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    Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies
    71.
    发明授权
    Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies 有权

    公开(公告)号：US10945333B1

    公开(公告)日：2021-03-09

    申请号：US16692534

    申请日：2019-11-22

    Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

    Inventor： Shailesh N. Joshi ,  Shohei Suenaga ,  Yanghe Liu

    IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H01L23/473

    Abstract: Thermal management assemblies for cooling an electronic assembly disposed on a PCB are disclosed. The thermal management assembly includes a heatsink, a heatsink manifold formed through the heatsink and a thermal compensation base layer coupled to the heatsink. The heatsink manifold has a fluid inlet and a fluid outlet. The thermal compensation base layer thermally connects the heatsink and the electronic assembly. The thermal management assembly further includes a cooling manifold disposed through the PCB to form a fluid flow path. Two or more electrically insulated posts are disposed between the heatsink manifold and the cooling manifold. Individual electrically insulated posts have a vertical cooling channel. At least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path. At least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.

    ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIES INCORPORATING THE SAME
    73.
    发明申请
    ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIES INCORPORATING THE SAME 审中-公开

    公开(公告)号：US20200286849A1

    公开(公告)日：2020-09-10

    申请号：US16880126

    申请日：2020-05-21

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Naoya Take

    IPC: H01L23/00 ,  H01L23/22 ,  H01L23/427

    Abstract: Encapsulated stress mitigation layers and assemblies having the same are disclosed. An assembly that includes a first substrate, a second substrate, an encapsulating layer disposed between the first and second substrates, and a stress mitigation layer disposed in the encapsulating layer such that the stress mitigation layer is encapsulated within the encapsulating layer. The stress mitigation layer has a lower melting temperature relative to a higher melting temperature of the encapsulating layer. The assembly includes an intermetallic compound layer disposed between the first substrate and the encapsulating layer such that the encapsulating layer is separated from the first substrate by the intermetallic compound layer. The stress mitigation layer melts into a liquid when the assembly operates at a temperature above the low melting temperature of the stress mitigation layer and the encapsulating layer maintains the liquid of the stress mitigation layer within the assembly.

    METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE OPAL STRUCTURES AND ENCAPSULATED-POLYMER SPHERES
    76.
    发明申请
    METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE OPAL STRUCTURES AND ENCAPSULATED-POLYMER SPHERES 审中-公开

    公开(公告)号：US20200235032A1

    公开(公告)日：2020-07-23

    申请号：US16250743

    申请日：2019-01-17

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi

    IPC: H01L23/373 ,  C23C28/02 ,  H01L23/488

    Abstract: A method of forming a bonding assembly that includes positioning a plurality of polymer spheres against an opal structure and placing a substrate against a second major surface of the opal structure. The opal structure includes the first major surface and the second major surface with a plurality of voids defined therebetween. The plurality of polymer spheres encapsulates a solder material disposed therein and contacts the first major surface of the opal structure. The method includes depositing a material within the voids of the opal structure and removing the opal structure to form an inverse opal structure between the first and second major surfaces. The method further includes removing the plurality of polymer spheres to expose the solder material encapsulated therein and placing a semiconductor device onto the inverse opal structure in contact with the solder material.

    SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE CABIN OF AUTONOMOUS VEHICLES
    79.
    发明申请
    SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE CABIN OF AUTONOMOUS VEHICLES 审中-公开

    公开(公告)号：US20200148029A1

    公开(公告)日：2020-05-14

    申请号：US16728503

    申请日：2019-12-27

    Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

    Inventor： Feng Zhou ,  Tianzhu Fan ,  Shailesh N. Joshi ,  Ercan Mehmet Dede

    IPC: B60H1/00

    Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

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