公开(公告)号：US08506278B2

公开(公告)日：2013-08-13

申请号：US12308949

申请日：2007-08-08

申请人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

发明人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

IPC分类号： A23G1/22 ,  A01J21/00 ,  A23P1/00 ,  B29C45/14 ,  B29C35/08 ,  B29B7/00

CPC分类号： B29C70/48 ,  B29C35/0805 ,  B29C70/548 ,  B29C2035/0827

摘要： A resin transfer molding (RTM) molding device is designed to mold a fiber-reinforced plastic (FRP) molded body by injecting a resin composition into a mold and by impregnating the molded body therewith. The resin composition is a chain curing polymer (CCP). A CCP accommodating layer is disposed adjacent to an outer side of the molded body. The layer contains the CCP. The layer is provided with a Vf limit value, the value defined by the curing characteristics of the CCP and the characteristics of dissipation of heat from the CCP to the exterior. An element for separating the molded body is disposed between the body and the layer.

摘要翻译： 树脂传递模塑（RTM）成型装置被设计成通过将树脂组合物注射到模具中并通过浸渍成型体来模制纤维增强塑料（FRP）成型体。 树脂组合物是链固化聚合物（CCP）。 CCP容纳层邻近成型体的外侧设置。 该层包含CCP。 该层具有Vf极限值，由CCP的固化特性定义的值和从CCP到外部的热耗散特性。 用于分离模制体的元件设置在主体和层之间。

公开(公告)号：US08104750B2

公开(公告)日：2012-01-31

申请号：US12289079

申请日：2008-10-20

申请人： Koichi Hasegawa ,  Hironori Koyama ,  Satoshi Umemura

发明人： Koichi Hasegawa ,  Hironori Koyama ,  Satoshi Umemura

IPC分类号： F16F9/10

CPC分类号： F16F13/262

摘要： A fluid filled vibration damping device including: a fluid passage interconnecting a pressure receiving chamber partially defined by a rubber elastic body connecting a first and second mounting members, and an equilibrium chamber partially defined by a flexible film; a movable valve body provided for switching the fluid passage between a communicating state and a blocked state through reciprocating operation; an electric motor employed for actuating the movable valve body; an actuating force converter mechanism provided on an actuating force transmission path from the electric motor to the movable valve body. A rotational actuating force of the electric motor is transmitted as reciprocating actuating force to the movable valve body by the actuating force converter mechanism.

摘要翻译： 一种流体填充的减震装置，包括：将由连接第一和第二安装构件的橡胶弹性体部分限定的受压室和由柔性膜部分限定的平衡室相互连接的流体通道; 可动阀体，其设置用于通过往复运动在通气状态和阻塞状态之间切换流体通道; 用于致动可动阀体的电动马达; 驱动力转换机构，其设置在从电动机到可动阀体的致动力传递路径上。 电动机的旋转驱动力通过致动力转换器机构作为往复致动力传递到可动阀体。

公开(公告)号：US08083032B2

公开(公告)日：2011-12-27

申请号：US11918332

申请日：2005-09-27

申请人： Koichi Hasegawa

发明人： Koichi Hasegawa

IPC分类号： H02K7/18

CPC分类号： H02K7/1853 ,  F03G1/08 ,  F03G5/06

摘要： There is provided a power source device capable of obtaining power not only when springs or the like return but also when a handle for winding up the springs or the like are operated. The power source device comprises a main shaft connected to both the handle and a main power generation device, an auxiliary shaft connected to an auxiliary power generation device arranged side by side in parallel with the main shaft, the main spring and the auxiliary spring requiring less load to wind up than the main spring being installed between the main shaft and the auxiliary shaft via drums such that accumulation and release of elastic force of the springs are alternated on both shafts, wherein when the main shaft is normally rotated by the handle, elastic force accumulated in the auxiliary spring is applied in the direction of rotation of the main shaft as releasing force.

摘要翻译： 提供了一种能够在弹簧等返回时能够获得电力的动力源装置，而且当用于卷起弹簧等的手柄被操作时。 电源装置包括连接到手柄和主发电装置的主轴，与主轴平行布置的辅助发电装置连接的辅助轴，主弹簧和辅助弹簧要求较少 通过滚筒将主弹簧与主轴和辅助轴之间的主弹簧负载起来，使得弹簧的弹性的累积和释放在两个轴上交替，其中当主轴通过手柄正常旋转时，弹性 累积在辅助弹簧中的力作为释放力沿主轴的旋转方向施加。

公开(公告)号：US20110307214A1

公开(公告)日：2011-12-15

申请号：US13141859

申请日：2010-09-16

申请人： Yuuki Saitou ,  Masaru Murayama ,  Tomonori Hayakawa ,  Koichi Hasegawa ,  Tetsuyoshi Shibata

