carrier mobility of at least 10 cm2/V-s. Multi-terminal devices can have a substrate including a doped semiconductor layer and at least two doped regions formed upon the substrate. The doped regions can be doped oppositely from the semiconductor layer and exhibit a charge carrier mobility of greater than 10 cm2/V-s. Methods for making the same are also disclosed.

摘要翻译： 诸如在柔性基底上具有柔性基底和印刷材料的电子器件。 在一个实施例中，印刷材料和基底是具有至少三个端子的电子器件的一部分，其中电子器件具有至少10cm 2 / V-s的电荷载流子迁移率。 多端子器件可以具有包括掺杂半导体层和形成在衬底上的至少两个掺杂区的衬底。 掺杂区域可以与半导体层相反地掺杂并且表现出大于10cm 2 / V-s的电荷载流子迁移率。 还公开了制备其的方法。

公开(公告)号：US20080084449A1

公开(公告)日：2008-04-10

申请号：US11838992

申请日：2007-08-15

申请人： Xiaorong Cai ,  Michael John Dixon ,  Yimin Guan ,  Elios Klemo ,  Bryan Dale McKinley ,  Paul Sacoto ,  Jeanne Marie Saldanha Singh ,  George Nelson Woolcott ,  Frank Edward Anderson

发明人： Xiaorong Cai ,  Michael John Dixon ,  Yimin Guan ,  Elios Klemo ,  Bryan Dale McKinley ,  Paul Sacoto ,  Jeanne Marie Saldanha Singh ,  George Nelson Woolcott ,  Frank Edward Anderson

IPC分类号： B41J2/015

CPC分类号： H05K3/125 ,  H05K1/0256 ,  H05K3/386 ,  H05K3/4664 ,  H05K2203/013 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156

摘要： The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method relates to the application of fluid composition receiving layers, conductive layers, and dielectric layers, such as in the provision of printed circuits.

摘要翻译： 本公开涉及用于制造电路的电路和方法，例如避免形成不期望的短路路径的电路和方法。 一种这样的方法维持介电层的布局区域内的流体组合物接收层的布局面积。 另一种这样的方法涉及流体组合物接收层，导电层和电介质层的应用，例如在提供印刷电路中。

公开(公告)号：US07296871B2

公开(公告)日：2007-11-20

申请号：US11025343

申请日：2004-12-29

申请人： Yimin Guan ,  Kristi M. Rowe

发明人： Yimin Guan ,  Kristi M. Rowe

IPC分类号： B41J2/393 ,  B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/14072

摘要： An integrated circuit having a plurality of devices. The plurality of devices have a plurality of device characteristics. A sectional cut through the integrated circuit reveals the plurality of device characteristics.

摘要翻译： 一种具有多个装置的集成电路。 多个装置具有多个装置特性。 通过集成电路的截面显示了多种器件特性。

公开(公告)号：US07195343B2

公开(公告)日：2007-03-27

申请号：US10927796

申请日：2004-08-27

申请人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

发明人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/164 ,  Y10T29/49401

摘要： A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

摘要翻译： 一种具有改进的低能量设计的微流体喷射装置结构及其方法。 这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。 在选自TaAl，Ta2N，TaAl（O，N），TaAlSi，Ti（N，O），WSi（O，N），TaAlN等的电阻层的绝缘层上形成多个加热电阻体， 和TaAl / TaAlN。 选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。 电极从第一金属导电层形成在牺牲层上，以提供与多个加热电阻器的阳极和阴极连接。 牺牲层在等离子体氧化过程中被氧化，以在多个加热电阻器上提供流体接触层。

公开(公告)号：US07080896B2

公开(公告)日：2006-07-25

申请号：US10760726

申请日：2004-01-20

申请人： Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan ,  George K. Parish

发明人： Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan ,  George K. Parish

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2202/03 ,  Y10T29/49082 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49163 ,  Y10T29/49346 ,  Y10T29/49401

摘要： A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

摘要翻译： 一种用于微流体喷射头的半导体衬底。 衬底包括设置在衬底上的多个流体喷射致动器。 每个流体喷射致动器包括薄加热器堆叠，其包括薄膜加热器和与加热器相邻的一个或多个保护层。 薄膜加热器由具有主要由AlN，TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料制成，并且具有约30至约100欧姆/平方的薄层电阻。 薄膜材料含有约30至约70原子％的钽，约10至约40原子％的铝和约5至约30原子％的氮。

公开(公告)号：US20060139411A1

公开(公告)日：2006-06-29

申请号：US11025343

申请日：2004-12-29

申请人： Yimin Guan ,  Kristi Rowe

发明人： Yimin Guan ,  Kristi Rowe

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/14072

摘要： An integrated circuit having a plurality of devices. The plurality of devices have a plurality of device characteristics. A sectional cut through the integrated circuit reveals the plurality of device characteristics.

摘要翻译： 一种具有多个装置的集成电路。 多个装置具有多个装置特性。 通过集成电路的截面显示了多种器件特性。

公开(公告)号：US07055756B2

公开(公告)日：2006-06-06

申请号：US10973106

申请日：2004-10-25

申请人： Frank E. Anderson ,  Yimin Guan

发明人： Frank E. Anderson ,  Yimin Guan

IPC分类号： G06K19/06 ,  H05K1/03 ,  H05K1/05

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2203/013 ,  Y10T428/24802 ,  Y10T436/209163

摘要： A method of fabricating an RFID antenna, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a conductive antenna. The invention also includes an RFID tag comprising: (a) a substrate including a plurality of micropores; (b) a microchip; and (c) an RFID antenna in electrical communication with the microchip and contacting the substrate, the RFID antenna comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.

摘要翻译： 一种制造RFID天线的方法，所述方法包括：（a）以预定图案将浆料沉积在基底上，所述基底包括多个微孔，用于从所述基底的表面排出所述浆液的流体成分，同时 将所述浆料的导电颗粒保持在所述基底的表面上; 和（b）干燥导电颗粒以将导电颗粒固定在基板的表面上并提供导电天线。 本发明还包括RFID标签，其包括：（a）包括多个微孔的基底; （b）微芯片; 和（c）与微芯片电连通并接触基板的RFID天线，RFID天线包括通过从喷墨打印机喷射浆料而沉积在基板上的导电颗粒。