公开(公告)号：US20140170785A1

公开(公告)日：2014-06-19

申请号：US14126211

申请日：2012-06-18

申请人： Shinichi Kurita ,  Beom Soo Kim

发明人： Shinichi Kurita ,  Beom Soo Kim

IPC分类号： H01L51/56

CPC分类号： H01L51/56 ,  C23C16/042

摘要： A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate.

摘要翻译： 一种用于封装有机发光二极管（OLED）器件的系统和方法，其通过使衬底和多个掩模能够被有效地接收到真空处理环境中，在一个或多个用于沉积封装层的处理室之间传送的真空处理环境中，以及 从处理系统中删除。 封装有机发光二极管（OLED）器件的方法包括将一个或多个掩模定位在衬底上以将封装层沉积在设置在衬底上的OLED器件上。 用于封装有机发光二极管（OLED）器件的处理系统包括一个或多个传送室，耦合到每个传送室的一个或多个负载锁定室，并可操作以将掩模接收到真空环境中，以及一个或多个处理室 耦合到每个传送室并可操作以将封装层沉积在衬底上。

公开(公告)号：US09076991B2

公开(公告)日：2015-07-07

申请号：US14126211

申请日：2012-06-18

申请人： Shinichi Kurita ,  Beom Soo Kim

发明人： Shinichi Kurita ,  Beom Soo Kim

IPC分类号： H01L21/00 ,  H01L51/56 ,  C23C16/04

CPC分类号： H01L51/56 ,  C23C16/042

摘要： A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate.

摘要翻译： 一种用于封装有机发光二极管（OLED）器件的系统和方法，其通过使衬底和多个掩模能够被有效地接收到真空处理环境中，在一个或多个用于沉积封装层的处理室之间传送的真空处理环境中，以及 从处理系统中删除。 封装有机发光二极管（OLED）器件的方法包括将一个或多个掩模定位在衬底上以将封装层沉积在设置在衬底上的OLED器件上。 用于封装有机发光二极管（OLED）器件的处理系统包括一个或多个传送室，耦合到每个传送室的一个或多个负载锁定室，并可操作以将掩模接收到真空环境中，以及一个或多个处理室 耦合到每个传送室并可操作以将封装层沉积在衬底上。

公开(公告)号：US09922854B2

公开(公告)日：2018-03-20

申请号：US13098253

申请日：2011-04-29

申请人： Shinichi Kurita ,  Jozef Kudela ,  Suhail Anwar ,  John M. White ,  Dong-Kil Yim ,  Hans Georg Wolf ,  Dennis Zvalo ,  Makoto Inagawa ,  Ikuo Mori

发明人： Shinichi Kurita ,  Jozef Kudela ,  Suhail Anwar ,  John M. White ,  Dong-Kil Yim ,  Hans Georg Wolf ,  Dennis Zvalo ,  Makoto Inagawa ,  Ikuo Mori

IPC分类号： C23C16/458 ,  C23C16/46 ,  C23C16/511 ,  C23C16/54 ,  H01J37/32 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67712 ,  C23C16/4587 ,  C23C16/46 ,  C23C16/463 ,  C23C16/511 ,  C23C16/54 ,  H01J37/32192 ,  H01J37/3222 ,  H01J37/32513 ,  H01J37/32522 ,  H01J37/32889 ,  H01J37/32899 ,  H01L21/67098 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67201

摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

公开(公告)号：US09382621B2

公开(公告)日：2016-07-05

申请号：US12700484

申请日：2010-02-04

申请人： Soo Young Choi ,  Robin L. Tiner ,  Shinichi Kurita ,  John M. White ,  Carl A. Sorensen ,  Jeffrey A. Kho ,  Suhail Anwar ,  Makoto Inagawa ,  Gaku Furuta

发明人： Soo Young Choi ,  Robin L. Tiner ,  Shinichi Kurita ,  John M. White ,  Carl A. Sorensen ,  Jeffrey A. Kho ,  Suhail Anwar ,  Makoto Inagawa ,  Gaku Furuta

IPC分类号： C23C16/509 ,  C23C16/458 ,  H01J37/32 ,  H01L21/67

CPC分类号： C23C16/5096 ,  C23C16/4585 ,  H01J37/32091 ,  H01J37/32174 ,  H01J37/32568 ,  H01L21/67069

摘要： A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.

