公开(公告)号：US07219713B2

公开(公告)日：2007-05-22

申请号：US11037913

申请日：2005-01-18

Applicant: Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

Inventor： Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

IPC: F28F7/00

CPC classification number: H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

Abstract translation: 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。

公开(公告)号：US20060269047A1

公开(公告)日：2006-11-30

申请号：US11497252

申请日：2006-08-02

Applicant: Hendrik Hamann ,  Yves Martin ,  Theodore van Kessel ,  Hemantha Wickramasinghe

Inventor： Hendrik Hamann ,  Yves Martin ,  Theodore van Kessel ,  Hemantha Wickramasinghe

IPC: H05G2/00 ,  G21G4/00 ,  H01J35/00

CPC classification number: H01J35/08 ,  G21K7/00 ,  H01J2235/083 ,  H01J2235/086

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

公开(公告)号：US20060158849A1

公开(公告)日：2006-07-20

申请号：US11037441

申请日：2005-01-18

Applicant: Yves Martin ,  Theodore Van Kessel

Inventor： Yves Martin ,  Theodore Van Kessel

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract translation: 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。

公开(公告)号：US20060157223A1

公开(公告)日：2006-07-20

申请号：US11037913

申请日：2005-01-18

Applicant: Jeffrey Gelorme ,  Supratik Guha ,  Nancy LaBianca ,  Yves Martin ,  Theodore Van Kessel

Inventor： Jeffrey Gelorme ,  Supratik Guha ,  Nancy LaBianca ,  Yves Martin ,  Theodore Van Kessel

IPC: H05K7/20

CPC classification number: H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

Abstract translation: 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。

公开(公告)号：US20060147820A1

公开(公告)日：2006-07-06

申请号：US11028799

申请日：2005-01-04

Applicant: Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

IPC: G03F9/00 ,  B29C59/02 ,  B29C35/08

CPC classification number: G03F9/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7049 ,  G03F9/7065 ,  G03F9/7088 ,  G03F9/7092

Abstract: An apparatus (and method) for forming a pattern on a workpiece, includes an optical phase contrast image sensor, and an imprint lithography system coupled to the optical phase contrast image sensor for laterally aligning an imprint template feature relative to the workpiece.

Abstract translation: 用于在工件上形成图案的装置（和方法）包括光学相差图像传感器和耦合到光学相差图像传感器的压印光刻系统，用于相对于工件横向对准压印模板特征。

公开(公告)号：US20060105571A1

公开(公告)日：2006-05-18

申请号：US10989078

申请日：2004-11-16

Applicant: Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

IPC: B29C59/02 ,  B29C33/58 ,  B29C71/04 ,  H01L21/302 ,  H01L21/461

CPC classification number: B29C43/021 ,  B29C43/003 ,  B29C43/3642 ,  B29C2043/025 ,  B29C2043/3647 ,  B29C2043/3649 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0273

Abstract: A method (and apparatus) for nano lithography, includes applying a pneumatic pressure to at least one of a surface of a semi-rigid mask or template and a portion of a surface of a resist-coated workpiece, and, by the applying of the pneumatic pressure, transferring a pattern from the mask to the workpiece.

Abstract translation: 一种用于纳米光刻的方法（和装置），包括向半刚性掩模或模板的表面和抗蚀剂涂覆的工件的表面的一部分中的至少一个施加气动压力，并且通过施加 气动压力，将图案从面罩转移到工件。

公开(公告)号：US20050061474A1

公开(公告)日：2005-03-24

申请号：US10665798

申请日：2003-09-18

Applicant: Jeffrey Gelorme ,  Hendrik Hamann ,  Nancy LaBianca ,  Yves Martin ,  Theodore van Kessel

Inventor： Jeffrey Gelorme ,  Hendrik Hamann ,  Nancy LaBianca ,  Yves Martin ,  Theodore van Kessel

IPC: H01L23/433 ,  H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a thermal interface for IC chip cooling. One embodiment of the invention comprises a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.

