公开(公告)号：US06399463B1

公开(公告)日：2002-06-04

申请号：US09797756

申请日：2001-03-01

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2146

CPC classification number: H01L21/3043 ,  H01L21/78

Abstract: A wafer is singulated from the back-side surface of the wafer using laser ablation, thus protecting the front-side surface of the wafer and, more particularly, the integrated circuits and/or functional units on the front-side surface. Since, according to the invention, no saw blade is used, the width of the scribe lines does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe lines is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

Abstract translation: 使用激光烧蚀从晶片的背面形成晶片，从而保护晶片的前侧表面，更具体地，保护前表面上的集成电路和/或功能单元。 由于根据本发明，没有使用锯片，所以划线的宽度不需要大于来自激光器的光束的宽度加上对准的最小公差。 结果，使用本发明，划线的宽度比现有技术方法所需的划线宽度小24倍。

公开(公告)号：US06309943B1

公开(公告)日：2001-10-30

申请号：US09558392

申请日：2000-04-25

Applicant: Thomas P. Glenn ,  Steven Webster ,  Gary L. Swiss

Inventor： Thomas P. Glenn ,  Steven Webster ,  Gary L. Swiss

IPC: H01L2176

CPC classification number: H01L23/544 ,  H01L21/481 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/6834 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method includes identifying and determining a position of a scribe grid on a front-side surface of a wafer with a camera. Based on this information, a laser is fired to form an alignment mark on the back-side surface of the wafer. Advantageously, the alignment mark is positioned with respect to the scribe grid to within tight tolerance. The wafer is then cut from the backside surface using the alignment mark as a reference. Of importance, the wafer is cut from the back-side surface thus protecting the front-side surface of the wafer. Of further importance, the wafer is precisely cut such that the scribe line is not fabricated with the extra large width of scribe lines of conventional wafers designed to be cut from the back-side surface.

Abstract translation: 一种方法包括使用照相机识别并确定在晶片的前侧表面上的划线格栅的位置。 基于该信息，在晶片的背面表面上烧制激光以形成对准标记。 有利地，对准标记相对于划线网格定位在紧公差内。 然后使用对准标记作为参考，从背面切割晶片。 重要的是，从后侧表面切割晶片，从而保护晶片的前侧表面。 更重要的是，晶片被精确地切割，使得划线不是用设计成从后侧表面切割的常规晶片的超大宽度的划线制造的。

公开(公告)号：US06266197B1

公开(公告)日：2001-07-24

申请号：US09458033

申请日：1999-12-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: G02B702

CPC classification number: H04N5/2254 ,  G01J5/045 ,  G01J5/0875 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

Abstract translation: 同时制造图像传感器封装以最小化与每个单独的图像传感器封装相关联的成本。 为了制造图像传感器封装，将窗口模制成模制化合物以形成模制的窗口阵列。 衬底包括以阵列形式整体连接在一起的多个单独衬底。 图像传感器被附接并电连接到相应的各个基板。 粘合剂层将模制的窗口阵列附着到基底上。 衬底和附着的模制窗阵列被分割成多个单独的图像传感器封装。

公开(公告)号：US20130329126A1

公开(公告)日：2013-12-12

申请号：US13631642

申请日：2012-09-28

Applicant: Douglas Stuart Brodie ,  Steven Webster ,  Terence N. Tam

Inventor： Douglas Stuart Brodie ,  Steven Webster ,  Terence N. Tam

IPC: H04N5/225 ,  B23P17/04

CPC classification number: G02B7/023 ,  G02B7/04 ,  G02B13/001

Abstract: A camera module has an image sensor and a lens assembly that includes a lens barrel having a first cylindrical portion that includes an externally threaded portion and a second cylindrical portion that has a larger diameter than the externally threaded portion. A lens moving mechanism includes a movable sleeve having internal threads that receive the externally threaded portion of the lens assembly. The lens moving mechanism is coupled to the image sensor such that the second cylindrical portion of the lens assembly is closest to the image sensor. The camera module is assembled by inserting the lens assembly into the lens moving mechanism from the side closest to the image sensor. An installation tool may engage the second cylindrical portion to rotate the lens assembly and engage the threaded portions. Features may be provided to retain the lens assembly in the lens moving mechanism before joining the threaded portions.

