Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip
    77.
    发明授权
    Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip 有权
    半导体激光器模块,带有用于调节半导体激光芯片温度的珀耳帖模块

    公开(公告)号:US06697399B2

    公开(公告)日:2004-02-24

    申请号:US09864249

    申请日:2001-05-25

    IPC分类号: H01L2306

    摘要: A bottom plate (4a) of a box-shaped package (4) is made of a metal. Portions of the package (4) (peripheral wall (4b) and cover plate (4c)) other than the bottom plate (4a) are made of a resin or a ceramic that is more economical than the metal. The material cost of the package (4) can thus be reduced in comparison with the case where the package (4) is made of the metal as a whole. A Peltier module (5) is fixed to the bottom plate (4a). A base (6) is fixed over the Peltier module (5), and a semiconductor laser chip (2) is disposed on this base (6). Heat from the semiconductor laser chip (2) and from the Peltier module (5) can be efficiently radiated through the bottom plate (4a) made of the metal, and deterioration of heat radiation performance can be prevented.

    摘要翻译: 盒形包装(4)的底板(4a)由金属制成。 除了底板(4a)之外的包装件(4)(周壁(4b)和盖板(4c))的部分由比金属更经济的树脂或陶瓷制成。 与包装(4)整体由金属制成的情况相比,可以减小包装(4)的材料成本。 帕尔贴模块(5)固定在底板(4a)上。 基座(6)固定在珀耳帖模块(5)上,半导体激光芯片(2)设置在该基座(6)上。 来自半导体激光芯片(2)和珀尔贴模块(5)的热量可以有效地通过由金属制成的底板(4a)辐射,并且可以防止散热性能的劣化。

    Lensed optical fiber
    79.
    发明授权

    公开(公告)号:US06317550B2

    公开(公告)日:2001-11-13

    申请号:US09769689

    申请日:2001-01-25

    IPC分类号: G02B602

    CPC分类号: G02B6/4203

    摘要: There is provided a lensed optical fiber (20) in which a lens is formed on the end face of an optical fiber to enhance the efficiency of optical coupling with a light beam. The tip end portion of an optical fiber (21) is formed with a lens (26) formed into a wedge shape having two slant portions (24) symmetrical with respect to an axis (Ac) of a core (22) and a plane portion (25) perpendicular to the axis of the core.

    Semiconductor laser module
    80.
    发明授权
    Semiconductor laser module 失效
    半导体激光模块

    公开(公告)号:US5745625A

    公开(公告)日:1998-04-28

    申请号:US707957

    申请日:1996-09-10

    IPC分类号: G02B6/26 G02B6/42 G02B6/36

    CPC分类号: G02B6/262 G02B6/4204

    摘要: A semiconductor laser module comprising a lens system having first and second lenses for coupling a beam emitted from a semiconductor laser with a core expanded fiber having a single-mode fiber end whose core diameter is expanded. The core expanded fiber is set so as to have a core expansion coefficient of 1.3 or more and an absolute value of change rate of mode field diameter smaller than 6.0.times.10.sup.-4 .mu.m.sup.-1.

    摘要翻译: 一种半导体激光器模块,包括具有第一和第二透镜的透镜系统,用于将从半导体激光器发射的光束与具有纤芯直径扩大的单模光纤端的芯扩展光纤耦合。 芯扩展纤维的芯膨胀系数为1.3以上,模场直径的变化率的绝对值小于6.0×10 -4 m -1。