公开(公告)号：US5561642A

公开(公告)日：1996-10-01

申请号：US526875

申请日：1995-09-12

申请人： Jun Saito ,  Shinichi Kurita

发明人： Jun Saito ,  Shinichi Kurita

IPC分类号： G11B7/00 ,  G11B7/0045 ,  G11B7/125 ,  G11B11/105 ,  G11B11/00

CPC分类号： G11B7/126 ,  G11B11/1053 ,  G11B7/0045 ,  G11B7/0062 ,  G11B7/1267

摘要： This invention relates to an optical recording method and apparatus, in which the intensity of a laser beam to be radiated onto an optical recording medium is raised from an intensity P.sub.pre for maintaining a pre-heat state in which the temperature of the medium surface becomes a predetermined temperature, to P.sub.W1 higher than P.sub.pre, the intensity is reduced to an intensity P.sub.LT lower than P.sub.W1 after P.sub.W1 is maintained for a time T.sub.W1, and thereafter, the laser beam is intensity-modulated between P.sub.LT and an intensity P.sub.W2 higher than P.sub.LT so as to form a mark on the optical recording medium. When at least one of P.sub.W2, P.sub.LT, and a time T.sub.W2 for maintaining P.sub.W2 is controlled, the medium temperature, after an elapse of T.sub.W1, at the peak temperature position or the spot center position of the laser beam radiated onto the medium surface is equal to the medium temperature after an elapse of T.sub.W2.

摘要翻译： 本发明涉及一种光记录方法和装置，其中要辐射到光记录介质上的激光束的强度从用于维持介质表面的温度变为的预热状态的强度Ppre升高 在PW1高于Ppre的情况下，在PW1保持一段时间TW1之后，将强度降低到低于PW1的强度PLT，之后激光束在PLT和比PLT高的PW2之间进行强度调制，以便 以在光学记录介质上形成标记。 当PW2，PLT以及用于维持PW2的时间TW2中的至少一个被控制时，TW1之后的中间温度在辐射到介质表面上的激光束的峰值温度位置或光点中心位置相等 经过TW2后的介质温度。

公开(公告)号：US4788409A

公开(公告)日：1988-11-29

申请号：US84555

申请日：1987-08-11

申请人： Takashi Yamade ,  Seishi Watahiki ,  Yasuzi Sakuma ,  Masayoshi Yamaguchi ,  Shinichi Kurita

发明人： Takashi Yamade ,  Seishi Watahiki ,  Yasuzi Sakuma ,  Masayoshi Yamaguchi ,  Shinichi Kurita

IPC分类号： B23K9/167 ,  B23K9/235 ,  B23K10/00 ,  B23K10/02 ,  B23K5/00

CPC分类号： B23K10/02 ,  B23K9/167

摘要： A plasma welding method has successive steps including pre-heating of members to be welded, tack welding of the members for tentatively fixing these members, keyhole welding for completely welding the members to each other, and finish padding. These steps are automatically conducted by a single plasma welding apparatus operative in accordance with a programmed sequence including data concerning the optimum conditions of operation in each step in relation to the conditions such as sizes and materials of the members to be welded. The apparatus has a welding torch, a welding head on which the welding torch is mounted for rotation, a controller adapted for storing the optimum welding conditions for successive steps of the welding process in relation to the conditions of the members to be welded, a power supply system for transmitting welding current and welding speed signal to the welding head in accordance with a command provided by the controller, and a gas supply system for supplying a plasma gas at a rate determined in accordance with a command from the controller.

公开(公告)号：US4770105A

公开(公告)日：1988-09-13

申请号：US892285

申请日：1986-08-04

申请人： Atsushi Takagi ,  Shinichi Kurita ,  Seishi Watahiki ,  Yasuzi Sakuma ,  Kiyoshi Sakamoto ,  Chikara Sato

发明人： Atsushi Takagi ,  Shinichi Kurita ,  Seishi Watahiki ,  Yasuzi Sakuma ,  Kiyoshi Sakamoto ,  Chikara Sato

IPC分类号： G01N23/18 ,  B61B13/10 ,  F16L55/30 ,  F16L55/32 ,  G01N29/04 ,  G21C17/017 ,  G01M19/00

CPC分类号： G21C17/017 ,  F16L55/30 ,  F16L55/32 ,  F16L2101/30

摘要： A piping travelling apparatus having a plurality of continuous treads driven by motors through transmission gearing. The continuous treads are mounted to a frame and spaced apart a predetermined distance peripherally of the inner wall surface of the piping. At least one of the continuous treads is kept in contact with the inner wall surface of the piping no matter what the posture of the apparatus may be, so that the apparatus can travel without any trouble even if its posture undergoes a change when it moves along elevations and depressions on the inner wall surface of the piping or negotiates the boundary between different levels of the inner wall surface or bends of the piping. The apparatus enables a travel through piping of relatively small diameter having vertical or steeply slanted pipes to be made without any trouble.