Abstract translation: 相机模块具有图像传感器和透镜组件，其包括具有包括外螺纹部分的第一圆柱形部分和具有比外螺纹部分更大直径的第二圆柱形部分的透镜镜筒。 透镜移动机构包括具有接纳透镜组件的外螺纹部分的内螺纹的可移动套筒。 透镜移动机构联接到图像传感器，使得透镜组件的第二圆柱形部分最靠近图像传感器。 通过从最靠近图像传感器的一侧将透镜组件插入透镜移动机构来组装相机模块。 安装工具可以接合第二圆柱形部分以旋转透镜组件并接合螺纹部分。 可以提供特征以在接合螺纹部分之前将透镜组件保持在透镜移动机构中。

公开(公告)号：US20130063629A1

公开(公告)日：2013-03-14

申请号：US13229363

申请日：2011-09-09

Applicant: Steven Webster ,  Ning Y. Chan

Inventor： Steven Webster ,  Ning Y. Chan

IPC: H04N9/097

CPC classification number: G02B27/1013 ,  G02B13/009 ,  G02B15/177 ,  G02B27/149 ,  G02B27/646 ,  G03B17/17 ,  G03B33/12 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H04N5/23248 ,  H04N5/23296 ,  H04N2209/049

Abstract: A digital camera component is described that has a light splitter cube having an entrance face to receive incident light from a camera scene. The cube splits the incident light into first, second, and third color components that emerge from the cube through a first face, a second face, and a third face of the cube, respectively. First, second, and third image sensors are provided, each being positioned to receive a respective one of the color components that emerge from the first, second, and third faces of the cube. Other embodiments are also described and claimed.

公开(公告)号：US20120042254A1

公开(公告)日：2012-02-16

申请号：US13277024

申请日：2011-10-19

Applicant: Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

Inventor： Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

IPC: G06F3/01 ,  G06F15/16

CPC classification number: G06F9/451

Abstract: A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.

Abstract translation: 公开了一种用于指示与第一视觉处理器（VP）通信的用户界面（UI）与第二（VP）建立通信的方法。 本发明在具有多个VP和至少一个UI的机器视觉系统中是有用的。 该方法包括以下步骤：为每个VP提供用于建立VP与UI之间的通信的链接功能; 并激活链接功能，以向UI发出指令以建立与另一个VP的通信。 链接功能使得UI上的远程VP的本地动态显示以及提供连续更新的显示的动态连接表示连接到UI的VP的当前状态。 操作员可以观察系统中任何VP的结果并更改参数，而无需首先了解机器视觉系统的架构。

公开(公告)号：US08056009B2

公开(公告)日：2011-11-08

申请号：US09873163

申请日：2001-06-02

Applicant: Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

Inventor： Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

IPC: G06F3/00

CPC classification number: G06F9/451

Abstract: A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.

公开(公告)号：US07786429B2

公开(公告)日：2010-08-31

申请号：US12221948

申请日：2008-08-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01J5/02

CPC classification number: H01L27/14625 ,  B29C33/0022 ,  B29C43/36 ,  B29C2043/023 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US07729606B2

公开(公告)日：2010-06-01

申请号：US11682275

申请日：2007-03-05

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Chun-Hung Lin

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Chun-Hung Lin

IPC: G02B7/04 ,  G02B7/02 ,  G03B3/00 ,  G03B13/00 ,  H04N5/225

CPC classification number: G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

Abstract translation: 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

公开(公告)号：US07696619B2

公开(公告)日：2010-04-13

申请号：US12060106

申请日：2008-03-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Chao-Yuan Chan ,  Shih-Min Lo

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Chao-Yuan Chan ,  Shih-Min Lo

IPC: H01L23/488

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

Abstract translation: 组合包括第一芯片封装单元和放置第一芯片封装单元的第二芯片封装单元。 第一和第二芯片封装单元中的每一个包括具有第一表面，第二表面，电连接到第一表面的芯片封装的衬底和形成在第一表面和第二表面上的多个焊盘。 第一芯片封装单元的第一表面上的焊盘分别与第二芯片封装单元的表面上的焊盘电连接。 电连接到第一表面的芯片封装被基板封闭，并且第二表面上的焊盘被配置为该组合的接口端子。