公开(公告)号：US20060175622A1

公开(公告)日：2006-08-10

申请号：US11332594

申请日：2006-01-12

申请人： Peter Richards ,  Andrew Huibers ,  Satyadev Patel

发明人： Peter Richards ,  Andrew Huibers ,  Satyadev Patel

IPC分类号： H01L33/00 ,  H01L21/00 ,  G02B26/00

CPC分类号： B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

摘要： A projection system is disclosed herein. The projection system employs a spatial light modulator comprising an array of individually addressable pixels for modulating the incident light based on image data. The modulated light is projected on a screen for viewing.

公开(公告)号：US07019880B1

公开(公告)日：2006-03-28

申请号：US10927562

申请日：2004-08-25

申请人： Andrew Huibers ,  Satyadev Patel

发明人： Andrew Huibers ,  Satyadev Patel

IPC分类号： G02B26/00

CPC分类号： G02B26/0841

摘要： The micromirror of the present invention comprises a mirror plate having thereon a cavity allowing deformation of a hinge attached to the mirror plate and deflection of the mirror plate in operation.

摘要翻译： 本发明的微反射镜包括一个镜板，其上具有允许在镜面板上附接的铰链变形并且操作中的镜板偏转的腔体。

公开(公告)号：US20060044519A1

公开(公告)日：2006-03-02

申请号：US10927408

申请日：2004-08-25

申请人： Andrew Huibers ,  Satyadev Patel

发明人： Andrew Huibers ,  Satyadev Patel

IPC分类号： G03B21/26 ,  G02B26/00

CPC分类号： H04N5/7458 ,  G02B26/008 ,  G02B26/0841 ,  G03B21/008

摘要： A spatial light modulator is disclosed, along with methods for making such a modulator. The spatial light modulator comprises an array of micromirrors each having a hinge and a micromirror plate held via a hinge on a substrate, the micromirror plate being attached to the hinge such that the micromirror plate can rotate along a rotation axis and the hinge structure is located between the micromirror plate and the light source. The mirror plate is formed between the hinge and the substrate on which the hinge is formed. As a result, the hinge is exposed to the incident light during the operation.

摘要翻译： 公开了一种空间光调制器以及用于制造这种调制器的方法。 空间光调制器包括微镜阵列，每个微镜具有通过基板上的铰链保持的铰链和微镜板，微镜板附接到铰链，使得微镜板可以沿着旋转轴线旋转并且铰链结构位于 在微镜板和光源之间。 镜板形成在铰链和形成有铰链的基板之间。 结果，铰链在操作期间暴露于入射光。

公开(公告)号：US20060033977A1

公开(公告)日：2006-02-16

申请号：US11256035

申请日：2005-10-21

申请人： Satyadev Patel ,  Andrew Huibers

发明人： Satyadev Patel ,  Andrew Huibers

IPC分类号： G02F1/03 ,  G02F1/07

CPC分类号： G02B26/0841

摘要： A spatial light modulator comprises an array of micromirror devices each of which has a reflective and deflectable mirror plates. The mirror plates are moved between an ON and OFF state during operation, wherein the OFF state is a state wherein the mirror plate is not parallel to the substrate on which the mirror plate is formed. The micromirror device may have an ON state stopper for limiting the rotation of the mirror plate at the ON state angle, but does not have an OFF state angle. The non-zero OFF state is achieved by attaching the mirror plate to a deformable hinge held by a hinge support that is curved at the natural resting state.

摘要翻译： 空间光调制器包括微镜器件的阵列，每个微镜器件具有反射和可偏转的镜板。 在操作期间，镜板在ON和OFF状态之间移动，其中OFF状态是其中镜板不平行于其上形成有镜板的基板的状态。 微镜装置可以具有用于将镜板的旋转限制在ON状态角但不具有OFF状态角的ON状态止动器。 通过将镜板附接到由在自然静止状态下弯曲的铰链支撑件保持的可变形铰链来实现非零关闭状态。

公开(公告)号：US20060007522A1

公开(公告)日：2006-01-12

申请号：US11216594

申请日：2005-08-30

申请人： Andrew Huibers ,  Satyadev Patel

发明人： Andrew Huibers ,  Satyadev Patel

IPC分类号： G02B26/00

CPC分类号： G02B26/0841

摘要： A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is parallel to but offset from a diagonal of the mirror plate when viewed from the top. An imaginary line connecting the two posts is not parallel to either diagonal of the mirror plate.

公开(公告)号：US20050260793A1

公开(公告)日：2005-11-24

申请号：US11102214

申请日：2005-04-07

申请人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

发明人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/44

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US20050180686A1

公开(公告)日：2005-08-18

申请号：US11102186

申请日：2005-04-07

申请人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

发明人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  G02B6/26 ,  G02B6/42

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US20050173711A1

公开(公告)日：2005-08-11

申请号：US11094087

申请日：2005-03-29

申请人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

发明人： Satyadev Patel ,  Andrew Huibers ,  Steve Chiang

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L27/15

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US20050170546A1

公开(公告)日：2005-08-04

申请号：US11094086

申请日：2005-03-29

申请人： Satyadev Patel ,  Andrew Huibers

发明人： Satyadev Patel ,  Andrew Huibers

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/00

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

摘要翻译： 公开了一种用于形成微机械装置的方法。 该方法包括在第一衬底上多次完全或部分地形成一个或多个微机械结构。 将第二基板接合到第一基板上以覆盖各自具有一个或多个微机械结构的多个区域，以便形成基板组件。 然后将基板组件分离成单个管芯，每个管芯具有保持在第一衬底的一部分上的一个或多个微机械结构，其中第二衬底的一部分结合到第一衬底部分。 最后，从每个管芯移除第二衬底部分以露出第一衬底部分上的一个或多个微机械结构。 本发明还涉及一种用于形成微机械装置的方法，包括：在第一基板上的一个或多个区域中形成一个或多个微机械结构; 将盖接合到第一基板上以覆盖每个具有一个或多个微机械结构的一个或多个区域，以便形成基板组件; 在一段时间之后，移除盖以露出一个或多个微机械结构。 在接合盖子和稍后移除盖子之间的时间段期间，可以对基板组件进行单切割，检查，照射，退火，模具附接，运输和/或存储。

公开(公告)号：US20050094240A1

公开(公告)日：2005-05-05

申请号：US10698563

申请日：2003-10-30

申请人： Andrew Huibers ,  Satyadev Patel

发明人： Andrew Huibers ,  Satyadev Patel

IPC分类号： G02B26/08 ,  G02B26/00

CPC分类号： G02B26/0841

摘要： A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is parallel to but offset from a diagonal of the mirror plate when viewed from the top. An imaginary line connecting the two posts is not parallel to either diagonal of the mirror plate.

摘要翻译： 在显示系统中使用的空间光调制器的微镜阵列的微镜包括附接到由在基板上形成的两个支柱支撑的铰链的镜板。 此外，当从顶部观察时，镜板可操作以沿着平行于但偏离镜板的对角线的旋转轴线旋转。 连接两个柱的假想线不平行于镜板的任一对角线。