摘要翻译： 一种管道传送装置，具有通过传动装置由马达驱动的多个连续胎面。 连续的胎面安装到框架并且在管道的内壁表面的外围隔开预定距离。 连续的胎面中的至少一个与管道的内壁表面保持接触，不管装置的姿势如何，使得即使其姿势在其移动时其姿势发生变化，该装置也可以无障碍地行进 在管道的内壁表面上的高度和凹陷或协调内壁表面的不同层次或管道的弯曲之间的边界。 该装置能够在没有任何麻烦的情况下通过具有垂直或陡倾斜管道的相对较小直径的管道行进。

公开(公告)号：US20140170785A1

公开(公告)日：2014-06-19

申请号：US14126211

申请日：2012-06-18

申请人： Shinichi Kurita ,  Beom Soo Kim

发明人： Shinichi Kurita ,  Beom Soo Kim

IPC分类号： H01L51/56

CPC分类号： H01L51/56 ,  C23C16/042

摘要： A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate.

摘要翻译： 一种用于封装有机发光二极管（OLED）器件的系统和方法，其通过使衬底和多个掩模能够被有效地接收到真空处理环境中，在一个或多个用于沉积封装层的处理室之间传送的真空处理环境中，以及 从处理系统中删除。 封装有机发光二极管（OLED）器件的方法包括将一个或多个掩模定位在衬底上以将封装层沉积在设置在衬底上的OLED器件上。 用于封装有机发光二极管（OLED）器件的处理系统包括一个或多个传送室，耦合到每个传送室的一个或多个负载锁定室，并可操作以将掩模接收到真空环境中，以及一个或多个处理室 耦合到每个传送室并可操作以将封装层沉积在衬底上。

公开(公告)号：USD687535S1

公开(公告)日：2013-08-06

申请号：US29436342

申请日：2012-11-05

申请人： Makoto Inagawa ,  Shinichi Kurita

设计人： Makoto Inagawa ,  Shinichi Kurita

公开(公告)号：US20120251964A1

公开(公告)日：2012-10-04

申请号：US13284815

申请日：2011-10-28

申请人： MAKOTO INAGAWA ,  Shinichi Kurita

发明人： MAKOTO INAGAWA ,  Shinichi Kurita

IPC分类号： F27D3/12 ,  F27D3/00

CPC分类号： F27B17/0025 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67309 ,  H01L21/6734

摘要： The present invention generally relates to methods and apparatus for handling of substrates in a thermal treatment chamber. In one embodiment, an apparatus is provided. The apparatus includes a chamber body having sidewalls, a substrate support assembly disposed in the chamber body, the substrate support assembly movable in a first direction within the chamber body, and two or more support fingers coupled to the sidewalls, the two or more support fingers being movable in a second direction within the chamber body, the second direction being transverse to the first direction.

摘要翻译： 本发明一般涉及用于处理热处理室中的衬底的方法和设备。 在一个实施例中，提供了一种装置。 该装置包括具有侧壁的室主体，设置在室主体中的基板支撑组件，可在室主体内沿第一方向移动的基板支撑组件以及联接到侧壁的两个或多个支撑指，两个或多个支撑指 可在腔体内沿第二方向移动，第二方向横向于第一方向。

公开(公告)号：US07847566B2

公开(公告)日：2010-12-07

申请号：US11940432

申请日：2007-11-15

申请人： Matthias Brunner ,  Shinichi Kurita ,  Ralf Schmid ,  Fayez (Frank) E. Abboud ,  Benjamin Johnston ,  Paul Bocian ,  Emanuel Beer

发明人： Matthias Brunner ,  Shinichi Kurita ,  Ralf Schmid ,  Fayez (Frank) E. Abboud ,  Benjamin Johnston ,  Paul Bocian ,  Emanuel Beer

IPC分类号： G01R31/26

CPC分类号： G09G3/006 ,  G01R31/2893 ,  G01R31/305

摘要： A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.

