摘要:
A method of fabricating a semiconductor device having a metal gate pattern is provided in which capping layers are used to control the relative oxidation rates of portions of the metal gate pattern during a oxidation process. The capping layer may be a multilayer structure and may be etched to form insulating spacers on the sidewalls of the metal gate pattern. The capping layer(s) allow the use of a selective oxidation process, which may be a wet oxidation process utilizing partial pressures of both H2O and H2 in an H2-rich atmosphere, to oxidize portions of the substrate and metal gate pattern while suppressing the oxidation of metal layers that may be included in the metal gate pattern. This allows etch damage to the silicon substrate and edges of the metal gate pattern to be reduced while substantially maintaining the original thickness of the gate insulating layer and the conductivity of the metal layer(s).
摘要:
A base station is capable of performing 4-beamforming using Radio Units (RU), each having two paths in a wireless communication system. The base station includes a Digital Unit (DU), a first RU, and a second RU. The DU performs a mutual conversion function between an information bit line and a digital signal, calculates beamforming coefficients for 4-beamforming, and performs the 4-beamforming using the beamforming coefficients. The first RU has two Radio Frequency (RF) paths, extracts a clock signal from a digital signal from the DU, and provides the clock signal to the second RU. The second RU has two RF paths and operates according to the clock signal provided from the first RU.
摘要:
This invention relates to a non-sulfurous statuary material and a method of manufacturing the same, and particularly, to a novel statuary material containing no sulfur, which is capable of substituting for a conventional statuary material containing sulfur as a component of a statuary filling composition, in particular, an industrial statuary material, and to a method of manufacturing the same. In the case where the statuary material according to this invention is used, because it contains no sulfur, unlike conventional statuary material, environmental contamination and the generation of offensive odors due to sulfur are avoided, and furthermore, the use of material having a specific gravity lower than that of sulfur facilitates modeling.
摘要:
A thin film transistor array panel is provided, which includes: a gate line, a gate insulating layer, and a semiconductor layer sequentially formed on a substrate; a data line and a drain electrode formed at least on the semiconductor layer; a first passivation layer formed on the data line and the drain electrode and having a first contact hole exposing the drain electrode at least in part; a second passivation layer formed on the first passivation layer and having a second contact hole that is disposed on the first contact hole and has a first bottom edge, placed outside the first contact hole and a second bottom edge placed inside the first contact hole; and a pixel electrode formed on the second passivation layer and connected to the drain electrode through the first and the second contact holes.
摘要:
A method of fabricating a semiconductor device having a metal gate pattern is provided in which capping layers are used to control the relative oxidation rates of portions of the metal gate pattern during a oxidation process. The capping layer may be a multilayer structure and may be etched to form insulating spacers on the sidewalls of the metal gate pattern. The capping layer(s) allow the use of a selective oxidation process, which may be a wet oxidation process utilizing partial pressures of both H2O and H2 in an H2-rich atmosphere, to oxidize portions of the substrate and metal gate pattern while suppressing the oxidation of metal layers that may be included in the metal gate pattern. This allows etch damage to the silicon substrate and edges of the metal gate pattern to be reduced while substantially maintaining the original thickness of the gate insulating layer and the conductivity of the metal layer(s).
