公开(公告)号：US20120199311A1

公开(公告)日：2012-08-09

申请号：US13447421

申请日：2012-04-16

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

IPC分类号： F28F27/00

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供一种用于便利液体冷却电子机架的维修的装置。 该设备包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US20120111035A1

公开(公告)日：2012-05-10

申请号：US12939546

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B41/00 ,  F25D31/00 ,  F25D17/06 ,  F25B1/00 ,  F25B43/00

CPC分类号： F25B49/02 ,  F25B25/005 ,  F25B2400/01 ,  F25B2400/06 ,  F25B2500/28 ,  F25B2600/13 ,  F25B2700/21171 ,  H05K7/20809 ,  H05K7/20836 ,  Y02B30/745

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器 冷却剂冷却剂冷却结构。 该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。 可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

公开(公告)号：US20120111027A1

公开(公告)日：2012-05-10

申请号：US12939574

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/04 ,  F25D31/00

CPC分类号： F25B21/02 ,  F25B40/00 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括制冷剂回路，耦合到制冷剂回路的压缩机以及与制冷剂回路热连通地设置的可控热电阵列。 流过制冷剂回路的制冷剂有助于从电子部件散发热量，并且热电阵列设置有位于压缩机上游的制冷剂回路的第一部分与阵列的第一侧热接触，第二部分 位于压缩机下游的制冷剂回路的一部分与阵列的第二侧热接触。 热电阵列确保进入压缩机的制冷剂回路中的制冷剂通过将通过第二部分的制冷剂的热量传递通过制冷剂回路的第一部分的制冷剂而处于过热的热力学状态。

公开(公告)号：US20110315343A1

公开(公告)日：2011-12-29

申请号：US12825776

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F13/00

CPC分类号： F28D15/0233 ,  F28D2021/0028 ,  F28F2215/10 ,  H01L23/427 ,  H01L2224/73204 ,  H05K7/20781

摘要： Cooling apparatuses and methods are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatuses include a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple fluid-boiling fins of a heat spreader coupled to one or more of the electronic components immersed within the dielectric fluid. The interleaved fins facilitate localized cooling and condensing of dielectric fluid vapor within the sealed compartment.

摘要翻译： 提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。 冷却装置包括至少部分地围绕电子子系统围绕并形成密封隔室的壳体，以及设置在密封室内的电介质流体，电子子系统浸入介电流体内。 提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。 冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。 在密封隔室内，多个导热冷凝器翅片与耦合到浸入介电流体中的一个或多个电子部件的散热器的多个流体沸腾翅片交错。 交错的翅片促进密封隔室内的介质流体蒸汽的局部冷却和冷凝。

公开(公告)号：US20110292601A1

公开(公告)日：2011-12-01

申请号：US12787839

申请日：2010-05-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F25D15/00

CPC分类号： H05K7/20736 ,  F24F3/14 ,  F24F2013/221 ,  H05K5/0213

摘要： Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in fluid communication with a coolant loop for passing chilled coolant through the heat exchanger, and the dehumidifying heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the dehumidifying of ingressing air, and a condensate delivery mechanism delivers the condensate to the re-humidifying structure to humidify air egressing from the electronics rack.

摘要翻译： 为电子机架提供除湿和再加湿冷却装置和方法。 该装置包括设置在机架的空气入口侧的除湿空气 - 液体热交换器和设置在机架的出气侧的再加湿结构。 除湿空气 - 液体热交换器与用于使冷却的冷却剂通过热交换器的冷却剂回路流体连通，并且除湿热交换器将进入的空气除湿到电子机架，以减少流过机架的空气的露点。 设置在空气入口侧的冷凝水收集器从进气的除湿收集液体冷凝物，并且冷凝物输送机构将冷凝物输送到再加湿结构，以加湿从电子机架排出的空气。

公开(公告)号：US20110075373A1

公开(公告)日：2011-03-31

申请号：US12567954

申请日：2009-09-28

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/202 ,  H05K7/20609

摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

摘要翻译： 提供了系统和方法来冷却电子机架。 模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。 来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。 该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。 控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。 在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。