摘要翻译： 描述了一种在基板上测试电子器件的方法。 该方法包括将可配置的探测器放置在第一衬底上，测试第一衬底，重新配置可配置的探测器，将可配置的探测器放置在第二衬底上，以及测试第二衬底。

公开(公告)号：US07784164B2

公开(公告)日：2010-08-31

申请号：US11214475

申请日：2005-08-29

申请人： John M. White ,  Donald Verplancken ,  Shinichi Kurita

发明人： John M. White ,  Donald Verplancken ,  Shinichi Kurita

IPC分类号： B23P11/00

CPC分类号： H01L21/67236 ,  H01L21/67196 ,  Y10S414/135 ,  Y10S414/139 ,  Y10T29/49826 ,  Y10T29/53

摘要： A non-polygon shaped, multi-piece chamber is provided. A non-polygon shaped, multi-piece chamber may include (1) a central piece having a first side and a second side, (2) a first side piece adapted to couple with the first side of the central piece, and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece, and the second side piece form a cylindrical overall shape when coupled together. Numerous other aspects are provided.

摘要翻译： 提供非多边形形状的多片式室。 非多边形多片式室可以包括（1）具有第一侧和第二侧的中心件，（2）适于与中心件的第一侧连接的第一侧件，以及（3） 适于与中心件的第二侧联接的第二侧件。 当连接在一起时，中心件，第一侧件和第二侧件形成圆柱形的整体形状。 提供了许多其他方面。

公开(公告)号：US20100051111A1

公开(公告)日：2010-03-04

申请号：US12538237

申请日：2009-08-10

申请人： Takayuki Matsumoto ,  Shinichi Kurita

发明人： Takayuki Matsumoto ,  Shinichi Kurita

IPC分类号： F15D1/00 ,  F16K3/00

CPC分类号： F16K3/188 ,  F16K51/02 ,  H01L21/67772 ,  Y10T137/0391

摘要： Embodiments disclosed herein generally relate to methods for sealing a processing chamber with a slit valve door. The door initially raises from a position below the opening for the processing chamber to a raised position. The door then expands until an O-ring that is on the door just touches the sealing surface. Then, the door expands again to compress the O-ring against the sealing surface. The door expands by flowing a gas into the interior volume of the door. By controlling the pressure buildup within the door, the speed with which the door expands is controlled to ensure that the door gently contacts the sealing surface and then compresses against the sealing surface. Thus, the door may be prevented from contacting the sealing surface with too great a force that may jolt or shake the processing chamber and produce undesired particles that may contaminate the process.

摘要翻译： 本文公开的实施例通常涉及用狭缝阀门密封处理室的方法。 门最初从处理室的开口下方的位置升高到升高位置。 门然后膨胀，直到门上的O形圈刚好碰到密封面。 然后，门再次膨胀以将O形环压靠在密封表面上。 通过将气体流入门的内部空间来扩大门。 通过控制门内的压力积分，控制门膨胀的速度，以确保门轻轻地接触密封表面，然后压靠密封表面。 因此，可以防止门用太大的力使密封表面接触，该力可能使处理室震动或摇晃并产生可能污染该过程的不期望的颗粒。

公开(公告)号：US20090321399A1

公开(公告)日：2009-12-31

申请号：US12422208

申请日：2009-04-10

申请人： Makoto Inagawa ,  Shinichi Kurita ,  Bassam Shamoun ,  Sriram Krishnaswami ,  Michael D. Shirk ,  Kevin L. Cunningham

发明人： Makoto Inagawa ,  Shinichi Kurita ,  Bassam Shamoun ,  Sriram Krishnaswami ,  Michael D. Shirk ,  Kevin L. Cunningham

IPC分类号： B23K26/38

CPC分类号： B23K26/364 ,  B23K26/042 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/083 ,  B23K26/40 ,  B23K2103/172

摘要： Methods and systems for improving the alignment between a previously formed feature and a subsequently formed feature are provided. An exemplary method can include laser scribing a workpiece (104, 550) having a previously formed first feature. The exemplary method includes imaging the workpiece (104, 550) with an imaging device (320, 420, 554, 640) so as to capture a plurality of positions of the first feature on the workpiece (104, 550) relative to the laser-scribing device (100). The exemplary method further includes using the captured positions to align output from the laser-scribing device (100) in order to form a second feature on the workpiece (104, 550) at a controlled distance from the first feature.

摘要翻译： 提供了用于改善先前形成的特征与随后形成的特征之间的对准的方法和系统。 示例性的方法可以包括激光划刻具有先前形成的第一特征的工件（104,550）。 该示例性方法包括用成像装置（320,420,554,640）对工件（104,550）进行成像，以便相对于激光打印机捕获工件（104,550）上的第一特征的多个位置， 划线装置（100）。 该示例性方法还包括使用所捕获的位置来对齐来自激光划线装置（100）的输出，以便在距离第一特征的受控距离处在工件（104,550）上形成第二特征。