Abstract translation: 本发明是用于IC芯片冷却的热界面。 本发明的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。

公开(公告)号：US06510120B2

公开(公告)日：2003-01-21

申请号：US09773323

申请日：2001-01-31

Applicant: Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

Inventor： Hemantha Kumar Wickramasinghe ,  Hendrik F. Hamann ,  Yves Martin

IPC: G11B700

CPC classification number: G11B9/00 ,  B82Y10/00 ,  G11B9/14 ,  G11B9/1409 ,  G11B9/1418 ,  Y10S977/725 ,  Y10S977/833 ,  Y10S977/932 ,  Y10S977/947

Abstract: The invention discloses a method capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in an assembly enabled by the present method. The method may be preferably used for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

Abstract translation: 本发明公开了一种能够写入/擦除高密度数据的方法，优选地在相变记录介质上。 本发明的一个优选实施例的特征在于一种新的热近场加热器，其可以用于通过本方法实现的组件中。 该方法可以优选用于以基本上热的近场模式进行写入。 本发明提供的写入密度大于衍射受限系统的密度，例如大约大于100Gbit / inch2的写入密度以及大约大于100MHz的写入速度。

公开(公告)号：US5646731A

公开(公告)日：1997-07-08

申请号：US511166

申请日：1995-08-04

Applicant: Hemantha Kumar Wickramasinghe ,  Frederic Zenhausern ,  Yves Martin ,  Martin Patrick O'Boyle

Inventor： Hemantha Kumar Wickramasinghe ,  Frederic Zenhausern ,  Yves Martin ,  Martin Patrick O'Boyle

IPC: G01N37/00 ,  G01Q30/02 ,  G01Q60/18 ,  G01B9/02

CPC classification number: G01Q60/22 ,  B82Y20/00 ,  B82Y35/00

Abstract: A method for detecting and/or imaging a workpiece. In a detection aspect, the method comprises the steps of sampling an electromagnetic wave packet representative of workpiece properties and comprising encoded wave information derivable from a multi-pole interactive coupling between a probe tip and the workpiece; decoding said electromagnetic wave packet by interrogating at least one of its phase and amplitude information; and, using the decoding information as a means for detecting the presence of the workpiece. In an imaging aspect, the method includes incorporating the previous steps in a scanning operation for developing an image representative of the workpiece.

Abstract translation: 一种用于检测和/或成像工件的方法。 在检测方面，该方法包括以下步骤：对代表工件属性的电磁波包进行采样，并且包括可从探针尖端和工件之间的多极交互耦合导出的编码波信息; 通过询问其相位和幅度信息中的至少一个来解码所述电磁波分组; 并且使用解码信息作为检测工件的存在的装置。 在成像方面，该方法包括将前述步骤结合在用于显影代表工件的图像的扫描操作中。

公开(公告)号：US5578745A

公开(公告)日：1996-11-26

申请号：US419295

申请日：1995-04-10

Applicant: Thomas Bayer ,  Johann Greschner ,  Yves Martin ,  Klaus Meissner ,  Helga Weiss

Inventor： Thomas Bayer ,  Johann Greschner ,  Yves Martin ,  Klaus Meissner ,  Helga Weiss

IPC: G01N1/00 ,  G01B1/00 ,  G01B7/34 ,  G01N27/00 ,  G01N37/00 ,  G01Q40/02 ,  H01L21/20

CPC classification number: G01Q40/02 ,  B82Y35/00 ,  Y10S977/86

Abstract: Adjacent shaped grooves are placed in single crystal structure with great accuracy and known dimensions by a combination of anisotropic and isotropic etching to produce a scanning probe microscope calibration standard with fine V-shaped grooves forming a prismatically shaped ridge or blade between them. A probe microscope to be calibrated is used to profile the tip of the ridge in a number of places along the length of the ridge. With knowledge of the sidewall angles and tip radius of the calibration standard both the flat tip dimensions of a probe with a flared tip and the tip radius of a probe with a conical tip can be calculated from the profile they produce.

Abstract translation: 相邻的形状的槽通过各向异性和各向同性蚀刻的组合以高精度和已知的尺寸放置在单晶结构中，以产生具有精细的V形槽的扫描探针显微镜校准标准，在它们之间形成棱镜状的脊或刀片。 要校准的探针显微镜用于沿着脊的长度在多个位置分布脊的尖端。 通过了解校准标准的侧壁角度和尖端半径，可以从其产生的轮廓计算具有喇叭形尖端的探头的平坦末端尺寸和具有锥形尖端的探针的尖端半径。