摘要翻译:提供一种制造具有金属栅极图案的半导体器件的方法,其中使用覆盖层来控制氧化过程中金属栅极图案的部分的相对氧化率。 覆盖层可以是多层结构,并且可以被蚀刻以在金属栅极图案的侧壁上形成绝缘间隔物。 封盖层允许使用选择性氧化工艺,其可以是使用H 2 H 2 O和H 2 H 2的分压的H氧化方法 2极化气氛,以便在抑制可能包含在金属栅极图案中的金属层的氧化的同时氧化基板和金属栅极图案的部分。 这允许对硅衬底的蚀刻损伤和金属栅极图案的边缘减小,同时基本上保持栅极绝缘层的原始厚度和金属层的导电性。
摘要:
A method of fabricating a semiconductor device having a metal gate pattern is provided in which capping layers are used to control the relative oxidation rates of portions of the metal gate pattern during a oxidation process. The capping layer may be a multilayer structure and may be etched to form insulating spacers on the sidewalls of the metal gate pattern. The capping layer(s) allow the use of a selective oxidation process, which may be a wet oxidation process utilizing partial pressures of both H2O and H2 in an H2-rich atmosphere, to oxidize portions of the substrate and metal gate pattern while suppressing the oxidation of metal layers that may be included in the metal gate pattern. This allows etch damage to the silicon substrate and edges of the metal gate pattern to be reduced while substantially maintaining the original thickness of the gate insulating layer and the conductivity of the metal layer(s).
摘要翻译:提供一种制造具有金属栅极图案的半导体器件的方法,其中使用覆盖层来控制氧化过程中金属栅极图案的部分的相对氧化率。 覆盖层可以是多层结构,并且可以被蚀刻以在金属栅极图案的侧壁上形成绝缘间隔物。 封盖层允许使用选择性氧化工艺,其可以是使用H 2 H 2 O和H 2 H 2的分压的H氧化方法 2极化气氛,以便在抑制可能包含在金属栅极图案中的金属层的氧化的同时氧化基板和金属栅极图案的部分。 这允许对硅衬底的蚀刻损伤和金属栅极图案的边缘减小,同时基本上保持栅极绝缘层的原始厚度和金属层的导电性。
摘要:
Disclosed is a thin film transistor array panel. The panel includes a plurality of pixels arranged in the form of a matrix each with a pixel electrode and a switching element connected to the pixel electrode, and a plurality of gate lines connected to the switching elements and extending in the row direction. A pair of the gate lines are connected to pixels in each pixel row. A plurality of data lines are connected to the switching elements, and elongated in the column direction. Each data line is provided between two columns of the pixels. The respective data lines are horizontally bent between the two adjacent gate lines, and vertically extend between the two pixel rows.
摘要:
A thin film array panel is provided, which includes: a plurality of signal lines including contact parts for contact with an external device; a plurality of thin film transistors connected to the signal lines; an insulating layer formed on the signal lines and the thin film transistors; and a plurality of pixel electrodes formed on the insulating layer and connected to the thin film transistors, wherein the insulating layer includes a contact portion disposed on the contact parts of the signal lines and having a thickness smaller than other portions and the contact portion of the insulating layer includes an inclined portion having an inclination angle smaller than about 45 degrees.
摘要:
Integrated circuit gates are fabricated by forming an insulated gate on an integrated circuit substrate, wherein the insulated gate includes a gate oxide on the integrated circuit substrate, a polysilicon pattern including polysilicon sidewalls, on the gate oxide, and a metal pattern on the polysilicon pattern. The insulated gate is pretreated with hydrogen and nitrogen gasses. The polysilicon sidewalls are then oxidized. The pretreating in hydrogen and nitrogen gasses prior to oxidizing can reduce growth in thickness of the gate oxide during the oxidizing and/or can reduce formation of whiskers on the metal pattern, compared to absence of the pretreatment.
摘要:
A gate drive circuit includes plural stages connected together one after each other. Each of the plural stages includes a circuit transistor, a capacitor part, a first connection part and a second connection part. The circuit transistor outputs the gate signal through a source electrode in response to a control signal applied through a gate electrode. The capacitor part includes a first electrode, a second electrode formed on the first electrode, and a third electrode formed on the second electrode. The first connection part electrically connects the gate electrode of the circuit transistor and the second electrode of the capacitor part. The second connection part electrically connects the source electrode of the circuit transistor and the first electrode of the capacitor part. Thus, an integrated size of a gate drive circuit may be decreased, and a reliability of a gate drive circuit may be enhanced.