摘要翻译： 描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。 该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。 该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF器件中的一个或两个的位移电极实现接地返回路径，耦合到腔室的底部的RF器件和 电极或其组合。

公开(公告)号：US08877553B2

公开(公告)日：2014-11-04

申请号：US13195592

申请日：2011-08-01

申请人： John M. White ,  Shinichi Kurita ,  Takayuki Matsumoto

发明人： John M. White ,  Shinichi Kurita ,  Takayuki Matsumoto

IPC分类号： H01L21/00 ,  F16K51/02

CPC分类号： F16K51/02 ,  Y10S438/905 ,  Y10T29/49412

摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.

摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。

公开(公告)号：US08528762B2

公开(公告)日：2013-09-10

申请号：US12534534

申请日：2009-08-03

申请人： Shinichi Kurita ,  Mehran Behdjat ,  Makoto Inagawa

发明人： Shinichi Kurita ,  Mehran Behdjat ,  Makoto Inagawa

IPC分类号： B65D6/28

CPC分类号： B65D7/06 ,  B23K15/0006 ,  B65D7/38 ,  H01L21/67379

摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.

摘要翻译： 本文公开的实施例涉及已经焊接在一起的大型真空室主体。 腔体可以在其中的至少一个表面上具有高发射率涂层。 由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。 这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。 室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。 高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

公开(公告)号：USD670372S1

公开(公告)日：2012-11-06

申请号：US29403680

申请日：2011-10-10

申请人： Makoto Inagawa ,  Shinichi Kurita

设计人： Makoto Inagawa ,  Shinichi Kurita

公开(公告)号：US08206075B2

公开(公告)日：2012-06-26

申请号：US11145018

申请日：2005-06-02

申请人： John M. White ,  Shinichi Kurita ,  William N. Sterling ,  Yoshiaki Tanase

发明人： John M. White ,  Shinichi Kurita ,  William N. Sterling ,  Yoshiaki Tanase

IPC分类号： H01L21/67 ,  C23C16/00

CPC分类号： H01L21/67126 ,  H01L21/67201

摘要： In certain aspects, a load lock chamber is provided that includes a body having at least one sealing surface wall including a sealing surface. The sealing surface wall has an opening adjacent the sealing surface adapted to input or output a substrate. The body further includes a plurality of side walls. The load lock chamber also includes a top coupled to the body. The top includes one or more openings that divide the top into a first portion and a second portion. The load lock chamber further includes one or more top sealing members adapted to cover each opening of the top. Each top sealing member absorbs a movement of the first portion of the top relative to the second portion of the top. Numerous other aspects are provided.

摘要翻译： 在某些方面，提供了一种装载锁定室，其包括具有包括密封表面的至少一个密封表面壁的主体。 密封表面壁具有邻近密封表面的开口，适于输入或输出基底。 身体还包括多个侧壁。 负载锁定室还包括联接到主体的顶部。 顶部包括将顶部分成第一部分和第二部分的一个或多个开口。 负载锁定室还包括适于覆盖顶部的每个开口的一个或多个顶部密封构件。 每个顶部密封构件吸收顶部相对于顶部的第二部分的第一部分的运动。 提供了许多其他方面。

公开(公告)号：US08070408B2

公开(公告)日：2011-12-06

申请号：US12199341

申请日：2008-08-27

申请人： Mehran Behdjat ,  Shinichi Kurita ,  Makoto Inagawa ,  Suhail Anwar

发明人： Mehran Behdjat ,  Shinichi Kurita ,  Makoto Inagawa ,  Suhail Anwar

IPC分类号： H01L21/677

CPC分类号： H01L21/67201 ,  H01L21/67236

摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.

摘要翻译： 本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。 负载锁定室可以具有一个或多个单独的环境隔离环境。 每个处理环境可以具有用于抽真空的多个排气口。 排气口可以位于处理环境的拐角处。 当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。 由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。 因此，可能降低衬底污染。

公开(公告)号：US07665951B2

公开(公告)日：2010-02-23

申请号：US11421793

申请日：2006-06-02

申请人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

发明人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

IPC分类号： B65G49/07

CPC分类号： H01L21/67201 ,  C23C14/566 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67751 ,  Y10S414/139

摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.

摘要翻译： 本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。 在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。