公开(公告)号：US20110069452A1

公开(公告)日：2011-03-24

申请号：US12565189

申请日：2009-09-23

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  B23P11/00

CPC分类号： H05K7/2079 ,  H05K7/20745 ,  Y10T29/49826

摘要： Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

摘要翻译： 提供了用于促进通过电子机架的空气冷却的装置和方法。 该装置包括铰链地安装在机架上方和外部的热交换组件，使得从空气出口侧到其空气入口侧的齿条上方的空气通过热交换组件，并被冷却。 热交换组件包括支撑结构以支撑组件在机架上方的铰接安装，以及耦合到支撑结构的空气 - 液体热交换器。 热交换器具有入口压力室和与相应的连接联接器流体连通的出口增压室，分别促进增压室连接到冷却剂供应和回流管线。 热交换器还包括热交换管部分，每个热交换管部分具有冷却剂通道，分别具有入口和出口，该入口和出口分别连接到入口和出口增压室。

公开(公告)号：US20100328889A1

公开(公告)日：2010-12-30

申请号：US12491281

申请日：2009-06-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28F13/00 ,  B23P17/04

CPC分类号： H05K7/20809 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K7/203 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2224/0401

摘要： Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.

摘要翻译： 冷却的电子模块和制造方法设置有电子装置的泵增强的介电流体浸没冷却。 冷却的电子模块包括支撑要冷却的电子设备的基板。 冷却装置耦合到基板，并且包括构造成至少部分围绕电子装置围绕并形成密封隔室的壳体。 此外，冷却装置包括介电流体和设置在密封室内的一个或多个泵。 电介质流体与电子设备直接接触，泵是一种冲击冷却浸入式泵，其设置成主动地将密封隔室内的介电流体泵向电子设备。 多个冷凝器翅片从壳体延伸到密封隔室的上部的密封隔室中，并且液冷冷板或风冷散热器联接到壳体的顶部以冷却冷凝器翅片。

公开(公告)号：US20100328882A1

公开(公告)日：2010-12-30

申请号：US12491289

申请日：2009-06-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/00 ,  F24F11/00

CPC分类号： H01L23/427 ,  H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device.

摘要翻译： 提供冷却装置和方法，以便于利用冷却子组件，泵和控制器来冷却电子设备。 冷却子组件包括喷射冲击结构和热虹吸管。 当喷射冲击模式时，喷射冲击结构将冷却剂引导到子组件的室中，以在待喷射的冲击模式下被冷却的表面上，并且与室相关联的热虹吸通过冷却液的沸腾有助于对待冷却表面的对流冷却 该室在热虹吸模式下。 耦合到泵以控制泵的激活和停用的控制器还基于感测到的电子设备的温度来控制喷射冲击模式和热虹吸模式之间的转换。

公开(公告)号：US20100313590A1

公开(公告)日：2010-12-16

申请号：US12481824

申请日：2009-06-10

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. Simons

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. Simons

IPC分类号： F25D23/00 ,  F28F9/007 ,  F28D15/00 ,  B23P15/26

CPC分类号： H05K7/20809 ,  H05K7/20781 ,  Y10T29/49359

摘要： Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.

摘要翻译： 提供液冷电子机架和制造方法，其中基于液体的冷却装置便于当对接在电子机架内时电子子系统的冷却。 冷却装置包括安装在机架前部的液冷式冷却结构和多个传热元件。 冷却结构是导热材料，其具有用于促进冷却剂流过结构的冷却剂输送通道。 每个传热元件连接到相应电子子系统的一个或多个发热部件，当该电子子系统对接在机架内时，物理地接触冷却结构，并且提供从电子子系统的发热部件的热传输路径 到液冷的冷却结构。 有利地，电子子系统可以对准在电子机架内或从电子机架排出，而不会影响冷却剂通过液冷式冷却结构的流动。