发明人： Yuuki Saitou ,  Masaru Murayama ,  Tomonori Hayakawa ,  Koichi Hasegawa ,  Tetsuyoshi Shibata

IPC分类号： G06F15/00 ,  G01B7/16

CPC分类号： G01L1/205 ,  G01B1/00 ,  G01B7/16 ,  G01B7/18 ,  G01M5/0041 ,  G01M5/0083 ,  H01C10/106 ,  H01C17/0652 ,  H01C17/06586

摘要： Provided are a bending sensor that is less dependent on an input speed of a strain and in which a response delay is unlikely to occur, and a deformed shape measurement method using the bending sensor. The bending sensor is configured to include a base material; a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles filled in the matrix resin at a filling rate of 30% by volume or more, and in which three-dimensional conductive paths are formed by contact among the conductive filler particles, and electrical resistance increases as an deformation amount increases; an elastically deformable cover film arranged so as to cover the sensor body; and a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances. In the sensor body, cracks are formed in advance in such a direction that the conductive paths are cut off during a bending deformation.

摘要翻译： 提供一种弯曲传感器，其不太依赖于应变的输入速度，并且其中不可能发生响应延迟，并且使用弯曲传感器的变形形状测量方法。 弯曲传感器构造成包括基材; 传感器体，其设置在所述基材的表面上，并且以30体积％以上的填充速度包含基质树脂和填充在所述基体树脂中的导电性填充剂颗粒，并且其中通过接触形成三维导电路径 导电填料颗粒和电阻随着变形量的增加而增加; 布置成覆盖传感器主体的可弹性变形的覆盖膜; 以及连接到传感器主体并能够输出电阻的多个电极。 在传感器体中，在弯曲变形时，导电路径被切断的方向预先形成裂纹。

公开(公告)号：US20110238952A1

公开(公告)日：2011-09-29

申请号：US13024580

申请日：2011-02-10

申请人： Hitoshi Kai ,  Hiroaki Sakaguchi ,  Hiroshi Kobayashi ,  Katsuhiko Metsugi ,  Haruhisa Yamamoto ,  Yousuke Morita ,  Koichi Hasegawa ,  Taichi Hirao

发明人： Hitoshi Kai ,  Hiroaki Sakaguchi ,  Hiroshi Kobayashi ,  Katsuhiko Metsugi ,  Haruhisa Yamamoto ,  Yousuke Morita ,  Koichi Hasegawa ,  Taichi Hirao

IPC分类号： G06F9/38

CPC分类号： G06F9/321 ,  G06F9/30101 ,  G06F9/30156 ,  G06F9/30167 ,  G06F9/30178 ,  G06F9/3804 ,  G06F9/3842

摘要： An instruction fetch apparatus is disclosed which includes: a program counter configured to manage the address of an instruction targeted to be executed in a program in which instructions belonging to a plurality of instruction sequences are placed sequentially; a change designation register configured to designate a change of an increment value on the program counter; an increment value register configured to hold the changed increment value; and an addition control section configured such that if the change designation register designates the change of the increment value on the program counter, then the addition control section increments the program counter based on the changed increment value held in the increment value register, the addition control section further incrementing the program counter by an instruction word length if the change designation register does not designate any change of the increment value on the program counter.

摘要翻译： 一种提取指令装置，其特征在于包括：程序计数器，被配置为在其中顺序放置属于多个指令序列的指令的程序中管理目标要执行的指令的地址; 变更指定寄存器，被配置为指定所述程序计数器上的增量值的变化; 增量值寄存器，被配置为保持所述改变的增量值; 以及附加控制部分，其被配置为使得如果所述改变指定寄存器指定所述程序计数器上的所述增量值的改变，则所述相加控制部分基于所述增量值寄存器中保持的改变的增量值来增加所述程序计数器，所述加法控制 如果改变指定寄存器没有指定程序计数器上的增量值的任何改变，则进一步将程序计数器递增指令字长度。

公开(公告)号：US07949696B2

公开(公告)日：2011-05-24

申请号：US11280244

申请日：2005-11-17

申请人： Masaaki Ishii ,  Koichi Hasegawa ,  Hiroaki Sakaguchi

发明人： Masaaki Ishii ,  Koichi Hasegawa ,  Hiroaki Sakaguchi

IPC分类号： G06F7/00 ,  G06F7/38 ,  G06F9/30

CPC分类号： G06F9/30029 ,  G06F7/483 ,  G06F9/30014 ,  G06F9/30025 ,  G06F9/30167 ,  G06F2207/3816 ,  G06F2207/3824

摘要： Disclosed herein is a floating-point number arithmetic circuit for efficiently supplying data to be performed arithmetic operation. The floating-point number arithmetic circuit includes an floating-point number arithmetic unit for performing a predetermined floating-point number arithmetic operation on a floating-point number of a predetermined precision, and a converting circuit for converting data into the floating-point number of predetermined precision and supplying the floating-point number of the predetermined precision to at least either one of input terminals of the floating-point number arithmetic unit.

摘要翻译： 这里公开了一种用于有效地提供要进行的算术运算的数据的浮点数运算电路。 浮点数算术电路包括用于对预定精度的浮点数执行预定的浮点数算术运算的浮点数运算单元和用于将数据转换为浮点数运算的浮点数运算单元 预定精度，并将预定精度的浮点数提供给浮点数运算单元的输入端中的至少一个。

公开(公告)号：US07785525B2

公开(公告)日：2010-08-31

申请号：US11989133

申请日：2006-07-27

申请人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

发明人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

IPC分类号： B29B13/08 ,  B27N3/12 ,  B29C45/02

CPC分类号： B29C70/48 ,  B29C35/0272 ,  B29C2035/0827 ,  B29K2077/10 ,  B29K2707/04 ,  B29K2709/08

摘要： Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.

摘要翻译： 提供了一种能够产生FRP成型体的RTM成型方法，该FRP成型体形成为增加纤维体积含量，从而使其强度和轻量化更加优异。 树脂组合物是链固化树脂组合物，在树脂组合物固化开始之后，在固化开始后10秒内，经历链固化的树脂组合物的固化头的最高温度增加 比浸渍后和固化前的树脂组合物的温度高50℃以上，因此树脂组合物的Vf为41％以上链状固化。

公开(公告)号：US07622804B2

公开(公告)日：2009-11-24

申请号：US11860560

申请日：2007-09-25

申请人： Koichi Hasegawa

发明人： Koichi Hasegawa

IPC分类号： H01L23/043

CPC分类号： H01L23/3135 ,  H01L23/3142 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric constant, and a package molding resin (sealing resin) provided so as to cover the semiconductor chip and the film. As a result, deterioration in contact property with the sealing resin is suppressed and a high frequency characteristic can be enhanced.

摘要翻译： 提供了一种半导体器件，其包括半导体芯片，膜（第一膜），其被设置为覆盖半导体芯片的周边部分未被覆盖的有源区域，并且由具有低介电常数的介电材料制成， 以及设置成覆盖半导体芯片和膜的封装模制树脂（密封树脂）。 结果，抑制了与密封树脂的接触性能的劣化，并且可以提高高频特性。

公开(公告)号：US20090256309A1

公开(公告)日：2009-10-15

申请号：US12385283

申请日：2009-04-03

申请人： Koichi Hasegawa

发明人： Koichi Hasegawa

IPC分类号： B65H5/02 ,  G01D5/34 ,  G05B1/08 ,  B21D53/26

CPC分类号： G01D5/3473 ,  B65H2553/51 ,  G01D5/34707 ,  Y10T29/49481

摘要： A manufacturing method for a code wheel for a rotary encoder is provided. The code wheel includes, in a central portion, a hole into which a rotary shaft of a rotary member is fitted and a code portion including a radial code pattern in a circumferential edge portion. The manufacturing method is configured to include the steps of forming the code portion and a reference circle in a plate so that the reference circle has a radius larger than a radius of the hole by a tolerance of deviation between a center position of the code portion and a center position of the hole and has a same center as that of the code portion; and forming the hole in the plate in which the code portion and the reference circle are formed, so as to be contained in the reference circle.

摘要翻译： 提供了一种用于旋转编码器的编码轮的制造方法。 码盘在中心部分包​​括旋转构件的旋转轴被装配到的孔和在周缘部分中包括径向码图案的代码部分。 该制造方法被配置为包括以下步骤：在板中形成代码部分和参考圆，使得参考圆的半径大于孔的半径，通过代码部分的中心位置和 孔的中心位置，并且具有与代码部分相同的中心; 并且在形成有代码部分和参考圆的板中形成孔，以便包含在参考圆中。

公开(公告)号：US20090051067A1

公开(公告)日：2009-02-26

申请号：US11989133

申请日：2006-07-27

申请人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

发明人： Noriya Hayashi ,  Hiroshi Mizuno ,  Koichi Hasegawa ,  Kazuo Ota

IPC分类号： B29C39/42

CPC分类号： B29C70/48 ,  B29C35/0272 ,  B29C2035/0827 ,  B29K2077/10 ,  B29K2707/04 ,  B29K2709/08

摘要： Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.

摘要翻译： 提供了一种能够产生FRP成型体的RTM成型方法，该FRP成型体形成为增加纤维体积含量，从而使其强度和轻量化更加优异。 树脂组合物是链固化树脂组合物，在树脂组合物固化开始之后，在固化开始后10秒内，经历链固化的树脂组合物的固化头的最高温度增加 比浸渍后和固化前的树脂组合物的温度高50℃以上，因此树脂组合物的Vf为41％以上链状固化。